公开(公告)号：US11008815B2

公开(公告)日：2021-05-18

申请号：US15745719

申请日：2016-07-20

Applicant: SMITH INTERNATIONAL, INC.

Inventor： John Daniel Belnap ,  Yi Fang ,  Michael David France ,  David P. DenBoer ,  Haibo Zhang

IPC: E21B10/573 ,  E21B10/567 ,  C22C26/00 ,  C22C29/08 ,  C04B35/645 ,  C04B37/02 ,  B22F7/06 ,  B22F7/08 ,  B22F5/00 ,  C04B35/528 ,  C04B35/63 ,  E21B10/50 ,  E21B10/55

Abstract: Cutting elements include a diamond-bonded body attached with a substrate. The substrate has a coercivity of greater than about 200 Oe, and has a magnetic saturation of from about 73 to 90. The diamond-bonded body has a compressive stress at the surface of greater than about 0.9 GPa after heat treatment, and greater than about 1.2 GPa prior to heat treatment.

公开(公告)号：US20180043325A1

公开(公告)日：2018-02-15

申请号：US15556645

申请日：2016-03-09

Applicant: Smith International, Inc.

Inventor： David P. DenBoer ,  Clint Hamilton ,  Michael David France ,  Ryan J. Davis ,  Lynn L. Belnap ,  Yi Fang

IPC: B01J3/06

Abstract: Assemblies as disclosed herein for making superhard products by HPHT process comprise a first can portion for accommodating a mixture of materials therein and a second can mated with the first can portion. A leak-tight seal is provided between the first can portion and second can portion in a manner that accommodates the manufacture of relatively longer superhard products without having to change other elements or members used for HPHT processing to thereby provide improved manufacturing flexibility and cost efficiency.

公开(公告)号：US10562000B2

公开(公告)日：2020-02-18

申请号：US15556645

申请日：2016-03-09

Applicant: Smith International, Inc.

Inventor： David P. DenBoer ,  Clint Hamilton ,  Michael David France ,  Ryan J. Davis ,  Lynn L. Belnap ,  Yi Fang

IPC: B29C43/02 ,  B01J3/06 ,  B29C43/00

Abstract: Assemblies as disclosed herein for making superhard products by HPHT process comprise a first can portion for accommodating a mixture of materials therein and a second can mated with the first can portion. A leak-tight seal is provided between the first can portion and second can portion in a manner that accommodates the manufacture of relatively longer superhard products without having to change other elements or members used for HPHT processing to thereby provide improved manufacturing flexibility and cost efficiency.

公开(公告)号：US20180216411A1

公开(公告)日：2018-08-02

申请号：US15745719

申请日：2016-07-20

Applicant: SMITH INTERNATIONAL, INC.

Inventor： John Daniel Belnap ,  Yi Fang ,  Michael David France ,  David P. DenBoer ,  Haibo Zhang

IPC: E21B10/573 ,  E21B10/567 ,  C04B35/528 ,  C04B35/645 ,  C04B35/63 ,  C04B37/02 ,  C22C26/00 ,  C22C29/08 ,  B22F7/08

CPC classification number: E21B10/5735 ,  B22F7/062 ,  B22F7/08 ,  B22F2005/001 ,  B22F2302/10 ,  B22F2302/406 ,  C04B35/528 ,  C04B35/6303 ,  C04B35/645 ,  C04B37/023 ,  C04B37/025 ,  C04B37/026 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/442 ,  C04B2235/96 ,  C04B2237/086 ,  C04B2237/12 ,  C04B2237/363 ,  C04B2237/401 ,  C04B2237/704 ,  C04B2237/72 ,  C22C26/00 ,  C22C29/08 ,  E21B10/50 ,  E21B10/55 ,  E21B10/5673 ,  E21B10/573

Abstract: Cutting elements include a diamond-bonded body attached with a substrate. The substrate has a coercivity of greater than about 200 Oe, and has a magnetic saturation of from about 73 to 90. The diamond-bonded body has a compressive stress at the surface of greater than about 0.9 GPa after heat treatment, and greater than about 1.2 GPa prior to heat treatment.