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公开(公告)号：US20180358213A1
公开(公告)日：2018-12-13
申请号：US16006357
申请日：2018-06-12
IPC分类号： H01J37/34
CPC分类号： H01J37/3467 , H01J37/3405 , H01J37/3414 , H01J37/3444
摘要： An electrical power pulse generator system and a method of the system's operation are described herein. A main energy storage capacitor supplies a negative DC power and a kick energy storage capacitor supplies a positive DC power. A main pulse power transistor is interposed between the main energy storage capacitor and an output pulse rail and includes a main power transmission control input for controlling power transmission from the main energy storage capacitor to the output pulse rail. A positive kick pulse power transistor is interposed between the kick energy storage capacitor and the output pulse rail and includes a kick power transmission control input for controlling power transmission from the kick energy storage capacitor to the output pulse rail. A positive kick pulse power transistor control line is connected to the kick power transmission control input of the positive kick pulse transistor.
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公开(公告)号：US20180199423A1
公开(公告)日：2018-07-12
申请号：US15862354
申请日：2018-01-04
CPC分类号： H05H1/46 , H01L21/67017 , H01L21/67155 , H01L31/18 , H05H2001/4615 , H05H2001/463
摘要： Systems and methods are described herein for generating surface-wave plasmas capable of simultaneously achieving high density with low temperature and planar scalability. A key feature of the invention is reduced damage to objects in contact with the plasma due to the lack of an RF bias; allowing for damage free processing. The preferred embodiment is an all-in-one processing reactor suitable for photovoltaic cell manufacturing, performing saw-damage removal, oxide stripping, deposition, doping and formation of hetero structures. The invention is scalable for atomic-layer deposition, etching, and other surface interaction processes.
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公开(公告)号：US11069515B2
公开(公告)日：2021-07-20
申请号：US16006357
申请日：2018-06-12
摘要： An electrical power pulse generator system and a method of the system's operation are described herein. A main energy storage capacitor supplies a negative DC power and a kick energy storage capacitor supplies a positive DC power. A main pulse power transistor is interposed between the main energy storage capacitor and an output pulse rail and includes a main power transmission control input for controlling power transmission from the main energy storage capacitor to the output pulse rail. A positive kick pulse power transistor is interposed between the kick energy storage capacitor and the output pulse rail and includes a kick power transmission control input for controlling power transmission from the kick energy storage capacitor to the output pulse rail. A positive kick pulse power transistor control line is connected to the kick power transmission control input of the positive kick pulse transistor.
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公开(公告)号：US20140315347A1
公开(公告)日：2014-10-23
申请号：US14217342
申请日：2014-03-17
CPC分类号： H05H1/46 , H01L21/67017 , H01L21/67155 , H01L31/18 , H05H2001/4615 , H05H2001/463
摘要： Systems and methods are described herein for generating surface-wave plasmas capable of simultaneously achieving high density with low temperature and planar scalability. A key feature of the invention is reduced damage to objects in contact with the plasma due to the lack of an RF bias; allowing for damage free processing. The preferred embodiment is an all-in-one processing reactor suitable for photovoltaic cell manufacturing, performing saw-damage removal, oxide stripping, deposition, doping and formation of heterostructures. The invention is scalable for atomic-layer deposition, etching, and other surface interaction processes.
摘要翻译： 本文描述了用于产生能够同时实现具有低温度和平面可伸缩性的高密度的表面波等离子体的系统和方法。 本发明的关键特征是由于缺少RF偏压而减少与等离子体接触的物体的损坏; 允许无损处理。 优选的实施方案是适用于光伏电池制造，执行锯切损伤去除，氧化物剥离，沉积，掺杂和形成异质结构的一体化处理反应器。 本发明可用于原子层沉积，蚀刻和其它表面相互作用过程。
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公开(公告)号：US20210343513A1
公开(公告)日：2021-11-04
申请号：US17375383
申请日：2021-07-14
摘要： An electrical power pulse generator system and a method of the system's operation are described herein. A main energy storage capacitor supplies a negative DC power and a kick energy storage capacitor supplies a positive DC power. A main pulse power transistor is interposed between the main energy storage capacitor and an output pulse rail and includes a main power transmission control input for controlling power transmission from the main energy storage capacitor to the output pulse rail. A positive kick pulse power transistor is interposed between the kick energy storage capacitor and the output pulse rail and includes a kick power transmission control input for controlling power transmission from the kick energy storage capacitor to the output pulse rail. A positive kick pulse power transistor control line is connected to the kick power transmission control input of the positive kick pulse transistor.
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公开(公告)号：US10531553B2
公开(公告)日：2020-01-07
申请号：US15862354
申请日：2018-01-04
摘要： Systems and methods are described herein for generating surface-wave plasmas capable of simultaneously achieving high density with low temperature and planar scalability. A key feature of the invention is reduced damage to objects in contact with the plasma due to the lack of an RF bias; allowing for damage free processing. The preferred embodiment is an all-in-one processing reactor suitable for photovoltaic cell manufacturing, performing saw-damage removal, oxide stripping, deposition, doping and formation of hetero structures. The invention is scalable for atomic-layer deposition, etching, and other surface interaction processes.
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公开(公告)号：US09867269B2
公开(公告)日：2018-01-09
申请号：US14217342
申请日：2014-03-17
CPC分类号： H05H1/46 , H01L21/67017 , H01L21/67155 , H01L31/18 , H05H2001/4615 , H05H2001/463
摘要： Systems and methods are described herein for generating surface-wave plasmas capable of simultaneously achieving high density with low temperature and planar scalability. A key feature of the invention is reduced damage to objects in contact with the plasma due to the lack of an RF bias; allowing for damage free processing. The preferred embodiment is an all-in-one processing reactor suitable for photovoltaic cell manufacturing, performing saw-damage removal, oxide stripping, deposition, doping and formation of heterostructures. The invention is scalable for atomic-layer deposition, etching, and other surface interaction processes.
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