公开(公告)号：US20090098667A1

公开(公告)日：2009-04-16

申请号：US12247986

申请日：2008-10-08

申请人： Stefan Behler ,  Patrick Blessing

发明人： Stefan Behler ,  Patrick Blessing

IPC分类号： H01L21/66

CPC分类号： G05B19/4015 ,  G05B2219/37619 ,  G05B2219/39022 ,  G05B2219/39041 ,  G05B2219/45029 ,  G05B2219/45063 ,  G05B2219/49206 ,  G05B2219/50023 ,  H01L21/67144 ,  H01L21/67276 ,  H01L21/681 ,  H01L22/12

摘要： The invention relates to a method for picking up semiconductor chips from a wafer table and, optionally, their mounting on a substrate by means of a pick-and-place system. The position and orientation of the semiconductor chip to be mounted next are determined by means of a first camera and made available in the form of positional data relating to a first system of coordinates. The position and orientation of the substrate place on which the semiconductor chip will be mounted are determined by means of a second camera and made available in the form of positional data relating to a second system of coordinates. The conversion of coordinates of the first or second system of coordinates into coordinates of motion of the pick-and-place system occurs by means of two fixed mapping functions and two changeable correction vectors. The correction vectors are readjusted on the occurrence of a predetermined event.

摘要翻译： 本发明涉及一种用于从晶片台拾取半导体芯片的方法，并且可选地，通过拾取和放置系统将其安装在基板上。 接下来要安装的半导体芯片的位置和取向通过第一相机确定，并以与第一坐标系相关的位置数据的形式提供。 通过第二相机确定半导体芯片将要安装的基板位置的位置和取向，并以与第二坐标系相关的位置数据的形式提供。 通过两个固定映射函数和两个可更改的校正向量，将第一或第二坐标系坐标转换为拾取和放置系统的运动坐标。 在发生预定事件时重新调整校正矢量。

公开(公告)号：US08133823B2

公开(公告)日：2012-03-13

申请号：US12247986

申请日：2008-10-08

申请人： Stefan Behler ,  Patrick Blessing

发明人： Stefan Behler ,  Patrick Blessing

IPC分类号： H01L21/98

CPC分类号： G05B19/4015 ,  G05B2219/37619 ,  G05B2219/39022 ,  G05B2219/39041 ,  G05B2219/45029 ,  G05B2219/45063 ,  G05B2219/49206 ,  G05B2219/50023 ,  H01L21/67144 ,  H01L21/67276 ,  H01L21/681 ,  H01L22/12

摘要： The invention relates to a method for picking up semiconductor chips from a wafer table and, optionally, their mounting on a substrate by means of a pick-and-place system. The position and orientation of the semiconductor chip to be mounted next are determined by means of a first camera and made available in the form of positional data relating to a first system of coordinates. The position and orientation of the substrate place on which the semiconductor chip will be mounted are determined by means of a second camera and made available in the form of positional data relating to a second system of coordinates. The conversion of coordinates of the first or second system of coordinates into coordinates of motion of the pick-and-place system occurs by means of two fixed mapping functions and two changeable correction vectors. The correction vectors are readjusted on the occurrence of a predetermined event.

摘要翻译： 本发明涉及一种用于从晶片台拾取半导体芯片的方法，并且可选地，通过拾取和放置系统将其安装在基板上。 接下来要安装的半导体芯片的位置和取向通过第一相机确定，并以与第一坐标系相关的位置数据的形式提供。 通过第二相机确定半导体芯片将要安装的基板位置的位置和取向，并以与第二坐标系相关的位置数据的形式提供。 通过两个固定映射函数和两个可更改的校正向量，将第一或第二坐标系坐标转换为拾取和放置系统的运动坐标。 在发生预定事件时重新调整校正矢量。

公开(公告)号：US20100315655A1

公开(公告)日：2010-12-16

申请号：US12518098

申请日：2007-11-19

申请人： Stefan Behler ,  Patrick Blessing ,  Stephan Scholze ,  Roland Stalder ,  Martin Von Arx

发明人： Stefan Behler ,  Patrick Blessing ,  Stephan Scholze ,  Roland Stalder ,  Martin Von Arx

IPC分类号： G01B11/02

CPC分类号： G01B11/0608

摘要： Determination of the height difference between a first reference point and a second reference point, at least one of the two reference points lying on a semiconductor chip, which is mounted on a substrate, comprises the stepsA) recording a first image from a first direction, which runs diagonally to the surface of the substrate at a predetermined angle α2, the substrate and the semiconductor chip being illuminated from a second direction which runs diagonally to the surface of the substrate at a predetermined angle α3, a telecentric optics being located in the beam path, B) recording a second image from the second direction, the substrate and the semiconductor chip being illuminated from the first direction, either the cited telecentric optics or a further telecentric optics being located in the beam path, C) ascertaining a first coordinate of the position of the first reference point and a first coordinate of the position of the second reference point in the first image and determining a first difference between these two coordinates, D) ascertaining a first coordinate of the position of the first reference point and a first coordinate of the position of the second reference point in the second image and determining a second difference between these two coordinates, and E) calculating the height difference from the first difference and the second difference.

摘要翻译： 确定第一参考点和第二参考点之间的高度差，位于安装在基板上的半导体芯片上的两个参考点中的至少一个包括以下步骤：A）从第一方向 ，其以预定角度α2对角地延伸到基板的表面，基板和半导体芯片从以基板的表面以预定角度α3斜对角地延伸的第二方向照射，远心光学器件位于 B）从所述第二方向记录第二图像，所述衬底和所述半导体芯片从所述第一方向被照射，所述远心光学器件或另外的远心光学器件位于所述光束路径中，C）确定第一坐标 的第一参考点的位置和第二参考点在第一图像和确定中的位置的第一坐标 确定这两个坐标之间的第一差异，D）确定第一参考点的位置的第一坐标和第二图像中的第二参考点的位置的第一坐标，并确定这两个坐标之间的第二差，以及 E）计算与第一差异和第二差异的高度差。

公开(公告)号：US20070145102A1

公开(公告)日：2007-06-28

申请号：US11644445

申请日：2006-12-22

申请人： Patrick Blessing ,  Ruedi Grueter ,  Dominik Werne

发明人： Patrick Blessing ,  Ruedi Grueter ,  Dominik Werne

IPC分类号： A47J36/02

CPC分类号： H05K13/0812 ,  H01L21/67144 ,  H01L21/681 ,  H01L2224/75 ,  H01L2224/757 ,  H01L2224/75702 ,  H01L2224/758 ,  H05K2201/10674

摘要： The invention concerns a method for mounting a semiconductor chip with bumps on one surface onto a substrate location of a substrate, whereby the bumps are brought into contact with corresponding pads on the substrate location. Reference marks are attached to the bondhead that enable measurement of the actual position of the semiconductor chip as well as measurement of the actual position of the substrate location in relation to a system of coordinates defined by the reference marks. Positional displacement of the individual components of the assembly machine caused by thermal influences can be compensated without perpetual calibration procedures having to be carried out.

摘要翻译： 本发明涉及一种将一个表面上具有凸块的半导体芯片安装到基板的基板位置上的方法，由此使凸块与基板位置上的相应焊盘接触。 参考标记附着在能够测量半导体芯片的实际位置的基准头上，以及相对于由参考标记定义的坐标系的基板位置的实际位置的测量。 可以补偿由热影响引起的组装机的各个部件的位置位移，而不必执行永久校准程序。

公开(公告)号：US08166637B2

公开(公告)日：2012-05-01

申请号：US12525535

申请日：2008-01-25

申请人： Patrick Blessing ,  Ruedi Grueter ,  Dominik Werne

发明人： Patrick Blessing ,  Ruedi Grueter ,  Dominik Werne

IPC分类号： B23P19/00

CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L21/681 ,  H01L24/75 ,  H01L24/81 ,  Y10T29/49131 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183

摘要： An apparatus for mounting semiconductor chips as flip chips on a substrate includes a chip supply, a pick-and-place system with a bonding head having a chip gripper, a flipping apparatus operable to rotate the chip from a first position to a second (flipped) position through an angle with a gripper and two cameras. The first camera determines a position of the chip before the flipping apparatus receives the chip and also determines a position of the flipped chip received by the chip gripper of the bonding head once the flipping apparatus has transferred the chip to it. The apparatus also comprises an optical switch, e.g., a rotatable mirror located in the field of view of the first camera. The mirror operates to rotate with the gripper of the flipping apparatus but at half the angle.

摘要翻译： 用于将半导体芯片作为倒装芯片安装在基板上的装置包括芯片供应，具有带芯片夹持器的接合头的拾取和放置系统，可操作以将芯片从第一位置旋转到第二位置的翻转装置（翻转 ）位置与夹具和两个相机成角度。 第一相机在翻转装置接收芯片之前确定芯片的位置，并且一旦翻转装置已经将芯片转移到其上，就确定由接合头的芯片夹持器接收的翻转芯片的位置。 该装置还包括光学开关，例如位于第一相机的视场中的可旋转镜。 镜子操作以与翻转装置的夹持器一起旋转，但是以一角度旋转。

公开(公告)号：US20050056947A1

公开(公告)日：2005-03-17

申请号：US10938430

申请日：2004-09-10

申请人： Patrick Blessing

发明人： Patrick Blessing

IPC分类号： H01L23/12 ,  H01L21/58 ,  H01L21/60 ,  H01L23/34

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01066 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/00

摘要： An apparatus for mounting semiconductor chips onto a substrate contains a measuring station for the contactless measurement of the height of the surface of the mounted semiconductor chip facing away from the substrate at a minimum of three locations. From this, at least one parameter is calculated that characterises the adhesive layer formed between the semiconductor chip and the substrate. A difference of the measured value to a set value is used to adjust the mounting process. An apparatus for wiring semiconductor chips also contains such a measuring station in order to determine the individual height of each connection point on the semiconductor chip. This information is used in order to lower the capillary to the respective connection point on the semiconductor chip in the shortest possible time.

摘要翻译： 用于将半导体芯片安装到基板上的装置包括用于在至少三个位置处非安装地测量安装的半导体芯片的背离基板的表面的高度的测量站。 由此，计算表征形成在半导体芯片和基板之间的粘合剂层的至少一个参数。 使用测量值与设定值的差异来调整安装过程。 用于布线半导体芯片的装置还包含这样的测量站，以便确定半导体芯片上的每个连接点的单独高度。 使用该信息以在最短的时间内将毛细管降低到半导体芯片上的相应连接点。

公开(公告)号：US20100040449A1

公开(公告)日：2010-02-18

申请号：US12525535

申请日：2008-01-25

申请人： Patrick Blessing ,  Ruedi Grueter ,  Dominik Werne

发明人： Patrick Blessing ,  Ruedi Grueter ,  Dominik Werne

IPC分类号： H01L21/68

CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L21/681 ,  H01L24/75 ,  H01L24/81 ,  Y10T29/49131 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183

摘要： The invention relates to an apparatus for mounting semiconductor chips as flip chip on a substrate. The apparatus comprises means for supplying the semiconductor chips, a pick-and-place system with a bonding head with a chip gripper, a flipping apparatus with a gripper and two cameras. The first camera is used for determining the actual position of the semiconductor chip that is provided by the said means for mounting before the flipping apparatus receives the semiconductor chip, and it is used to determine the actual position of the flip chip received by the chip gripper of the bonding head once the flipping apparatus has transferred the semiconductor chip. The apparatus comprises an optical switch in accordance with the invention, e.g., a rotatably held mirror which is located in the field of view of the first camera. In operation, the mirror is rotated simultaneously with the gripper of the flipping apparatus, but only by half the angle.

摘要翻译： 本发明涉及将半导体芯片作为倒装芯片安装在基板上的装置。 该装置包括用于提供半导体芯片的装置，具有带芯片夹持器的接合头的拾取和放置系统，具有夹持器的翻转装置和两个相机。 第一相机用于确定在翻转装置接收半导体芯片之前由所述用于安装的装置提供的半导体芯片的实际位置，并且用于确定由芯片夹持器接收的倒装芯片的实际位置 一旦翻转装置已经转移了半导体芯片，就结合头。 该装置包括根据本发明的光学开关，例如位于第一相机的视场中的可旋转地保持的反射镜。 在操作中，反射镜与翻转装置的夹持器同时旋转，但仅仅是角度的一半。

公开(公告)号：US07597234B2

公开(公告)日：2009-10-06

申请号：US11644445

申请日：2006-12-22

申请人： Patrick Blessing ,  Ruedi Grueter ,  Dominik Werne

发明人： Patrick Blessing ,  Ruedi Grueter ,  Dominik Werne

IPC分类号： B23K31/12 ,  H01L21/00

CPC分类号： H05K13/0812 ,  H01L21/67144 ,  H01L21/681 ,  H01L2224/75 ,  H01L2224/757 ,  H01L2224/75702 ,  H01L2224/758 ,  H05K2201/10674

摘要： The invention concerns a method for mounting a semiconductor chip with bumps on one surface onto a substrate location of a substrate, whereby the bumps are brought into contact with corresponding pads on the substrate location. Reference marks are attached to the bondhead that enable measurement of the actual position of the semiconductor chip as well as measurement of the actual position of the substrate location in relation to a system of coordinates defined by the reference marks. Positional displacement of the individual components of the assembly machine caused by thermal influences can be compensated without perpetual calibration procedures having to be carried out.

摘要翻译： 本发明涉及一种将一个表面上具有凸块的半导体芯片安装到基板的基板位置上的方法，由此使凸块与基板位置上的相应焊盘接触。 参考标记附着在能够测量半导体芯片的实际位置的基准头上，以及相对于由参考标记定义的坐标系的基板位置的实际位置的测量。 可以补偿由热影响引起的组装机的各个部件的位置位移，而不必执行永久校准程序。

公开(公告)号：US07193727B2

公开(公告)日：2007-03-20

申请号：US10938430

申请日：2004-09-10

申请人： Patrick Blessing

发明人： Patrick Blessing

IPC分类号： G01B11/24

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01066 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/00

摘要： An apparatus for mounting semiconductor chips onto a substrate contains a measuring station for the contactless measurement of the height of the surface of the mounted semiconductor chip facing away from the substrate at a minimum of three locations. From this, at least one parameter is calculated that characterises the adhesive layer formed between the semiconductor chip and the substrate. A difference of the measured value to a set value is used to adjust the mounting process. An apparatus for wiring semiconductor chips also contains such a measuring station in order to determine the individual height of each connection point on the semiconductor chip. This information is used in order to lower the capillary to the respective connection point on the semiconductor chip in the shortest possible time.

摘要翻译： 用于将半导体芯片安装到基板上的装置包括用于在至少三个位置处非安装地测量安装的半导体芯片的背离基板的表面的高度的测量站。 由此，计算表征形成在半导体芯片和基板之间的粘合剂层的至少一个参数。 使用测量值与设定值的差异来调整安装过程。 用于布线半导体芯片的装置还包含这样的测量站，以便确定半导体芯片上的每个连接点的单独高度。 使用该信息以在最短的时间内将毛细管降低到半导体芯片上的相应连接点。