公开(公告)号：US20240061405A1

公开(公告)日：2024-02-22

申请号：US18259667

申请日：2021-03-11

申请人： OMRON Corporation

发明人： Hiroyuki MORI ,  Keita SAJI ,  Mayuko TANAKA ,  Katsuki NAKAJIMA

IPC分类号： G05B19/418

CPC分类号： G05B19/4183 ,  G05B19/41835 ,  G05B2219/45026 ,  G05B2219/45029

摘要： A management apparatus of a production facility, including: a facility condition collecting unit collecting facility condition information regarding conditions of the production facility from the production facility; an operation instruction creating unit creating operation instruction information indicating an instruction to perform an operation relating to the production facility on the facility condition information; an instruction transmitting unit transmitting the operation instruction information to a target; an operation information receiving unit receiving operation information regarding status of response to the operation instruction information; a management state information creating unit creating management state information including the operation instruction information, the operation information, and the production facility condition information; and an additional operation instruction issuing unit receiving additional operation instruction information indicating an instruction to perform an additional operation on the management state information, and causing the operation instruction creating unit to create operation instruction information including the additional operation instruction information.

公开(公告)号：US08282008B2

公开(公告)日：2012-10-09

申请号：US11547728

申请日：2005-04-08

申请人： André Corriveau ,  François Monette ,  Vincent Dubois

发明人： André Corriveau ,  François Monette ,  Vincent Dubois

IPC分类号： G06K19/06

CPC分类号： G05B19/4183 ,  G05B2219/31312 ,  G05B2219/33199 ,  G05B2219/45029 ,  Y02P90/10

摘要： A closed-loop receptacle setup verification and traceability system for use in automatically detecting the presence or absence of a components receptacle at a location is presented, such receptacles comprising components reels, components bearing trays or racks, or other such receptacles for bearing and providing components for components processing and/or manipulation. The system is further for automatically identifying the detected receptacles and validating their use at respective detecting locations based on components parameters identifiably associated therewith. The system is still further for tracking and monitoring such receptacles from one detecting location to another optionally updating components parameters associated therewith as needed. To implement the system, each receptacle should comprise at least one detectable element and each detecting position should comprise at least one reader adapted to detect the detectable element and so determine whether receptacles are present at the detecting locations being monitored. Typically, the closed loop system uses RFID technology, e.g. the detector comprises at least one antenna and the detectable element comprises at least one RF tag. Detector antennae may be multiplexed or operated independently to communicate detection, identification and/or validation data between the detectable elements and the system.

摘要翻译： 提供了用于自动检测部件容器在某一位置是否存在的闭环插座设置验证和可追溯性系统，这种插座包括组件卷轴，部件托盘或机架，或其它用于承载和提供组件的容器 用于组件处理和/或操纵。 该系统进一步用于基于与其可识别相关联的组件参数来自动识别检测到的插座并在相应的检测位置验证其使用。 该系统还进一步用于跟踪和监视这些插座从一个检测位置到另一个检测位置，另外可选地根据需要更新与其相关联的部件参数。 为了实现该系统，每个容器应包括至少一个可检测元件，并且每个检测位置应包括适于检测可检测元件的至少一个读取器，并且因此确定在被监测的检测位置处是否存在插座。 通常，闭环系统使用RFID技术，例如 所述检测器包括至少一个天线，并且所述可检测元件包括至少一个RF标签。 检测器天线可以被独立地复用或操作，以便在可检测元件和系统之间传送检测，识别和/或验证数据。

公开(公告)号：US08133823B2

公开(公告)日：2012-03-13

申请号：US12247986

申请日：2008-10-08

申请人： Stefan Behler ,  Patrick Blessing

发明人： Stefan Behler ,  Patrick Blessing

IPC分类号： H01L21/98

CPC分类号： G05B19/4015 ,  G05B2219/37619 ,  G05B2219/39022 ,  G05B2219/39041 ,  G05B2219/45029 ,  G05B2219/45063 ,  G05B2219/49206 ,  G05B2219/50023 ,  H01L21/67144 ,  H01L21/67276 ,  H01L21/681 ,  H01L22/12

摘要： The invention relates to a method for picking up semiconductor chips from a wafer table and, optionally, their mounting on a substrate by means of a pick-and-place system. The position and orientation of the semiconductor chip to be mounted next are determined by means of a first camera and made available in the form of positional data relating to a first system of coordinates. The position and orientation of the substrate place on which the semiconductor chip will be mounted are determined by means of a second camera and made available in the form of positional data relating to a second system of coordinates. The conversion of coordinates of the first or second system of coordinates into coordinates of motion of the pick-and-place system occurs by means of two fixed mapping functions and two changeable correction vectors. The correction vectors are readjusted on the occurrence of a predetermined event.

摘要翻译： 本发明涉及一种用于从晶片台拾取半导体芯片的方法，并且可选地，通过拾取和放置系统将其安装在基板上。 接下来要安装的半导体芯片的位置和取向通过第一相机确定，并以与第一坐标系相关的位置数据的形式提供。 通过第二相机确定半导体芯片将要安装的基板位置的位置和取向，并以与第二坐标系相关的位置数据的形式提供。 通过两个固定映射函数和两个可更改的校正向量，将第一或第二坐标系坐标转换为拾取和放置系统的运动坐标。 在发生预定事件时重新调整校正矢量。

公开(公告)号：US07324861B1

公开(公告)日：2008-01-29

申请号：US11564969

申请日：2006-11-30

申请人： Chun Bin Zheng

发明人： Chun Bin Zheng

IPC分类号： G06F19/00

CPC分类号： H05K3/1225 ,  G05B2219/45029 ,  G05B2219/45041 ,  H05K2203/107

摘要： A numerical control system for laser cutting an SMT stencil includes a mechanical control portion (2) and a laser control portion (3). The mechanical control portion includes a first main control system (21), a first host computer isolation interface (22), a first communication interface controller (24), a first optoelectronic/magnetic isolator (25), and a first isolated input/output interface (23) coupled to a mechanical transmission device. Similarly, the laser control portion includes a second main control system (31), a second host computer isolation interface (32), a second communication interface controller (34), a second optoelectronic/magnetic isolator (35), and a second isolated input/output interface (33) coupled to a laser cutting device. The first and second main control systems are connected with the host computer via the respective first and second host computer isolation interfaces. The first and second optoelectronic/magnetic isolators are connected with a slave computer. The numerical control system can be further divided into a cutting management module (4) and a stencil output module (5). A numerical control method associated with the above numerical control system for laser cutting an SMT stencil is also disclosed.

摘要翻译： 用于激光切割SMT模板的数控系统包括机械控制部分（2）和激光控制部分（3）。 机械控制部分包括第一主控制系统（21），第一主机隔离接口（22），第一通信接口控制器（24），第一光电/磁隔离器（25）和第一隔离输入/输出 接口（23）耦合到机械传动装置。 类似地，激光控制部分包括第二主控制系统（31），第二主计算机隔离接口（32），第二通信接口控制器（34），第二光电子/磁隔离器（35）和第二隔离输入 /输出接口（33），其耦合到激光切割装置。 第一和第二主控制系统通过相应的第一和第二主机隔离接口与主计算机连接。 第一和第二光电/磁隔离器与从属计算机连接。 数控系统可以进一步分为切割管理模块（4）和模板输出模块（5）。 还公开了一种与上述用于激光切割SMT模板的数控系统相关联的数字控制方法。

公开(公告)号：US12017341B2

公开(公告)日：2024-06-25

申请号：US16795901

申请日：2020-02-20

申请人： FANUC CORPORATION

发明人： Yoshio Motowaki

IPC分类号： B25J11/00 ,  B23K3/06 ,  B23K3/08 ,  B23K37/00 ,  B25J9/00 ,  B25J15/04 ,  H05K13/04 ,  B23K101/42

CPC分类号： B25J11/005 ,  B23K3/0607 ,  B23K3/082 ,  B23K3/087 ,  B23K37/00 ,  B25J9/0093 ,  B25J9/0096 ,  B25J15/04 ,  H05K13/0465 ,  B23K2101/42 ,  G05B2219/2601 ,  G05B2219/45029 ,  G05B2219/50391

摘要： The robot apparatus includes a solder pot having a nozzle from which solder flows out, a flux ejection tool for ejecting flux, and a support tool for supporting the solder pot. The robot apparatus includes a table for supporting a workpiece, and a placement member on which the operation tools and the solder pot can be placed. The controller performs a flux application control for coupling the flux ejection tool to the robot and applying flux to the workpiece, a preheating control for coupling the support tool to the robot and arranging the solder pot below the workpiece so as to heat the workpiece, and a supply control for moving the nozzle of the solder pot closer to the workpiece and supplying the solder.

公开(公告)号：US20150079700A1

公开(公告)日：2015-03-19

申请号：US14026753

申请日：2013-09-13

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chih-Ming Ke ,  Ching-Pin Kao ,  Yang-Hung Chang ,  Kai-Hsiung Chen ,  Chun-Ming Hu

IPC分类号： H01L21/66

CPC分类号： G03F1/36 ,  G03F1/144 ,  G03F1/68 ,  G03F1/70 ,  G03F7/70508 ,  G03F7/70525 ,  G03F7/70633 ,  G05B13/042 ,  G05B19/41835 ,  G05B2219/45029 ,  G05B2219/45031 ,  G06F17/5068 ,  H01L22/20 ,  Y02P90/12

摘要： The present disclosure provides methods and systems for providing a similarity index in semiconductor process control. One of the methods disclosed herein is a method for semiconductor fabrication process control. The method includes steps of receiving a first semiconductor device wafer and receiving a second semiconductor device wafer. The method also includes a step of collecting metrology data from the first and second semiconductor device wafers. The metrology data includes a first set of vectors associated with the first semiconductor device wafer and a second set of vectors associated with the second semiconductor device wafer. The method includes determining a similarity index based in part on a similarity index value between a first vector from the first set of vectors and a second vector from the second set of vectors and continuing to process additional wafers under current parameters when the similarity index is above a threshold value.

摘要翻译： 本公开提供了用于在半导体过程控制中提供相似性指数的方法和系统。 本文公开的方法之一是用于半导体制造过程控制的方法。 该方法包括接收第一半导体器件晶片和接收第二半导体器件晶片的步骤。 该方法还包括从第一和第二半导体器件晶片收集测量数据的步骤。 测量数据包括与第一半导体器件晶片相关联的第一组向量和与第二半导体器件晶片相关联的第二组向量。 该方法包括部分地基于来自第一组向量的第一向量和来自第二组向量的第二向量之间的相似性指数值来确定相似性指数，并且当相似性指数高于当前参数时，继续处理当前参数下的附加晶圆 一个阈值。

公开(公告)号：US08925186B2

公开(公告)日：2015-01-06

申请号：US13520674

申请日：2011-01-06

申请人： Erwin John Van Zwet ,  Léon Van Dooren ,  Adrianus Johannes Petrus Maria Vermeer ,  Kees Moddemeijer

发明人： Erwin John Van Zwet ,  Léon Van Dooren ,  Adrianus Johannes Petrus Maria Vermeer ,  Kees Moddemeijer

IPC分类号： B23P19/00 ,  B25J9/16 ,  G05B19/401 ,  H01L21/68

CPC分类号： B25J9/1697 ,  G05B19/401 ,  G05B2219/40609 ,  G05B2219/45029 ,  H01L21/681 ,  Y10T29/53087 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178

摘要： According to an aspect of the invention, there is provided a chip die 2 manipulator apparatus arranged for picking and placing of a chip die 2 in a chip manufacturing process, wherein an imaging system 11 comprising an arc form convex spherical mirror 13 arranged at a second off-axis position B and centered relative to the center position 5; a folding mirror 4 arranged in a light path between the convex spherical mirror 13 and the center position 5 for folding the light path to a third off-axis position C; and an arc form concave spherical mirror 15 arranged at the third off-axis position C having a curvature to image from at least one of the center position 5 and the component 2 on the image detection system 9. The imaging system 11 corrects for the angled image detection of the center position 5.

摘要翻译： 根据本发明的一个方面，提供了一种在芯片制造过程中设置用于拾取和放置芯片芯片2的芯片芯片2的机械手装置，其中，成像系统11包括设置在第二个处的弧形凸球面镜13 离轴位置B并相对于中心位置5居中; 折叠镜4，布置在凸球面镜13和中心位置5之间的光路中，用于将光路折叠到第三离轴位置C; 以及布置在第三离轴位置C处的弧形凹球面镜15，其具有从图像检测系统9上的中心位置5和部件2中的至少一个成像的曲率。成像系统11校正成角度 图像检测中心位置5。

公开(公告)号：US20110098840A1

公开(公告)日：2011-04-28

申请号：US13000755

申请日：2009-05-28

申请人： Yuzuru Inaba ,  Osamu Okuda

发明人： Yuzuru Inaba ,  Osamu Okuda

IPC分类号： G06F19/00

CPC分类号： H05K13/0452 ,  G05B2219/45029 ,  H05K13/0404 ,  H05K13/0408 ,  H05K13/046

摘要： A problem that the present invention is to solve is to provide a parts mounting related work device which can prevent the occurrence of an unexpected operation failure and an erroneous stopping of the whole system which are attributed to an error in combination of working head and working equipment.A storage part (24c) stores combinations of types of working heads (H) and types of working equipment (E) which correspond to contents of work that is performed on a board (PB), and a determination part (24d) determines whether or not the combination of the type of the working head (H) which is currently detected by a head type detector and the type of the working equipment which is currently detected by an equipment type detector coincides with any of combinations stored in the storage part (24c). An action restriction part (24e) restricts a moving action of a moving stage (11) by an action control part (24a) in case the determination part (24d) determines that the combination of the type of the working head (H) which is currently attached to the moving stage (11) and the type of the working equipment which is currently mounted in a base platform (3) coincides with non of the combinations stored in the storage part (24c).

摘要翻译： 本发明要解决的问题是提供一种能够防止由于工作头和作业设备的组合引起的误差而引起的意外的操作故障和整个系统的错误停止的零件安装相关的工作装置 。 存储部（24c）存储与在板（PB）上进行的作业的内容对应的工作头（H）和工作装置（E）的种类的组合，判定部（24d） 不是由头型检测器当前检测到的工作头（H）的类型与当前由设备型检测器检测到的工作设备的类型的组合与存储在存储部分（24c）中的任何组合 ）。 动作限制部分（24e）在确定部分（24d）确定工作头（H）的类型的组合（H）是否合并的情况下，通过动作控制部分（24a）限制移动台（11）的移动动作 当前安装在基台（3）上的工作设备的类型与存储在存储部分（24c）中的组合的非组合一致。

公开(公告)号：US07801634B2

公开(公告)日：2010-09-21

申请号：US11914530

申请日：2006-06-07

申请人： Hiroaki Kurata ,  Yasuhiro Maenishi

发明人： Hiroaki Kurata ,  Yasuhiro Maenishi

IPC分类号： G06F19/00 ,  G06F11/30 ,  G21C17/00 ,  B23P19/00

CPC分类号： G05B19/41865 ,  G05B2219/31385 ,  G05B2219/32021 ,  G05B2219/32301 ,  G05B2219/45029 ,  G06Q10/087 ,  H05K13/0452 ,  H05K13/08 ,  Y02P70/161 ,  Y02P90/04 ,  Y02P90/20 ,  Y02P90/205 ,  Y02P90/26 ,  Y10T29/53174 ,  Y10T29/53178

摘要： A mounter for a manufacturing management method suppresses an occurrence of inventory shortage or excess inventory as much as possible, and provides energy savings when manufacturing is not performed at full capacity. A throughput determining step acquires manufacturing information included in a manufacturing plan while manufacturing equipment is manufacturing mounted boards and determines a throughput of the manufacturing equipment for the mounted boards based on the manufacturing information while the manufacturing equipment is manufacturing a sequence of the mounted boards. A manufacturing condition determining step determines a manufacturing condition for decreasing power consumption of the manufacturing equipment within a range of throughput not lower than the determined throughput in the case where the throughput determined in the throughput determining step is equal to or lower than a current throughput of the manufacturing equipment.

摘要翻译： 用于制造管理方法的安装者尽可能地抑制库存短缺或库存过剩，并且当以全容量进行制造时能够节省能源。 吞吐量确定步骤在制造设备制造安装板的同时制造设备中获得的制造信息，并且在制造设备制造安装的板的顺序的同时，基于制造信息确定安装板的制造设备的生产量。 制造条件确定步骤在吞吐量确定步骤中确定的吞吐量等于或低于当前吞吐量的情况下，确定在不低于所确定的吞吐量的吞吐量范围内降低制造设备的功耗的制造条件 制造设备。

公开(公告)号：US20090099678A1

公开(公告)日：2009-04-16

申请号：US11914530

申请日：2006-06-07

申请人： Hiroaki Kurata ,  Yasuhiro Maenishi

发明人： Hiroaki Kurata ,  Yasuhiro Maenishi

IPC分类号： G06F17/00 ,  G06G7/66

CPC分类号： G05B19/41865 ,  G05B2219/31385 ,  G05B2219/32021 ,  G05B2219/32301 ,  G05B2219/45029 ,  G06Q10/087 ,  H05K13/0452 ,  H05K13/08 ,  Y02P70/161 ,  Y02P90/04 ,  Y02P90/20 ,  Y02P90/205 ,  Y02P90/26 ,  Y10T29/53174 ,  Y10T29/53178

摘要： For a mounter, to provide a manufacturing management method which enables to suppress an occurrence of inventory shortage or excess inventory as much as possible, and to provide a manufacturing management method which allows energy savings when manufacturing is not performed at full capacity.The method includes: a throughput determining step of acquiring manufacturing information included in a manufacturing plan while manufacturing equipment is manufacturing mounted boards and determining a throughput of the manufacturing equipment for the mounted boards based on the manufacturing information while the manufacturing equipment is manufacturing a sequence of the mounted boards; and further a manufacturing condition determining step of determining a manufacturing condition for decreasing power consumption of the manufacturing equipment within a range of throughput not lower than the determined throughput in the case where the throughput determined in the throughput determining step is equal to or lower than a current throughput of the manufacturing equipment.

摘要翻译： 对于安装者来说，提供能够尽可能地抑制库存短缺或过多库存的发生的制造管理方法，并且提供一种当在全容量下不进行制造时允许节能的制造管理方法。 该方法包括：吞吐量确定步骤，在制造设备制造安装板时，获取制造计划中包括的制造信息，并且基于制造信息确定安装板的制造设备的生产量，同时制造设备制造一系列 安装板; 以及进一步的制造条件确定步骤，在吞吐量确定步骤中确定的吞吐量等于或低于所述吞吐量的情况下，确定在不低于所确定的吞吐量的吞吐量范围内降低制造设备的功耗的制造条件 当前生产设备的吞吐量。