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42 条记录 (耗时 0.02 秒)

    Expandable bracing apparatus and method
    1.
    发明申请
    Expandable bracing apparatus and method 有权
    可扩展支撑装置及方法

    公开(公告)号：US20050243524A1

    公开(公告)日：2005-11-03

    申请号：US10834517

    申请日：2004-04-28

    申请人： Stephan Barsun ,  Bryan Bolich ,  Richard Miner ,  Michael Wortman

    发明人： Stephan Barsun ,  Bryan Bolich ,  Richard Miner ,  Michael Wortman

    IPC分类号： H01L23/40 ,  H05K7/20

    CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A bracing apparatus is disclosed that has a component located within an opening in a cantilevered end of a heatsink. The component has a form factor that is expandable for stabilizing the heatsink at a given elevation relative to a printed circuit board. The bracing apparatus includes a tensioning device located within an opening in the component. When deployed, the tensioning device causes the component to expand. Also included in the bracing apparatus is a coupling medium for coupling the component to the printed circuit board.

    摘要翻译： 公开了一种支撑装置，其具有位于散热器的悬臂端部中的开口内的部件。 该组件具有可膨胀的形状因子，用于在相对于印刷电路板的给定高度处稳定散热器。 支撑装置包括位于部件中的开口内的张紧装置。 部署时，张紧装置使部件膨胀。 支撑装置中还包括用于将部件耦合到印刷电路板的耦合介质。

    Offset compensation system
    3.
    发明申请
    Offset compensation system 失效
    偏移补偿系统

    公开(公告)号：US20050186831A1

    公开(公告)日：2005-08-25

    申请号：US10782700

    申请日：2004-02-19

    申请人： Stephan Barsun ,  Bryan Bolich ,  Alisa Sandoval ,  Gregg Meyer ,  Richard Miner

    发明人： Stephan Barsun ,  Bryan Bolich ,  Alisa Sandoval ,  Gregg Meyer ,  Richard Miner

    IPC分类号： G06F1/18 ,  G06F1/20 ,  H01R12/00

    CPC分类号： G06F1/20 ,  G06F1/183

    摘要： A computing system includes a circuit board, a first connector portion electrically connected to the circuit board, an electronic component and a plurality of resilient support members. The electronic component includes a first electronic device, a second connector portion electrically coupled to the electronic device and connected to the first connector portion along an axis. The plurality of resilient support members are asymmetrically located about the axis and extend between the device and the circuit board.

    摘要翻译： 计算系统包括电路板，电连接到电路板的第一连接器部分，电子部件和多个弹性支撑部件。 电子部件包括第一电子设备，电连接到电子设备并沿轴线连接到第一连接器部分的第二连接器部分。 多个弹性支撑构件围绕轴线不对称地定位并且在装置和电路板之间延伸。

    Circuit board assembly
    4.
    发明申请
    Circuit board assembly 失效
    电路板组装

    公开(公告)号：US20050073813A1

    公开(公告)日：2005-04-07

    申请号：US10680857

    申请日：2003-10-07

    申请人： Gregory Meyer ,  Stephan Barsun ,  Bryan Bolich ,  S. Cromwell

    发明人： Gregory Meyer ,  Stephan Barsun ,  Bryan Bolich ,  S. Cromwell

    IPC分类号： H05K3/30 ,  H05K7/14 ,  H05K7/20 ,  H01L23/34

    CPC分类号： H05K3/301 ,  H05K7/142 ,  H05K2201/09954 ,  H05K2201/10409 ,  H05K2201/2036

    摘要： A circuit board assembly includes a circuit board, an electronic component, a plurality of incremental detents and at least one projection. The plurality of incremental detents are coupled to one of the circuit board and the electronic component and are retained relative to said one of the circuit board and the electronic component against linear movement in both directions along a first axis. The at least one projection is coupled to the other of the circuit board and the electronic component and is retained against linear movement along the first axis. The at least one projection is received within at least one of the plurality of detents to retain the electronic component relative to the circuit board against linear movement in both directions along the axis.

    摘要翻译： 电路板组件包括电路板，电子部件，多个增量棘爪和至少一个突起。 多个增量棘爪联接到电路板和电子部件中的一个，并且相对于电路板和电子部件中的一个保持，以抵抗沿着第一轴线的两个方向的线性运动。 所述至少一个突出部联接到所述电路板和所述电子部件中的另一个并且被保持抵抗沿着所述第一轴线的线性运动。 所述至少一个突起容纳在所述多个棘爪中的至少一个棘爪内，以相对于所述电路板保持所述电子部件，以抵抗沿所述轴线的两个方向的线性运动。

    Circuit board assembly
    7.
    发明申请
    Circuit board assembly 有权
    电路板组装

    公开(公告)号：US20050073817A1

    公开(公告)日：2005-04-07

    申请号：US10680445

    申请日：2003-10-07

    申请人： Stephan Barsun ,  Gregory Meyer ,  Bryan Bolich ,  S. Daniel Cromwell

    发明人： Stephan Barsun ,  Gregory Meyer ,  Bryan Bolich ,  S. Daniel Cromwell

    IPC分类号： H05K3/30 ,  H05K7/02 ,  H05K7/06

    CPC分类号： H05K3/301 ,  H05K2201/09954 ,  H05K2201/10409 ,  H05K2201/2036

    摘要： A circuit board assembly includes a circuit board, an electronic component and a structure coupling the electronic component to the circuit board. The structure retains the electronic component relative to the circuit board at a selected one of a plurality of positions in both directions along an axis perpendicular to the circuit board. The structure is movably coupled to one of the electronic component and the circuit board in a direction perpendicular to the axis at least prior to being coupled to the other of the electronic component and the circuit board.

    摘要翻译： 电路板组件包括电路板，电子部件和将电子部件耦合到电路板的结构。 该结构沿着垂直于电路板的轴在两个方向上的多个位置中的选定的一个位置处相对于电路板保持电子部件。 至少在与电子部件和电路板的另一个耦合之前，该结构可以在垂直于轴线的方向上可移动地耦合到电子部件和电路板之一。

    Spring adapted to hold electronic device in a frame
    9.
    发明申请
    Spring adapted to hold electronic device in a frame 有权
    弹簧适用于将电子设备固定在一个框架中

    公开(公告)号：US20060139886A1

    公开(公告)日：2006-06-29

    申请号：US11027337

    申请日：2004-12-29

    申请人： Stephan Barsun

    发明人： Stephan Barsun

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

    摘要： An assembly comprises a frame adapted to mount an electronic device having a thickness within a range of thicknesses. The frame is adapted to assemble to a heat sink assembly after the electronic device is mounted. The assembly further comprises at least one spring adapted to secure the electronic device to the frame.

    摘要翻译： 组件包括适于安装厚度在厚度范围内的电子设备的框架。 该框架适于在安装电子装置之后组装到散热器组件。 组件还包括适于将电子设备固定到框架的至少一个弹簧。

    Heatsink with multiple fin types
    10.
    发明授权
    Heatsink with multiple fin types 有权
    散热片有多种散热片类型

    公开(公告)号：US06659168B1

    公开(公告)日：2003-12-09

    申请号：US10192124

    申请日：2002-07-09

    申请人： Stephan Barsun

    发明人： Stephan Barsun

    IPC分类号： H05K720

    CPC分类号： H01L23/3672 ,  H01L23/3675 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink includes a base having first and second regions, a first fin of a first type disposed on the first region of the base, and a second fin of a second type disposed on the second region of the base. The first and second regions of the base may be integral with or attached to one another. Such a heat sink can dissipate heat from multiple electronic components with the respective fin type that is most cost effective for each respective component. Using such a heat sink often reduces manufacturing time and costs as compared to using a separate heat sink for each component. In addition, such a heat sink can dissipate heat from multiple regions of a single electronic component with the respective fin type that is most cost effective for each region.

    摘要翻译： 散热器包括具有第一和第二区域的基座，设置在基座的第一区域上的第一类型的第一翅片和设置在基座的第二区域上的第二类型的第二翅片。 基座的第一和第二区域可以彼此成一体或彼此附接。 这样的散热器可以从具有对于每个相应部件最具成本效益的相应散热片类型的多个电子部件散热。 与每个部件使用单独的散热器相比，使用这种散热器通常减少制造时间和成本。 此外，这样的散热器可以从单个电子部件的多个区域散发具有对于每个区域最具成本效益的相应散热片类型的热量。