摘要:
The present invention relates to a rapid and metal-free process for preparing high order hydridosilane compounds from low order hydridosilane compounds, wherein at least one low order hydridosilane compound (I) is thermally reacted in the presence of at least one hydridosilane compound (II) having a weight average molecular weight of at least 500 g/mol, to the hydridosilane compounds obtainable by the process and to their use.
摘要:
The present invention relates to a method for oligomerizing hydridosilanes, wherein a composition comprising substantially at least one non-cyclic hydridosilane having a maximum of 20 silicon atoms as the hydridosilane is thermally converted at temperatures below 235° C. in the absence of a catalyst, the oligomers that can be produced according to the method, and the use thereof.
摘要:
The present invention relates to a rapid and metal-free process for preparing high order hydridosilane compounds from low order hydridosilane compounds, wherein at least one low order hydridosilane compound (I) is thermally reacted in the presence of at least one hydridosilane compound (II) having a weight average molecular weight of at least 500 g/mol, to the hydridosilane compounds obtainable by the process and to their use.
摘要:
The present invention relates to a method for oligomerizing hydridosilanes, wherein a composition comprising substantially at least one non-cyclic hydridosilane having a maximum of 20 silicon atoms as the hydridosilane is thermally converted at temperatures below 235° C. in the absence of a catalyst, the oligomers that can be produced according to the method, and the use thereof.
摘要:
The present invention relates to a liquid-phase process for producing structured silicon- and/or germanium-containing coatings by the application to a substrate of at least one coating composition, the partial activation of the resulting coating on the coated substrate, and oxidation of non-activated coating on the substrate, to the coats produced by the process and to their use.
摘要:
A split end cutting device (20.2) is embodied as an attachment (15.2), which can be detachably connected to a hair cutting machine (21), where the attachment (15.2) has first and second deflecting sections (41, 42), which are disposed parallel to and spaced apart from each other by a distance (X). By means of a hinge (14.2), a third deflecting section (43) can be moved from a first position (A) passing between the first and second deflecting sections (41, 42) into a second position (B) parallel to the first and second deflecting sections (41, 42), in such a way that a lock of hair (28) placed underneath the first and second deflecting sections (41, 42) is engaged from underneath by the third deflecting section (43) and essentially constitutes an upside down U-shape. A cutting head (27) with the hair cutting machine (21) is positioned in a stationary fashion in such a way that when the lock of hair (28) is pulled through over the deflecting sections (41, 42, 43), only the protruding split ends (30) in an upper region (Y) of the third deflecting section (43) are cut off by the cutting head (27).