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    Method and system of releasing a MEMS structure
    2.
    发明授权
    Method and system of releasing a MEMS structure 有权
    释放MEMS结构的方法和系统

    公开(公告)号：US07250353B2

    公开(公告)日：2007-07-31

    申请号：US11094101

    申请日：2005-03-29

    申请人： Steven S. Nasiri ,  Anthony Francis Flannery, Jr. ,  Martin Lim

    发明人： Steven S. Nasiri ,  Anthony Francis Flannery, Jr. ,  Martin Lim

    IPC分类号： H01L21/46 ,  H01L21/78 ,  H01L21/326

    CPC分类号： B81C1/00333

    摘要： A MEMs (microelectromechanical systems) structure is provided. In one implementation, the MEMs structure includes a substrate wafer including a MEMs device formed on a surface of the substrate wafer, and a MEMs cover structure to cover the MEMs device formed on the surface of the substrate wafer. The MEMs cover structure comprises a first wafer bonded to a second wafer, in which only the first wafer of the MEMs cover structure is sawed through and not the second wafer of the MEMs cover structure during dicing of the MEMs structure.

    摘要翻译： 提供了MEM（微机电系统）结构。 在一个实施方式中，MEM结构包括：衬底晶片，其包括形成在衬底晶片的表面上的MEMs器件;以及覆盖形成在衬底晶片表面上的MEM器件的MEM盖结构。 所述MEM覆盖结构包括结合到第二晶片的第一晶片，其中只有所述MEM的覆盖结构的所述第一晶片被锯切穿过，而在所述MEM结构的切割期间，所述MEM的第二晶片不覆盖所述结构。

    X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging
    3.
    发明授权
    X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging 有权
    X-Y轴双质量音叉陀螺仪，具有垂直集成电子和晶片级密封包装

    公开(公告)号：US07621183B2

    公开(公告)日：2009-11-24

    申请号：US12026533

    申请日：2008-02-05

    申请人： Joseph Seeger ,  Steven S. Nasiri ,  Alexander Castro

    发明人： Joseph Seeger ,  Steven S. Nasiri ,  Alexander Castro

    IPC分类号： G01C19/00 ,  G01P9/04

    CPC分类号： G01C19/56 ,  G01C19/5712 ,  G01C19/5719 ,  G01C19/574

    摘要： An angular velocity sensor has two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame. In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer, a cap wafer and a reference wafer. In a further preferred embodiment, this assembly of wafers provides a hermetic barrier between the masses and an ambient environment.

    摘要翻译： 角速度传感器具有横向设置在X-Y平面中并间接连接到框架的两个质量块。 两个质量通过联动使得它们必须沿着相反方向移动。传感器绕Y轴的角速度可以通过将两个质量驱动为Z向反相振荡并测量角振荡幅度来感测 传给框架。 在优选实施例中，角速度传感器由体MEMS陀螺仪晶片，盖晶片和参考晶片制成。 在另一优选实施例中，晶片组件提供了质量和周围环境之间的密封屏障。

    X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging
    4.
    发明授权
    X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging 有权
    X-Y轴双质量音叉陀螺仪，具有垂直集成电子和晶片级密封包装

    公开(公告)号：US08069726B2

    公开(公告)日：2011-12-06

    申请号：US12621463

    申请日：2009-11-18

    申请人： Joseph Seeger ,  Steven S. Nasiri ,  Alexander Castro

    发明人： Joseph Seeger ,  Steven S. Nasiri ,  Alexander Castro

    IPC分类号： G01P9/04 ,  G01C19/00

    CPC分类号： G01C19/56 ,  G01C19/5712 ,  G01C19/5719 ,  G01C19/574

    摘要： An angular velocity sensor has two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame. In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer, a cap wafer and a reference wafer. In a further preferred embodiment, this assembly of wafers provides a hermetic barrier between the masses and an ambient environment.

    摘要翻译： 角速度传感器具有横向设置在X-Y平面中并间接连接到框架的两个质量块。 两个质量通过联动使得它们必须沿着相反方向移动。传感器绕Y轴的角速度可以通过将两个质量驱动为Z向反相振荡并测量角振荡幅度来感测 传给框架。 在优选实施例中，角速度传感器由体MEMS陀螺仪晶片，盖晶片和参考晶片制成。 在另一优选实施例中，晶片组件提供了质量和周围环境之间的密封屏障。

    Vertical integration of a MEMS structure with electronics in a hermetically sealed cavity
    6.
    发明授权
    Vertical integration of a MEMS structure with electronics in a hermetically sealed cavity 有权
    将MEMS结构与电子密封腔垂直集成在一起

    公开(公告)号：US07247246B2

    公开(公告)日：2007-07-24

    申请号：US10771135

    申请日：2004-02-02

    申请人： Steven S. Nasiri ,  Anthony Francis Flannery, Jr.

    发明人： Steven S. Nasiri ,  Anthony Francis Flannery, Jr.

    IPC分类号： C23F1/00

    CPC分类号： B81C1/00238 ,  B81B2201/0235 ,  B81C2201/019 ,  B81C2203/0118 ,  H01L2224/29011

    摘要： A wafer-scale fabrication method for providing MEMS assemblies having a MEMS subassembly sandwiched between and bonded to a cap and a base is provided. The MEMS subassembly includes at least one MEMS device element flexibly connected to the MEMS assembly. The vertical separation between the MEMS device element and an electrode on the base is lithographically defined. Precise control of this critical vertical gap dimension is thereby provided. Fabrication cost is greatly reduced by wafer scale integration.

    摘要翻译： 提供了一种用于提供MEMS组件的晶片级制造方法，所述MEMS组件具有夹在盖子和底座之间并结合到盖子和底座的MEMS子组件。 MEMS子组件包括至少一个柔性地连接到MEMS组件的MEMS器件元件。 MEMS器件元件与基底上的电极之间的垂直间隔是光刻的。 由此提供了该临界垂直间隙尺寸的精确控制。 晶圆规模集成大大降低了制造成本。

    Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging
    8.
    发明授权
    Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging 有权
    制造具有垂直集成电子元件和晶片级密封包装的X-Y轴双质量音叉陀螺仪的方法

    公开(公告)号：US06939473B2

    公开(公告)日：2005-09-06

    申请号：US10691472

    申请日：2003-10-20

    申请人： Steven S. Nasiri ,  Anthony Francis Flannery, Jr.

    发明人： Steven S. Nasiri ,  Anthony Francis Flannery, Jr.

    IPC分类号： G01C19/56 ,  H01L21/00

    CPC分类号： G01C19/5719

    摘要： A method for making an angular velocity sensor having two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame provided. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame. In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer, a cap wafer and a reference wafer. In a further preferred embodiment, this assembly wafers provides a hermetic barrier between the masses and an ambient environment.

    摘要翻译： 一种用于制造具有两个质量的角速度传感器的方法，其横向设置在X-Y平面中并间接地连接到设置的框架。 两个质量通过联动使得它们必须沿着相反方向移动。传感器绕Y轴的角速度可以通过将两个质量驱动成Z向反相振荡并测量角振荡幅度来感测 传给框架。 在优选实施例中，角速度传感器由体MEMS陀螺仪晶片，盖晶片和参考晶片制成。 在另一优选实施例中，该组装晶片提供了质量和周围环境之间的密封屏障。