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公开(公告)号：US07532318B2
公开(公告)日：2009-05-12
申请号：US11560477
申请日：2006-11-16
申请人： Steven W. Meeks , Rusmin Kudinar , William R. Wheeler , Hung Phi Nguyen , Vamsi Velidandla , Anoop Somanchi , Ronny Soetarman
发明人： Steven W. Meeks , Rusmin Kudinar , William R. Wheeler , Hung Phi Nguyen , Vamsi Velidandla , Anoop Somanchi , Ronny Soetarman
IPC分类号： G01N21/00
CPC分类号： G01N21/94 , G01B11/303 , G01B11/306 , G01N21/21 , G01N21/211 , G01N21/55 , G01N21/9501 , G01N21/9503 , G01N2021/556 , H01L22/12
摘要： In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a radial motor to move an optical head in a radial direction to detect defects at locations displaced from the edge of the wafer, and a rotational motor to rotate the optical head around the edge of the wafer to detect defects on the edge of the wafer.
摘要翻译： 在一个实施例中，使用单个工具测量晶片表面和晶片边缘上的缺陷的系统包括径向马达以沿径向方向移动光学头以检测从晶片边缘移位的位置处的缺陷 以及旋转电动机，用于围绕晶片的边缘旋转光学头以检测晶片边缘上的缺陷。
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公开(公告)号：US20070127016A1
公开(公告)日：2007-06-07
申请号：US11560477
申请日：2006-11-16
申请人： Steven Meeks , Rusmin Kudinar , William Wheeler , Hung Nguyen , Vamsi Velidandla , Anoop Somanchi , Ronny Soetarman
发明人： Steven Meeks , Rusmin Kudinar , William Wheeler , Hung Nguyen , Vamsi Velidandla , Anoop Somanchi , Ronny Soetarman
IPC分类号： G01N21/88
CPC分类号： G01N21/94 , G01B11/303 , G01B11/306 , G01N21/21 , G01N21/211 , G01N21/55 , G01N21/9501 , G01N21/9503 , G01N2021/556 , H01L22/12
摘要： In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a radial motor to move an optical head in a radial direction to detect defects at locations displaced from the edge of the wafer, and a rotational motor to rotate the optical head around the edge of the wafer to detect defects on the edge of the wafer.
摘要翻译： 在一个实施例中，使用单个工具测量晶片表面和晶片边缘上的缺陷的系统包括径向马达以沿径向方向移动光学头以检测从晶片边缘移位的位置处的缺陷 以及旋转电动机，用于围绕晶片的边缘旋转光学头以检测晶片边缘上的缺陷。
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公开(公告)号：US07161669B2
公开(公告)日：2007-01-09
申请号：US11365221
申请日：2006-03-01
IPC分类号： G01N21/88
CPC分类号： G01N21/94 , G01B11/303 , G01B11/306 , G01N21/21 , G01N21/211 , G01N21/55 , G01N21/9501 , G01N21/9503 , G01N2021/556 , H01L22/12
摘要： In one embodiment, a system to inspect an edge region of a wafer, comprises a surface analyzer assembly comprising a radiation targeting assembly that targets a radiation beam onto a surface of the wafer; a reflected radiation collection assembly to collect radiation reflected from a surface of the wafer; means for rotating the surface analyzer assembly about an edge surface of the wafer; and means for detecting one or more defects in the edge region of the wafer.
摘要翻译： 在一个实施例中，检查晶片的边缘区域的系统包括表面分析器组件，其包括将辐射束对准到晶片表面上的辐射瞄准组件; 用于收集从晶片表面反射的辐射的反射辐射收集组件; 用于使表面分析器组件围绕晶片的边缘表面旋转的装置; 以及用于检测晶片边缘区域中的一个或多个缺陷的装置。
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公开(公告)号：US20120327414A1
公开(公告)日：2012-12-27
申请号：US13494949
申请日：2012-06-12
申请人： James Jianguo Xu , Ken Kinsun Lee , Rusmin Kudinar , Ronny Soetarman , Hung Phi Nguyen , Zhen Hou
发明人： James Jianguo Xu , Ken Kinsun Lee , Rusmin Kudinar , Ronny Soetarman , Hung Phi Nguyen , Zhen Hou
CPC分类号： G01J3/2823 , G01J3/0208 , G01J3/0218 , G01N21/274 , G01N21/55 , G02B21/0092
摘要： A measurement system for monitoring an LED chip surface roughening process is described. A reflective illuminator can run reflectance measurements. A vertical positioning means can adjust a distance between an objective lens and an industrial sample. A horizontal positioning means can move objects in XY plane, and is specifically configured to hold the industrial sample and a reference sample. An optical sensor can acquire images of the industrial sample. A spectrometer can acquire reflectance spectrums of the industrial sample and the reference sample. A processor can control these components. The processor can perform deskew, and calculate an average reflectance and an oscillation amplitude from the reflectance spectrums of the industrial sample.
摘要翻译： 描述了一种用于监测LED芯片表面粗糙化工艺的测量系统。 反射照明器可以进行反射测量。 垂直定位装置可以调节物镜和工业样品之间的距离。 水平定位装置可以在XY平面中移动物体，并且被特别地配置成保持工业样品和参考样品。 光学传感器可以获取工业样品的图像。 光谱仪可以获得工业样品和参考样品的反射光谱。 处理器可以控制这些组件。 处理器可以进行偏斜校正，并从工业样品的反射光谱计算平均反射率和振荡幅度。
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公开(公告)号：US20120019626A1
公开(公告)日：2012-01-26
申请号：US13172686
申请日：2011-06-29
申请人： Zhen Hou , James Jianguo Xu , Ken Kinsun Lee , James Nelson Stainton , Hung Phi Nguyen , Rusmin Kudinar , Ronny Soetarman
发明人： Zhen Hou , James Jianguo Xu , Ken Kinsun Lee , James Nelson Stainton , Hung Phi Nguyen , Rusmin Kudinar , Ronny Soetarman
CPC分类号： G02B21/006 , G01N21/9501 , G01N21/956 , G01N2021/0168 , G02B21/0016 , G02B21/0028 , G02B21/0032 , G02B21/367 , G06T7/60 , G06T2207/10056 , G06T2207/10152 , G06T2207/20068 , G06T2207/30148
摘要： A three-dimensional (3D) microscope for patterned substrate measurement can include an objective lens, a reflected illuminator, a transmitted illuminator, a focusing adjustment device, an optical sensor, and a processor. The focusing adjustment device can automatically adjust the objective lens focus at a plurality of Z steps. The optical sensor can be capable of acquiring images at each of these Z steps. The processor can control the reflected illuminator, the transmitted illuminator, the focusing adjustment device, and the optical sensor. The processor can be configured to capture first and second images at multiple Z steps, the first image with the pattern using the reflected illuminator and the second image without the pattern using one of the reflected illuminator and the transmitted illuminator.
摘要翻译： 用于图案化衬底测量的三维（3D）显微镜可以包括物镜，反射照明器，透射照明器，聚焦调节装置，光学传感器和处理器。 聚焦调节装置可以在多个Z步骤自动调节物镜焦点。 光学传感器能够在这些Z步骤的每个步骤中获取图像。 处理器可以控制反射照明器，透射照明器，聚焦调节装置和光学传感器。 处理器可以被配置成以多个Z步骤捕获第一和第二图像，第一图像使用反射照明器的图案，而不使用反射照明器和透射照明器之一的图案的第二图像。
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公开(公告)号：US10048480B2
公开(公告)日：2018-08-14
申请号：US13333938
申请日：2011-12-21
申请人： James Jianguo Xu , Ken Kinsun Lee , Rusmin Kudinar , Ronny Soetarman , Hung Phi Nguyen , Zhen Hou
发明人： James Jianguo Xu , Ken Kinsun Lee , Rusmin Kudinar , Ronny Soetarman , Hung Phi Nguyen , Zhen Hou
摘要： A three-dimensional (3D) microscope includes various insertable components that facilitate multiple imaging and measurement capabilities. These capabilities include Nomarski imaging, polarized light imaging, quantitative differential interference contrast (q-DIC) imaging, motorized polarized light imaging, phase-shifting interferometry (PSI), and vertical-scanning interferometry (VSI).
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公开(公告)号：US08976366B2
公开(公告)日：2015-03-10
申请号：US13494949
申请日：2012-06-12
申请人： James Jianguo Xu , Ken Kinsun Lee , Rusmin Kudinar , Ronny Soetarman , Hung Phi Nguyen , Zhen Hou
发明人： James Jianguo Xu , Ken Kinsun Lee , Rusmin Kudinar , Ronny Soetarman , Hung Phi Nguyen , Zhen Hou
CPC分类号： G01J3/2823 , G01J3/0208 , G01J3/0218 , G01N21/274 , G01N21/55 , G02B21/0092
摘要： A measurement system for monitoring an LED chip surface roughening process is described. A reflective illuminator can run reflectance measurements. A vertical positioning means can adjust a distance between an objective lens and an industrial sample. A horizontal positioning means can move objects in XY plane, and is specifically configured to hold the industrial sample and a reference sample. An optical sensor can acquire images of the industrial sample. A spectrometer can acquire reflectance spectrums of the industrial sample and the reference sample. A processor can control these components. The processor can perform deskew, and calculate an average reflectance and an oscillation amplitude from the reflectance spectrums of the industrial sample.
摘要翻译： 描述了一种用于监测LED芯片表面粗糙化工艺的测量系统。 反射照明器可以进行反射测量。 垂直定位装置可以调节物镜和工业样品之间的距离。 水平定位装置可以在XY平面中移动物体，并且被特别地配置成保持工业样品和参考样品。 光学传感器可以获取工业样品的图像。 光谱仪可以获得工业样品和参考样品的反射光谱。 处理器可以控制这些组件。 处理器可以进行偏斜校正，并从工业样品的反射光谱计算平均反射率和振荡幅度。
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公开(公告)号：US09389408B2
公开(公告)日：2016-07-12
申请号：US13172686
申请日：2011-06-29
申请人： Zhen Hou , James Jianguo Xu , Ken Kinsun Lee , James Nelson Stainton , Hung Phi Nguyen , Rusmin Kudinar , Ronny Soetarman
发明人： Zhen Hou , James Jianguo Xu , Ken Kinsun Lee , James Nelson Stainton , Hung Phi Nguyen , Rusmin Kudinar , Ronny Soetarman
IPC分类号： H04N13/02 , G02B21/36 , G01N21/956
CPC分类号： G02B21/006 , G01N21/9501 , G01N21/956 , G01N2021/0168 , G02B21/0016 , G02B21/0028 , G02B21/0032 , G02B21/367 , G06T7/60 , G06T2207/10056 , G06T2207/10152 , G06T2207/20068 , G06T2207/30148
摘要： A three-dimensional (3D) microscope for patterned substrate measurement can include an objective lens, a reflected illuminator, a transmitted illuminator, a focusing adjustment device, an optical sensor, and a processor. The focusing adjustment device can automatically adjust the objective lens focus at a plurality of Z steps. The optical sensor can be capable of acquiring images at each of these Z steps. The processor can control the reflected illuminator, the transmitted illuminator, the focusing adjustment device, and the optical sensor. The processor can be configured to capture first and second images at multiple Z steps, the first image with the pattern using the reflected illuminator and the second image without the pattern using one of the reflected illuminator and the transmitted illuminator.
摘要翻译： 用于图案化衬底测量的三维（3D）显微镜可以包括物镜，反射照明器，透射照明器，聚焦调节装置，光学传感器和处理器。 聚焦调节装置可以在多个Z步骤自动调节物镜焦点。 光学传感器能够在这些Z步骤的每个步骤中获取图像。 处理器可以控制反射照明器，透射照明器，聚焦调节装置和光学传感器。 处理器可以被配置成以多个Z步骤捕获第一和第二图像，第一图像使用反射照明器的图案，而不使用反射照明器和透射照明器之一的图案的第二图像。
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9.发明申请3D Microscope Including Insertable Components To Provide Multiple Imaging And Measurement Capabilities 审中-公开包括可插入组件的3D显微镜，以提供多种成像和测量能力公开(公告)号：US20120176475A1
公开(公告)日：2012-07-12
申请号：US13333938
申请日：2011-12-21
申请人： James Jianguo Xu , Ken Kinsun Lee , Rusmin Kudinar , Ronny Soetarman , Hung Phi Nguyen , Zhen Hou
发明人： James Jianguo Xu , Ken Kinsun Lee , Rusmin Kudinar , Ronny Soetarman , Hung Phi Nguyen , Zhen Hou
CPC分类号： G02B21/06 , G02B21/0092 , G02B21/367
摘要： A three-dimensional (3D) microscope includes various insertable components that facilitate multiple imaging and measurement capabilities. These capabilities include Nomarski imaging, polarized light imaging, quantitative differential interference contrast (q-DIC) imaging, motorized polarized light imaging, phase-shifting interferometry (PSI), and vertical-scanning interferometry (VSI).
摘要翻译： 三维（3D）显微镜包括各种可插入的部件，便于多个成像和测量功能。 这些功能包括Nomarski成像，偏振光成像，定量微分干涉对比度（q-DIC）成像，电动偏振光成像，移相干涉测量（PSI）和垂直扫描干涉测量（VSI）。
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公开(公告)号：US20060250611A1
公开(公告)日：2006-11-09
申请号：US11365221
申请日：2006-03-01
IPC分类号： G01N21/88
CPC分类号： G01N21/94 , G01B11/303 , G01B11/306 , G01N21/21 , G01N21/211 , G01N21/55 , G01N21/9501 , G01N21/9503 , G01N2021/556 , H01L22/12
摘要： In one embodiment, a system to inspect an edge region of a wafer, comprises a surface analyzer assembly comprising a radiation targeting assembly that targets a radiation beam onto a surface of the wafer; a reflected radiation collection assembly to collect radiation reflected from a surface of the wafer; means for rotating the surface analyzer assembly about an edge surface of the wafer; and means for detecting one or more defects in the edge region of the wafer.
摘要翻译： 在一个实施例中，检查晶片的边缘区域的系统包括表面分析器组件，其包括将辐射束对准到晶片表面上的辐射瞄准组件; 用于收集从晶片表面反射的辐射的反射辐射收集组件; 用于使表面分析器组件围绕晶片的边缘表面旋转的装置; 以及用于检测晶片边缘区域中的一个或多个缺陷的装置。
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