Wafer edge inspection
    2.
    发明申请
    Wafer edge inspection 有权
    晶圆边缘检查

    公开(公告)号:US20060250611A1

    公开(公告)日:2006-11-09

    申请号:US11365221

    申请日:2006-03-01

    IPC分类号: G01N21/88

    摘要: In one embodiment, a system to inspect an edge region of a wafer, comprises a surface analyzer assembly comprising a radiation targeting assembly that targets a radiation beam onto a surface of the wafer; a reflected radiation collection assembly to collect radiation reflected from a surface of the wafer; means for rotating the surface analyzer assembly about an edge surface of the wafer; and means for detecting one or more defects in the edge region of the wafer.

    摘要翻译: 在一个实施例中,检查晶片的边缘区域的系统包括表面分析器组件,其包括将辐射束对准到晶片表面上的辐射瞄准组件; 用于收集从晶片表面反射的辐射的反射辐射收集组件; 用于使表面分析器组件围绕晶片的边缘表​​面旋转的装置; 以及用于检测晶片边缘区域中的一个或多个缺陷的装置。

    Servo pattern characterization on magnetic disks
    6.
    发明申请
    Servo pattern characterization on magnetic disks 失效
    磁盘上的伺服模式表征

    公开(公告)号:US20060215289A1

    公开(公告)日:2006-09-28

    申请号:US11432609

    申请日:2006-05-11

    IPC分类号: G11B5/02 G11B5/596

    CPC分类号: G11B5/59627

    摘要: In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target radiation onto a surface, a reflected radiation collecting assembly that collects radiation reflected from the surface, and a signal processing module. The signal processing module generates an image of magnetic characteristics of the magnetic disk, wherein the image comprises a plurality of servo sector arcs, locates a sample of points on a plurality of the servo sector arcs, fits a circle to the sample of points on each of the plurality of servo sector arcs, and determines at least one pivot-to-gap measurement from the radius of the circles.

    摘要翻译: 在一个实施例中,表面分析器系统包括将辐射瞄准到表面上的辐射瞄准组件,收集从表面反射的辐射的反射辐射收集组件和信号处理模块。 信号处理模块生成磁盘的磁特性的图像,其中图像包括多个伺服扇区弧,定位多个伺服扇区弧上的点样本,将圆适合于每个点上的点样本 并且从圆的半径确定至少一个枢轴对间隙测量。

    Surface inspection tool
    8.
    发明授权
    Surface inspection tool 失效
    表面检测工具

    公开(公告)号:US06704435B1

    公开(公告)日:2004-03-09

    申请号:US08841214

    申请日:1997-04-28

    IPC分类号: G06K900

    CPC分类号: G01N21/9506

    摘要: A laser based inspection tool (LIT) for inspecting planar surfaces is described. In a preferred embodiment the LIT can simultaneously inspect both planar surfaces of disks for use in disk drives. In one embodiment of the invention, the incident beam is directed onto the surface to be inspected at an angle slightly offset from perpendicular so that the reflected beam is physically separated from the incident beam. The reflected beam is routed to a detector which converts the intensity of the reflected into an analog signal. The analog signal is sampled and digitized to generate pixel data stored in a buffer. Various analyses are performed on the data including calculating a rate of change in the pixel data. If the rate of change in the pixel data exceeds a selected threshold that indicates a possible defect if it occurs in the data area of the disk.

    摘要翻译: 描述了一种用于检查平面的激光检测工具(LIT)。 在优选实施例中,LIT可以同时检查用于磁盘驱动器的磁盘的两个平面表面。 在本发明的一个实施例中,入射光束以与垂直稍微偏移的角度被引导到待检查的表面上,使得反射光束与入射光束物理分离。 反射光束被路由到检测器,该检测器将反射的强度转换成模拟信号。 模拟信号被采样和数字化以产生存储在缓冲器中的像素数据。 对包括计算像素数据的变化率的数据进行各种分析。 如果像素数据的变化率超过选择的阈值,如果在磁盘的数据区域中发生可能的缺陷则表示可能的缺陷。

    Detecting and classifying surface features or defects by controlling the angle of the illumination plane of incidence with respect to the feature or defect
    9.
    发明申请
    Detecting and classifying surface features or defects by controlling the angle of the illumination plane of incidence with respect to the feature or defect 失效
    通过控制相对于特征或缺陷的入射照明平面的角度来检测和分类表面特征或缺陷

    公开(公告)号:US20060250612A1

    公开(公告)日:2006-11-09

    申请号:US11485798

    申请日:2006-07-13

    申请人: Steven Meeks

    发明人: Steven Meeks

    IPC分类号: G01N21/88

    摘要: Scratches, pits and particles which are smaller or larger than the beam size may be measured and identified by a single and dual multiple beam techniques. In one embodiment, this the invention uses a pair of orthogonally oriented white light beams, one in the radial and one in the circumferential direction. The scattered light from the radial and circumferential beams allows the detection and classification of particles, pits and scratches. In other embodiments, single beam techniques are used to classify radial and circumferential defects.

    摘要翻译: 小于或大于光束尺寸的划痕,凹坑和颗粒可以通过单和双重多光束技术来测量和识别。 在一个实施例中,本发明使用一对正交定向的白光束,一个在径向上,一个在圆周方向上。 来自径向和圆周光束的散射光允许检测和分类颗粒,凹坑和划痕。 在其他实施例中,使用单光束技术对径向和周向缺陷进行分类。