Adhesive formulation comprising lignin

    公开(公告)号:US11981838B2

    公开(公告)日:2024-05-14

    申请号:US17048715

    申请日:2019-04-16

    Applicant: Stora Enso OYJ

    CPC classification number: C09J197/005 C08H6/00 C08L97/02 C09J161/06

    Abstract: The present invention relates to an adhesive formulation comprising lignin, suitable for use in the manufacture of for example wood products. The lignin is provided in the form of a solution or dispersion or in dry solid form, such as in the form of a powder. The adhesive formulation also comprises phenol-formaldehyde (PF) resin and/or lignin-phenol-formaldehyde (LPF) resin. The adhesive formulation may also comprise extenders, hardeners, fillers and other additives, to achieve an adhesive formulation useful in the manufacture of for example wood products, such as plywood and laminated veneer lumber (LVL). The adhesive formulation can also be used in the manufacture of laminates and oriented strand boards.

    USE OF BONDING RESIN
    2.
    发明申请

    公开(公告)号:US20220259466A1

    公开(公告)日:2022-08-18

    申请号:US17610856

    申请日:2020-05-13

    Applicant: Stora Enso OYJ

    Abstract: The present invention relates to the use of a bonding resin prepared by providing an aqueous solution comprising at least one biobased product selected from tannin, starch, soy protein, glycerol, chitin, pectin, dextrose or other carbohydrates, or a mixture thereof and mixing the aqueous solution with one or more of certain crosslinkers such as ethers, and optionally one or more additives. The bonding resin is used in the manufacture of laminates, mineral wool insulation or wood products, such as engineered wood products, such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF) or particle boards. Preferably, the bonding resin does not comprise lignin.

    PROCESS FOR THE PREPARATION OF A BONDING RESIN

    公开(公告)号:US20230002654A1

    公开(公告)日:2023-01-05

    申请号:US17757258

    申请日:2020-12-16

    Applicant: Stora Enso OYJ

    Abstract: The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of a solution in ammonia and/or an organic base and mixed with one or more crosslinkers and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards. The bonding resin is also useful for example in composites, molding compounds and foundry applications.

    ADHESIVE FORMULATION COMPRISING LIGNIN

    公开(公告)号:US20210238464A1

    公开(公告)日:2021-08-05

    申请号:US17048715

    申请日:2019-04-16

    Applicant: Stora Enso OYJ

    Abstract: The present invention relates to an adhesive formulation comprising lignin, suitable for use in the manufacture of for example wood products. The lignin is provided in the form of a solution or dispersion or in dry solid form, such as in the form of a powder. The adhesive formulation also comprises phenol-formaldehyde (PF) resin and/or lignin-phenol-formaldehyde (LPF) resin. The adhesive formulation may also comprise extenders, hardeners, fillers and other additives, to achieve an adhesive formulation useful in the manufacture of for example wood products, such as plywood and laminated veneer lumber (LVL). The adhesive formulation can also be used in the manufacture of laminates and oriented strand boards.

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