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    Process for preparing a bonding resin
    1.
    发明授权
    Process for preparing a bonding resin 有权

    公开(公告)号：US12163064B2

    公开(公告)日：2024-12-10

    申请号：US17059590

    申请日：2019-06-28

    Applicant: Stora Enso OYJ

    Inventor： Ben Nasli Bakir ,  Staffan Torssell ,  Lars Hjelm ,  Li Jansson ,  Huynh Tram Anh Pham ,  Ashar Zafar

    IPC: C09J197/00 ,  B27N3/00 ,  B27N3/02 ,  B27N3/04 ,  C08K5/1515

    Abstract: The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of an aqueous solution and mixed with one or more of glycerol diglycidyl ether, polyglycerol diglycidyl ether, polyglycerol polyglycidyl ether, glycerol triglycidyl ether, sorbitol polyglycidyl ether, alkoxylated glycerol polyglycidyl ether, trimethylolpropane triglycidyl ether, trimethylolpropane diglycidyl ether, polyoxy propylene glycol diglycidylether, polyoxypropylene glycol triglycidyl ether, diglycidylether of cyclohexane dimethanol, resorcinol diglycidyl ether, isosorbide diglycidyl ether, pentaerythritol tetraglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether having 2-9 ethylene glycol units, propylene glycol diglycidyl ether having 1-5 propylene glycol units, and/or diglycidyl ether of terminal diol having a linear carbon chain of 3-6 carbon atoms; and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated vencer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards.

    Adhesive formulation comprising lignin
    2.
    发明授权
    Adhesive formulation comprising lignin 有权

    公开(公告)号：US11981838B2

    公开(公告)日：2024-05-14

    申请号：US17048715

    申请日：2019-04-16

    Applicant: Stora Enso OYJ

    Inventor： Ben Nasli Bakir ,  Ashar Zafar ,  Jesper Ekström

    IPC: C09J197/00 ,  C08H7/00 ,  C08L97/02 ,  C09J161/06

    CPC classification number: C09J197/005 ,  C08H6/00 ,  C08L97/02 ,  C09J161/06

    Abstract: The present invention relates to an adhesive formulation comprising lignin, suitable for use in the manufacture of for example wood products. The lignin is provided in the form of a solution or dispersion or in dry solid form, such as in the form of a powder. The adhesive formulation also comprises phenol-formaldehyde (PF) resin and/or lignin-phenol-formaldehyde (LPF) resin. The adhesive formulation may also comprise extenders, hardeners, fillers and other additives, to achieve an adhesive formulation useful in the manufacture of for example wood products, such as plywood and laminated veneer lumber (LVL). The adhesive formulation can also be used in the manufacture of laminates and oriented strand boards.

    USE OF BONDING RESIN
    3.
    发明申请
    USE OF BONDING RESIN 有权

    公开(公告)号：US20220259466A1

    公开(公告)日：2022-08-18

    申请号：US17610856

    申请日：2020-05-13

    Applicant: Stora Enso OYJ

    Inventor： Ben Nasli Bakir ,  Ashar Zafar ,  Jesper Ekström

    IPC: C09J103/02 ,  C09J105/06 ,  C09J105/08 ,  C09J189/00 ,  C09J163/00 ,  B32B21/04 ,  B32B7/12 ,  B27D1/04

    Abstract: The present invention relates to the use of a bonding resin prepared by providing an aqueous solution comprising at least one biobased product selected from tannin, starch, soy protein, glycerol, chitin, pectin, dextrose or other carbohydrates, or a mixture thereof and mixing the aqueous solution with one or more of certain crosslinkers such as ethers, and optionally one or more additives. The bonding resin is used in the manufacture of laminates, mineral wool insulation or wood products, such as engineered wood products, such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF) or particle boards. Preferably, the bonding resin does not comprise lignin.

    PROCESS FOR THE PREPARATION OF A BONDING RESIN
    10.
    发明申请
    PROCESS FOR THE PREPARATION OF A BONDING RESIN 有权

    公开(公告)号：US20250051623A1

    公开(公告)日：2025-02-13

    申请号：US18717644

    申请日：2022-12-19

    Applicant: Stora Enso OYJ

    Inventor： Ashar Zafar ,  David Almqvist ,  Dimitri Areskogh ,  Huynh Tram Anh Pham

    IPC: C09J197/00 ,  B32B5/02 ,  B32B21/02 ,  C09J5/00 ,  C09J11/04

    Abstract: The present invention relates to a bonding resin useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiber-boards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards. The bonding resin is also useful for example in composites, molding compounds and foundry applications. The invention also relates to a method for preparing the bonding resin. The bonding resin comprises an aqueous solution comprising lignin and/or tannin and ammonia and/or an organic base and hydroxymethylfurfural, furfural, furfuryl alcohol, acetoxy methyl furfural or an oligomer of hydroxy methylfurfural or a combination thereof and optionally one or more crosslinker and optionally one or more additives.

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