公开(公告)号：US06179631B2

公开(公告)日：2001-01-30

申请号：US08975892

申请日：1997-11-21

申请人： Stuart D. Downes ,  Leonard A. Merrill

发明人： Stuart D. Downes ,  Leonard A. Merrill

IPC分类号： H01R1340

CPC分类号： H01R43/0256 ,  H01R12/58 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10871 ,  H05K2203/0415

摘要： An electrical contact that is mounted on a printed circuit board to provide an electrical connection to the printed circuit board. The contact has the structural integrity of a through-hole component with the capability of being soldered to the circuit board using a surface mount reflow process. The contact includes a pair of elongated, conductive pins with a base disposed therebetween, and a solder preform supported on one of the conductive pins adjacent the base. The pin supporting the solder preform is insertable into a plated-through hole on the circuit board so that the solder preform can be reflowed into the hole along the pin to form a solder joint between the contact and the hole. The contact may include a retainer to secure the solder preform to the pin and the end of the base adjacent the pin may be beveled to facilitate gas ventilation from the hole during the soldering process. The base may be configured so that it can be grasped with a test instrument or support a wire connection to the contact. The contact may be symmetrical so that the solder preform can be supported on either conductive pin.

摘要翻译： 安装在印刷电路板上以提供到印刷电路板的电连接的电触点。 该接触件具有通过使用表面安装回流工艺将电极焊接到电路板的能力的通孔部件的结构完整性。 接触件包括一对细长的导电销，其中设置有基部，并且支撑在与基座相邻的导电销之一上的焊料预制件。 支撑焊料预成型件的销可插入到电路板上的电镀通孔中，使得焊料预成型件可以沿着销回流到孔中，以在接触件和孔之间形成焊接接头。 触点可以包括用于将焊料预制件固定到销的保持器，并且邻近销的基座的端部可以被倾斜以便于在焊接过程期间从孔中进行气体通风。 基座可以被配置为使得其可以用测试仪器抓住或支撑与触点的电线连接。 触点可以是对称的，使得焊料预制件可以被支撑在任一导电引脚上。

公开(公告)号：US5589669A

公开(公告)日：1996-12-31

申请号：US579773

申请日：1995-12-28

申请人： Stuart D. Downes ,  Leonard A. Merrill

发明人： Stuart D. Downes ,  Leonard A. Merrill

IPC分类号： H01R12/58 ,  H05K3/30 ,  H05K1/02

CPC分类号： H01R12/58 ,  H05K3/308

摘要： An electrical pin contact for mounting on a printed circuit board to provide an electrical interconnection to the printed circuit board. The contact includes an elongated, conductive pin, and a base attached to one end of the pin. The base has a triangular cross-section with vertices that engage a plate-through hole to support the contact in the plated-through hole during a soldering process. The contact may include a flange or stops to support the contact on a printed circuit board. The contact may also include a tail extending from the base opposite the pin.

摘要翻译： 用于安装在印刷电路板上以提供与印刷电路板的电互连的电引脚触头。 触点包括细长的导电销和附接到销的一端的基座。 基座具有三角形横截面，其顶点与焊接过程中的通孔相通，以支撑电镀通孔中的接触。 触点可以包括用于支撑印刷电路板上的触点的凸缘或止动件。 触点还可以包括从引脚相对的底部延伸的尾部。

公开(公告)号：US07457118B1

公开(公告)日：2008-11-25

申请号：US10740990

申请日：2003-12-19

申请人： F. William French ,  Leonard A. Merrill

发明人： F. William French ,  Leonard A. Merrill

IPC分类号： H05K7/20

CPC分类号： H05K7/20936

摘要： A heat dissipation apparatus includes a heat absorption device coupled to a board, the heat absorption device configured to absorb heat generated by an electrical device mounted on the board, a heat dispersion device configured discretely from the heat absorbing device and the board for dispersing heat input thereto and a heat transporting device coupled between the heat absorption device and the heat dispersion device for transporting heat absorbed by the heat absorption device to the heat dispersion device.

摘要翻译： 散热装置包括耦合到板的吸热装置，所述吸热装置被配置为吸收由安装在所述板上的电气装置产生的热量，从所述吸热装置离散地配置的散热装置和用于分散热输入的所述板 以及耦合在吸热装置和散热装置之间的传热装置，用于将由吸热装置吸收的热量传送到散热装置。