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1.发明授权公开(公告)号：US06773269B1
公开(公告)日：2004-08-10
申请号：US10259053
申请日：2002-09-27
申请人： Stuart D. Downes
发明人： Stuart D. Downes
IPC分类号： H01R1200
CPC分类号： H01R12/523 , H01R43/0256 , H01R43/0263 , H05K3/3447 , H05K3/368 , H05K13/028 , H05K2201/10303 , H05K2201/10424
摘要： A pin assembly is configured to interconnect a first circuit board and a second circuit board. The pin assembly includes a set of pins. Each pin of the set of pins has a first end, a second end, and a mid-portion. The pin assembly further includes a frame which contacts the mid-portion of each pin of the set of pins to position the pins such that (i) the first ends of the pins simultaneously register into respective holes of the first circuit board when the pin assembly engages with the first circuit board, and (ii) the second ends of the pins simultaneously register into respective holes of the second circuit board when the pin assembly engages with the second circuit board.
摘要翻译： 销组件被配置为互连第一电路板和第二电路板。 销组件包括一组销。 该组销的每个销具有第一端，第二端和中间部分。 销组件还包括框架，该框架接触该组销的每个销的中间部分以定位销，使得（i）当销组件（1）的销组件中时，销的第一端部同时登记到第一电路板的相应孔中 与第一电路板接合，并且（ii）当销组件与第二电路板接合时，引脚的第二端同时寄存在第二电路板的相应孔中。
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2.发明授权公开(公告)号：US06736308B1
公开(公告)日：2004-05-18
申请号：US10083195
申请日：2002-02-26
申请人： Stuart D. Downes
发明人： Stuart D. Downes
IPC分类号： B23K3102
CPC分类号： B23K3/0638 , H05K3/3436 , H05K3/3484 , H05K2201/0949 , H05K2201/10734 , H05K2203/0545 , Y02P70/613
摘要： The invention is directed to techniques for distributing solder paste using a tool that defines a solder paste aperture having a non-circular cross-sectional shape. When the non-circular shape coincides with a pad and at least a portion of a stringer leading to the pad during a solder paste distribution process, solder paste is deposited over the pad and the stringer portion. Since solder paste now resides on the stringer portion, solder is not drawn from the pad toward the stringer portion during the soldering process as with some conventional situations. Rather, solder within the solder paste that resides on the stringer portion tends to adhere to the stringer portion, while some of the solder volume over the stringer pulls back to join the solder over the pad due to surface tension of the solder. The end result is a robust solder joint between the pad and corresponding component contact. Furthermore, the non-circular shape of the aperture allows for apertures that are larger in size than apertures for stencils that do not implement conventional overprinting approaches thus reducing the likelihood of clogging. One arrangement of the invention is directed to a solder paste distribution system having a base, a tool holder coupled to the base, and a solder paste distribution tool coupled to the tool holder. The solder paste distribution tool includes a support member that couples to the tool holder, a distribution member that defines a solder paste aperture having a non-circular cross-sectional shape, and a fastener that secures the distribution member to the support member.
摘要翻译： 本发明涉及使用限定具有非圆形横截面形状的焊膏孔的工具来分配焊膏的技术。 当非圆形形状与焊盘和在焊膏分配过程中通向焊盘的桁条的至少一部分重合时，焊膏沉积在焊盘和桁条部分上。 由于焊膏现在位于纵梁部分上，因此在焊接过程中焊料不会从焊盘朝向纵梁部分拉出，如同一些常规情况。 相反，驻留在纵梁部分的焊膏中的焊料倾向于粘附到纵梁部分，同时由于焊料的表面张力，在纵梁上方的焊料体积中的一些焊料体积回拉以将焊料焊接在焊盘上。 最终结果是焊盘和相应的部件接触之间的牢固的焊接接头。 此外，孔的非圆形形状允许尺寸大于不实施常规套印方法的模板的孔的孔，从而降低堵塞的可能性。 本发明的一种布置涉及一种焊膏分配系统，其具有底座，连接到基座的工具架以及耦合到工具架的焊膏分配工具。 焊膏分配工具包括耦合到工具架的支撑构件，限定具有非圆形横截面形状的焊膏孔的分配构件和将分配构件固定到支撑构件的紧固件。
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公开(公告)号：US06179631B2
公开(公告)日：2001-01-30
申请号：US08975892
申请日：1997-11-21
IPC分类号： H01R1340
CPC分类号： H01R43/0256 , H01R12/58 , H05K3/3447 , H05K2201/10303 , H05K2201/10871 , H05K2203/0415
摘要： An electrical contact that is mounted on a printed circuit board to provide an electrical connection to the printed circuit board. The contact has the structural integrity of a through-hole component with the capability of being soldered to the circuit board using a surface mount reflow process. The contact includes a pair of elongated, conductive pins with a base disposed therebetween, and a solder preform supported on one of the conductive pins adjacent the base. The pin supporting the solder preform is insertable into a plated-through hole on the circuit board so that the solder preform can be reflowed into the hole along the pin to form a solder joint between the contact and the hole. The contact may include a retainer to secure the solder preform to the pin and the end of the base adjacent the pin may be beveled to facilitate gas ventilation from the hole during the soldering process. The base may be configured so that it can be grasped with a test instrument or support a wire connection to the contact. The contact may be symmetrical so that the solder preform can be supported on either conductive pin.
摘要翻译： 安装在印刷电路板上以提供到印刷电路板的电连接的电触点。 该接触件具有通过使用表面安装回流工艺将电极焊接到电路板的能力的通孔部件的结构完整性。 接触件包括一对细长的导电销，其中设置有基部，并且支撑在与基座相邻的导电销之一上的焊料预制件。 支撑焊料预成型件的销可插入到电路板上的电镀通孔中，使得焊料预成型件可以沿着销回流到孔中，以在接触件和孔之间形成焊接接头。 触点可以包括用于将焊料预制件固定到销的保持器，并且邻近销的基座的端部可以被倾斜以便于在焊接过程期间从孔中进行气体通风。 基座可以被配置为使得其可以用测试仪器抓住或支撑与触点的电线连接。 触点可以是对称的，使得焊料预制件可以被支撑在任一导电引脚上。
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公开(公告)号：US07159758B1
公开(公告)日：2007-01-09
申请号：US10607400
申请日：2003-06-26
申请人： Stuart D. Downes , Larry Norris , Jin Liang
发明人： Stuart D. Downes , Larry Norris , Jin Liang
IPC分类号： B23K31/02
CPC分类号： B23K1/0016 , H05K3/1216 , H05K3/26 , H05K3/3484 , H05K2203/043 , H05K2203/0545
摘要： A circuit board processing system has a circuit board fabrication stage configured to fabricate a circuit board having a set of circuit board pads, and a solder fusing stage coupled to the circuit board fabrication stage. The solder fusing stage is configured to (i) apply flux and solder concurrently to the set of circuit board pads, and (ii) activate the flux and melt the solder to form a set of substantially flat solder coatings which is fused to the set of circuit board pads. The circuit board processing system further includes a washing stage coupled to the solder fusing stage. The washing stage is configured to remove contamination from a surface of the circuit board having the circuit board pads and from the set of substantially flat solder coatings which is fused to the set of circuit board pads. Such a system is well-suited for lead-free solder.
摘要翻译： 电路板处理系统具有电路板制造台，其被配置为制造具有一组电路板焊盘的电路板，以及耦合到电路板制造阶段的焊料熔合级。 焊料熔合阶段被配置为（i）同时向该组电路板焊盘施加焊剂和焊料，以及（ii）激活焊剂并熔化焊料以形成一组基本上平坦的焊料涂层，其熔合到该组焊接 电路板垫。 电路板处理系统还包括耦合到焊料熔合级的洗涤级。 洗涤阶段被配置为从具有电路板焊盘的电路板的表面以及熔融到该组电路板焊盘的一组基本上平坦的焊料涂层去除污染物。 这种系统非常适合无铅焊料。
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公开(公告)号：US07155821B1
公开(公告)日：2007-01-02
申请号：US10881588
申请日：2004-06-30
IPC分类号： H01K3/10
CPC分类号： H05K3/0047 , H05K1/112 , H05K1/115 , H05K3/3421 , H05K3/3478 , H05K3/421 , H05K3/429 , H05K2201/09472 , H05K2201/09518 , H05K2201/09827 , H05K2201/09845 , H05K2203/0207 , H05K2203/041 , Y10T29/49117 , Y10T29/49147 , Y10T29/49149 , Y10T29/49165
摘要： A technique for manufacturing a circuit board involves obtaining a plane-shaped structure having layers of circuit board material integrated together, and carving a hole within the plane-shaped structure (e.g., using a single countersinking drill bit). The carved hole includes an inner portion having a substantially uniform inner portion diameter and a connecting portion disposed between the inner portion and an outer surface of the plane-shaped structure. At least part of the connecting portion has a diameter which is larger than the substantially uniform inner portion diameter of the inner portion to improve access to the inner portion. The technique further involves performing a plating process on the plane-shaped structure to provide plating over the hole carved within the plane-shaped structure. The provided plating forms a countersunk via which provides an electrical pathway from the outer surface of the plane-shaped structure to an internal circuit board trace.
摘要翻译： 一种用于制造电路板的技术包括获得具有集成在一起的电路板材料层的平面形结构，并且在平面形结构内雕刻一个孔（例如，使用单个锪孔钻头）。 雕刻孔包括具有基本上均匀的内部部分直径的内部部分和设置在平面状结构的内部部分和外表面之间的连接部分。 连接部分的至少一部分具有比内部部分的基本上均匀的内部部分直径大的直径，以改善对内部部分的通路。 该技术还涉及对平面形状的结构进行电镀处理，以在平面形状的结构内雕刻的孔上提供电镀。 所提供的电镀形成沉头孔，通过该埋头孔提供从平面形结构的外表面到内部电路板迹线的电路。
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公开(公告)号：US07084353B1
公开(公告)日：2006-08-01
申请号：US10316286
申请日：2002-12-11
申请人： Stuart D. Downes
发明人： Stuart D. Downes
IPC分类号： H01R12/04
CPC分类号： H05K3/3442 , H05K1/111 , H05K2201/09381 , H05K2201/10636 , H05K2203/048 , Y02P70/611 , Y02P70/613
摘要： A circuit board has a layer of non-conductive material, and a set of soldering pads disposed on the layer of non-conductive material. The set of soldering pads defines a common axis that extends substantially through a midline of each soldering pad. Each soldering pad has, as measured perpendicularly through the common axis, an inner width, a first edge width and a second edge width. The inner width is longer than each of the first and second edge widths. Additionally, the first edge width is longer than the second edge width. Accordingly, the pads have less corner spaces that could otherwise, with melted solder, draw a circuit board component into an incorrect orientation which would result in incorrect mounting of the component. As a result, the component terminals tend to be drawn toward central regions of each pad for robust and reliable solder joint formation.
摘要翻译： 电路板具有非导电材料层和设置在非导电材料层上的一组焊盘。 该组焊盘限定了基本上穿过每个焊盘中线的公共轴线。 每个焊盘具有垂直于公共轴线测量的内部宽度，第一边缘宽度和第二边缘宽度。 内部宽度比第一和第二边缘宽度中的每一个长。 此外，第一边缘宽度比第二边缘宽度长。 因此，焊盘具有较少的拐角空间，否则可能会熔化的焊料将电路板部件拉到不正确的方位，导致组件的错误安装。 结果，元件端子倾向于被拉向每个焊盘的中心区域，用于牢固且可靠的焊点形成。
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公开(公告)号：US6084397A
公开(公告)日：2000-07-04
申请号：US995675
申请日：1997-12-22
申请人： Stuart D. Downes
发明人： Stuart D. Downes
CPC分类号： G01R35/00
摘要： A verification gauge for verifying the operation of an inspection system for inspecting the leads of an electronic package, particularly a ball grid array. The gauge has a predetermined mechanical relationship to a mechanical parameter of the leads of the electronic package so that when the inspection system is used to inspect the gauge, a reading will indicate whether the inspection system is properly set up for the mechanical parameter. The gauge may be configured to substantially emulate the structural configuration, including the particular size, shape and lead pattern, of the electronic package. The gauge may be used to verify the calibration or the predefined limit of the inspection system for the mechanical parameter, including lead coplanarity, lead pitch, missing lead and lead deformation parameters.
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公开(公告)号：US07416106B1
公开(公告)日：2008-08-26
申请号：US10674080
申请日：2003-09-29
申请人： Stuart D. Downes , Jin Liang , Larry Norris
发明人： Stuart D. Downes , Jin Liang , Larry Norris
IPC分类号： B23K31/02
CPC分类号： B23K1/0016 , B23K2101/40 , B23K2101/42 , H05K1/111 , H05K3/3442 , H05K3/3452 , H05K2201/09381 , H05K2201/0939 , H05K2201/099 , H05K2201/10636 , Y02P70/611 , Y02P70/613
摘要： A technique for processing a circuit board involves placing a mask layer on the circuit board, where the mask layer defines a set of pad profiles for a component mounting location. Each pad profile has a set of rounded corners. The technique further involves forming, for each pad profile, a soldering pad having a set of radii corresponding to the set of rounded corners of that pad profile to create a set of soldering pads for the component mounting location. Each soldering pad is configured for a high bond strength solder joint. The technique further involves removing the mask layer from the circuit board and soldering a component to the component mounting location. This technique is well-suited for robustly mounting the component to the circuit board at solder joints with relatively high solder joint bond strengths.
摘要翻译： 一种用于处理电路板的技术包括将掩模层放置在电路板上，其中掩模层限定用于部件安装位置的一组焊盘轮廓。 每个垫子轮廓都有一组圆角。 该技术还涉及为每个焊盘型材形成具有与该焊盘型材的一组圆角对应的一组半径的焊盘，以形成用于部件安装位置的一组焊盘。 每个焊盘都配置为高粘结强度的焊点。 该技术还包括从电路板去除掩模层并将部件焊接到部件安装位置。 这种技术非常适合在具有相对高的焊点接合强度的焊点处牢固地将部件安装到电路板上。
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公开(公告)号：US06478604B1
公开(公告)日：2002-11-12
申请号：US09879269
申请日：2001-06-12
IPC分类号： H01R1120
CPC分类号： H01R12/675
摘要： A ribbon cable assembly includes a segment of ribbon cable having first and second ends, a first IDC connector mounted to the first end of the ribbon cable segment, and a second IDC connector mounted to the second end of the ribbon cable segment. Each connector includes a connector housing, and a set of terminals supported by the connector housing. Each terminal has a base portion (e.g., a pin, a pad, etc.) for coupling to an external device, and a cable attachment portion which is unitary with the base portion of that terminal. The cable attachment portion of each terminal defines (i) a slot that receives a wire, and (ii) wire positioners that position the wire within the slot when the slot receives the wire. The wire positioners of each terminal can precisely locate a wire within that terminal. The wire positioners facilitate wire retention and improve electrical connectivity thus providing a reliable electrical pathway between the wire and that terminal.
摘要翻译： 带状电缆组件包括具有第一和第二端的带状电缆的段，安装到带状电缆段的第一端的第一IDC连接器和安装到带状电缆段的第二端的第二IDC连接器。 每个连接器包括连接器壳体和由连接器壳体支撑的一组端子。 每个端子具有用于联接到外部装置的基部（例如，销，垫等）和与该端子的基部一体的电缆连接部分。 每个端子的电缆连接部分限定（i）接收线的槽，和（ii）当槽接收线时将线定位在槽内的线定位器。 每个终端的线定位器可以精确定位该终端内的线。 电线定位器有助于电线保持并改善电连接，从而在电线和该端子之间提供可靠的电路径。
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公开(公告)号：US5589669A
公开(公告)日：1996-12-31
申请号：US579773
申请日：1995-12-28
摘要： An electrical pin contact for mounting on a printed circuit board to provide an electrical interconnection to the printed circuit board. The contact includes an elongated, conductive pin, and a base attached to one end of the pin. The base has a triangular cross-section with vertices that engage a plate-through hole to support the contact in the plated-through hole during a soldering process. The contact may include a flange or stops to support the contact on a printed circuit board. The contact may also include a tail extending from the base opposite the pin.
摘要翻译： 用于安装在印刷电路板上以提供与印刷电路板的电互连的电引脚触头。 触点包括细长的导电销和附接到销的一端的基座。 基座具有三角形横截面，其顶点与焊接过程中的通孔相通，以支撑电镀通孔中的接触。 触点可以包括用于支撑印刷电路板上的触点的凸缘或止动件。 触点还可以包括从引脚相对的底部延伸的尾部。
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