公开(公告)号：US11557553B2

公开(公告)日：2023-01-17

申请号：US16942177

申请日：2020-07-29

申请人： SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.

发明人： Ikuo Nakashima ,  Shingo Inoue

IPC分类号： H01L25/18 ,  H01L23/66 ,  H01P3/08 ,  H03H7/38 ,  H01L23/00 ,  H01L23/047

摘要： Disclosed is a semiconductor device including a semiconductor die, a base member, a side wall, first and second conductive films, and first and second conductive leads. The base member has a conductive main surface including a region that mounts the semiconductor die. The side wall surrounds the region and is made of a dielectric. The side wall includes first and second portions. The first and second conductive films are provided on the first and second portions, respectively and are electrically connected to the semiconductor die. The first and second conductive leads are conductively bonded to the first and second conductive films, respectively. At least one of the first and second portions includes a recess on its back surface facing the base member, and the recess defines a gap between the at least one of the first and second portions below the corresponding conductive film and the base member.

公开(公告)号：US20240292520A1

公开(公告)日：2024-08-29

申请号：US18437713

申请日：2024-02-09

申请人： Sumitomo Electric Device Innovations, Inc.

发明人： Ikuo Nakashima

IPC分类号： H05K1/02 ,  H01L23/498 ,  H05K1/16

CPC分类号： H05K1/0251 ,  H01L23/49822 ,  H05K1/162 ,  H05K2201/09645

摘要： A matching circuit board includes a first substrate, a second substrate, and a third substrate. The first substrate includes a first insulator, a first metal pattern, and first conductive vias. The second substrate includes a second insulator, a second metal pattern, and second conductive vias. The third substrate includes a third insulator and a third metal pattern. A capacitor is constituted by the first metal pattern, the second insulator, and the second metal pattern, and a capacitor is constituted by the first metal pattern, the first insulator, and the third metal pattern. The second metal pattern is electrically connected to the third metal pattern through the second conductive vias and the first conductive vias. The first metal pattern is separated from the first conductive vias to be positioned inside the first conductive vias, and is insulated from the first conductive vias.

公开(公告)号：US11935848B2

公开(公告)日：2024-03-19

申请号：US17984908

申请日：2022-11-10

申请人： SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.

发明人： Ikuo Nakashima ,  Shingo Inoue

IPC分类号： H01L23/66 ,  H01L23/00 ,  H01L23/047 ,  H01P3/08 ,  H03H7/38

CPC分类号： H01L23/66 ,  H01L23/047 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01P3/081 ,  H03H7/38 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48175 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/1033 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/15763 ,  H01L2924/17787 ,  H01L2924/19032 ,  H01L2924/19051

摘要： Disclosed is a package for a semiconductor device including a semiconductor die. The package includes a base member, a side wall, first and second conductive films, and first and second conductive leads. The base member has a conductive main surface including a region that mounts the semiconductor die. The side wall surrounds the region and is made of a dielectric. The side wall includes first and second portions. The first and second conductive films are provided on the first and second portions, respectively and are electrically connected to the semiconductor die. The first and second conductive leads are conductively bonded to the first and second conductive films, respectively. At least one of the first and second portions includes a recess in its back surface facing the base member, and the recess defines a gap between the at least one of the first and second portions below the corresponding conductive film and the base member.

公开(公告)号：US09743557B2

公开(公告)日：2017-08-22

申请号：US14837834

申请日：2015-08-27

申请人： Sumitomo Electric Device Innovations, Inc.

发明人： Ikuo Nakashima ,  Naoto Murata

IPC分类号： H05K7/20 ,  H01L23/055 ,  H01L23/367 ,  H01L23/498

CPC分类号： H05K7/205 ,  H01L23/055 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/49844 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H03F2200/447 ,  H01L2924/00014

摘要： An amplifier module having a surface-mounting carrier with a base and lid is disclosed. The base in a top surface thereof provides a die pad on which a transistor is mounted, and a back surface thereof provides a back pad electrically and thermally connected to the die pad. The back pad has an area wider than the area of the die pad. The heat conduction from the transistor to the host board on which the amplifier module is mounted is effectively enhanced.