Optical transmitter module, optical transmitter-receiver module, and optical module

    公开(公告)号:US11362736B2

    公开(公告)日:2022-06-14

    申请号:US17236455

    申请日:2021-04-21

    摘要: An optical transmitter module includes a semiconductor laser device, optical modulator, temperature adjusting device which includes a substrate, a first installation part and a second installation part, a package having a bottom surface opposite to a back surface of the substrate, the package housing the semiconductor laser device, the optical modulator, and the temperature adjusting device; and a middle block disposed between a first temperature controlling element a the second temperature controlling element, the middle block having a back surface directly or indirectly fastened to a principal surface of the substrate.

    OPTICAL TRANSMITTER MODULE, OPTICAL TRANSMITTER-RECEIVER MODULE, AND OPTICAL MODULE

    公开(公告)号:US20210336702A1

    公开(公告)日:2021-10-28

    申请号:US17236455

    申请日:2021-04-21

    摘要: An optical transmitter module includes a semiconductor laser device, optical modulator, temperature adjusting device which includes a substrate, a first installation part and a second installation part, a package having a bottom surface opposite to a back surface of the substrate, the package housing the semiconductor laser device, the optical modulator, and the temperature adjusting device; and a middle block disposed between a first temperature controlling element a the second temperature controlling element, the middle block having a back surface directly or indirectly fastened to a principal surface of the substrate.

    Package for optical receiver module

    公开(公告)号:US10727953B2

    公开(公告)日:2020-07-28

    申请号:US16256060

    申请日:2019-01-24

    摘要: A package for an optical receiver module is disclosed. The package includes a housing having electrically conductive walls including a rear and a pair of side walls, and a feed-through provided in the rear wall. The feed-through includes an internal portion, and an external portion protruding from the internal portion. The internal portion has a top face and a back face, the top face including ground lines, the back face including transmission lines with signal lines and ground lines.

    Optical module
    7.
    发明授权

    公开(公告)号:US10527804B2

    公开(公告)日:2020-01-07

    申请号:US16245303

    申请日:2019-01-11

    发明人: Hiroshi Hara

    摘要: An optical module that provides a bridge substrate for carrying a driving signal from a wiring substrate to a laser diode (LD) element is disclosed. The optical module provides a carrier, first and second assemblies, and the bridge substrate. The first assembly, which includes the LD element, stacks a first compensating substrate and a semiconductor substrate on the carrier, where the semiconductor substrate includes the LD element. The second assembly stacks a second compensating substrate and the wiring substrate on the carrier. The first compensating substrate is made of a material same with a material of the wiring substrate and has a thickness same with that of the wiring substrate. The second compensating substrate is made of a material same with a material of the semiconductor substrate and has a thickness same with that of the semiconductor substrate.

    PACKAGE FOR OPTICAL RECEIVER MODULE
    8.
    发明申请

    公开(公告)号:US20190238236A1

    公开(公告)日:2019-08-01

    申请号:US16256060

    申请日:2019-01-24

    摘要: A package for an optical receiver module is disclosed. The package includes a housing having electrically conductive walls including a rear wall and a pair of side walls, and a feed-through provided in the rear wall. The feed-through includes an internal portion having an upper rear face and a lower rear face, and an external portion protruding from the upper rear face and the lower rear face outwardly and having a top face and/or a back face continuous to the upper rear face and/or the lower rear face of the internal portion, a first top face, a second back face, and a pair of side faces, the rear face and the side faces connecting the first top face with the second back face, the first top face including DC lines, the second back face including transmission lines, and the transmission lines.