摘要:
An actively controlled suspension system employs a shut-off valve which is responsive to a source pressure dropping below a predetermined level to shut-off communication between a pressure return line for returning the fluid pressure to the pressure source from a hydraulic cylinder. The shut-off valve is disposed in a drain line connecting a drain port of a spool valve assembly and the pressure source. By the presence of the shut-off valve, substantial pressure difference between the hydraulic cylinder side and pressure source side of the spool valve is not created. Therefore, no leakage through the spool valve occurs and whereby the pressure in the hydraulic cylinder can be maintained even when the source pressure becomes substantially low or zero.
摘要:
The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.
摘要:
A compound of the following general formula [I]: wherein each symbol has the same meaning as defined herein, or a pharmaceutically acceptable salt thereof, or a solvate thereof, and a pharmaceutical use of the same in treating organ transplant rejection, graft versus host reaction after transplantation, autoimmune disease, allergic disease and chronic myeloproliferative disease.
摘要:
A high frequency relay comprises a contact base block having pairs of fixed contacts, contact members with movable contacts, and an electromagnet for moving the contact members to open and close the fixed contacts by the movable contacts. The contact base block comprises an injection-molded base having projections on its front surface, first metal films formed as the fixed contacts on top surfaces of the projections, second metal films formed as connection terminals for outside devices on a rear surface of the base, each of which corresponds to one of the first metal films, through holes each having a conductive material on its inner surface to make an electrical connection between one of the first metal films and the corresponding second metal film in the shortest distance, and a third metal film formed on the base to provide electrical isolation from the first and second metal films, which works as electromagnetic shield as well as a ground.
摘要:
A toner density detecting device is provided with a coil buried in a housing and a cover member provided on one end of the coil to prevent the developing agent from touching the coil. The cover member has a front end portion provided near the surface of the housing and extending along the developing agent flowing direction and an apex portion at the back of the front end portion with respect to the direction. The apex portion projects deeper into the developing agent than the front end portion. An edge connecting the front end portion and the apex portion extends in the direction to cross the central axis of the coil. A pair of faces extending in the direction on either side of the edge are gradually declined from the edge toward the surface of the housing.
摘要:
A molded motor 100 includes a molded stator formed by providing a molding resin to a stator, a rotor inside the molded stator, a pair of bearings supporting a rotor shaft of the rotor, and an insulating bracket fitted in an inner circumferential part of an opening formed at an axial end of the molded stator to surround and support an outer ring of the bearing with a concave part formed at a center, and formed of an insulating resin.
摘要:
In an acoustic wave sensor for detecting a distance to an object and an orientation where the object is located with using acoustic waves, an acoustic wave generating device generating an acoustic wave by applying thermal impact to the air with no mechanical vibration is used as a wave transmitting device, and an electric capacitance microphone converting variation of pressure due to acoustic wave to variation of an electric signal is used as each wave receiving device. Therefore, dead zone caused by reverberation component included in the acoustic wave transmitted from the wave transmitting device and dead zone caused by reverberation component included in wave receiving signals outputted from the wave receiving devices can be shortened and angular sensitivity of the acoustic wave sensor can be increased, in comparison with a conventional acoustic wave sensor using piezoelectric devices as the wave transmitting device and the wave receiving devices.
摘要:
To improve thermal insulation, a thermal infrared sensing element is carried on a sensor mount of a porous material and is spaced upwardly from a substrate by means of anchor studs projecting on the substrate. The sensor mount is formed with a pair of coplanar beams carry thereon leads extending from the sensing element. The leads and the beams are secured to the upper ends of the anchor studs to hold the sensing element at a predetermined height above the substrate. The beams and the leads are combined with each other by intermolecular adhesion such that the sensing element as well as the sensor mount can be altogether supported to the anchor studs.
摘要:
An infrared sensor unit has a thermal infrared sensor and an associated semiconductor device commonly developed on a semiconductor substrate. A dielectric top layer covers the substrate to conceal the semiconductor device formed in the top surface of the substrate. The thermal infrared sensor carried on a sensor mount which is supported above the semiconductor device by means of a thermal insulation support. The sensor mount and the support are made of a porous material which is superimposed on top of the dielectric top layer.