公开(公告)号：US09362437B1

公开(公告)日：2016-06-07

申请号：US12815260

申请日：2010-06-14

申请人： Sung Sun Park ,  Ik Su Jun ,  Do Won Lee

发明人： Sung Sun Park ,  Ik Su Jun ,  Do Won Lee

IPC分类号： H01L31/05 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/054

CPC分类号： H01L31/0508 ,  H01L31/02013 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/048 ,  H01L31/05 ,  H01L31/054 ,  H01L31/0543 ,  Y02E10/52

摘要： In accordance with the present invention, there is provided multiple embodiments of a concentrated photovoltaic (CPV) module or package. In each embodiment of the present invention, the CPV module includes a mounting device or holder for use in maintaining an optical member or optical light guide of the module in a prescribed position relative to the solar cell or receiver die thereof.

摘要翻译： 根据本发明，提供了集中光伏（CPV）模块或封装的多个实施例。 在本发明的每个实施例中，CPV模块包括用于将模块的光学构件或光学光导相对于其太阳能电池或接收器芯片保持在规定位置的安装装置或保持器。

公开(公告)号：US08362598B2

公开(公告)日：2013-01-29

申请号：US12548354

申请日：2009-08-26

申请人： Sung Sun Park ,  Ik Su Jun ,  Ye Sul Ahn

发明人： Sung Sun Park ,  Ik Su Jun ,  Ye Sul Ahn

IPC分类号： H01L23/552

CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： In accordance with the present invention, there is provided a quad flat no leads (QFN) semiconductor device or package including a leadframe wherein the leads of the leadframe are selectively formed so that portions one or more prescribed leads are exposed in a package body of the semiconductor package and electrically connected to an electromagnetic interference (EMI) shielding layer applied to the package body. In certain embodiments of the present invention, one or more tie bars of the leadframe may also be formed so as to be exposed in the package body of the semiconductor package and electrically connected to the shielding layer applied to the package body. Thus, in the present invention, the shielding layer may be electrically connected to one or more leads alone or in combination with one or more tie bars of the leadframe.

摘要翻译： 根据本发明，提供了一种包括引线框的四边形无引线（QFN）半导体器件或封装，其中引线框的引线被选择性地形成为使得一个或多个规定引线的部分暴露在 半导体封装并且电连接到施加到封装体的电磁干扰（EMI）屏蔽层。 在本发明的某些实施例中，引线框架的一个或多个连接条也可以形成为暴露在半导体封装的封装主体中并电连接到施加到封装主体上的屏蔽层。 因此，在本发明中，屏蔽层可以单独地或与引线框架的一个或多个连接条组合地与一个或多个引线电连接。

公开(公告)号：US20110049685A1

公开(公告)日：2011-03-03

申请号：US12548354

申请日：2009-08-26

申请人： Sung Sun Park ,  Ik Su Jun ,  Ye Sul Ahn

发明人： Sung Sun Park ,  Ik Su Jun ,  Ye Sul Ahn

IPC分类号： H01L23/552 ,  H01L23/48

CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： In accordance with the present invention, there is provided a quad flat no leads (QFN) semiconductor device or package including a leadframe wherein the leads of the leadframe are selectively formed so that portions one or more prescribed leads are exposed in a package body of the semiconductor package and electrically connected to an electromagnetic interference (EMI) shielding layer applied to the package body. In certain embodiments of the present invention, one or more tie bars of the leadframe may also be formed so as to be exposed in the package body of the semiconductor package and electrically connected to the shielding layer applied to the package body. Thus, in the present invention, the shielding layer may be electrically connected to one or more leads alone or in combination with one or more tie bars of the leadframe.

摘要翻译： 根据本发明，提供了一种包括引线框的四边形无引线（QFN）半导体器件或封装，其中引线框的引线被选择性地形成为使得一个或多个规定引线的部分暴露在 半导体封装并且电连接到施加到封装体的电磁干扰（EMI）屏蔽层。 在本发明的某些实施例中，引线框架的一个或多个连接条也可以形成为暴露在半导体封装的封装主体中并电连接到施加到封装主体上的屏蔽层。 因此，在本发明中，屏蔽层可以单独地或与引线框架的一个或多个连接条组合地与一个或多个引线电连接。