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    Methods of fabricating non-volatile memory devices including a chlorine cured tunnel oxide layer
    5.
    发明授权
    Methods of fabricating non-volatile memory devices including a chlorine cured tunnel oxide layer 失效
    制造包括氯固化的隧道氧化物层的非易失性存储器件的方法

    公开(公告)号：US07799639B2

    公开(公告)日：2010-09-21

    申请号：US12123919

    申请日：2008-05-20

    申请人： Young-jin Noh ,  Si-Young Choi ,  Bon-young Koo ,  Ki-hyun Hwang ,  Chul-sung Kim ,  Sung-kweon Baek

    发明人： Young-jin Noh ,  Si-Young Choi ,  Bon-young Koo ,  Ki-hyun Hwang ,  Chul-sung Kim ,  Sung-kweon Baek

    IPC分类号： H01L21/336

    CPC分类号： H01L27/115 ,  H01L27/11521

    摘要： Fabrication of a nonvolatile memory device includes sequentially forming a tunnel oxide layer, a first conductive layer, and a nitride layer on a semiconductor substrate. A stacked pattern is formed from the tunnel oxide layer, the first conductive layer, and the nitride layer and a trench is formed in the semiconductor substrate adjacent to the stacked pattern. An oxidation process is performed to form a sidewall oxide layer on a sidewall of the trench and the first conductive layer. Chlorine is introduced into at least a portion of the stacked pattern subjected to the oxidation process. Introducing Cl into the stacked pattern may at least partially cure defects that are caused therein during fabrication of the structure.

    摘要翻译： 非易失性存储器件的制造包括在半导体衬底上依次形成隧道氧化物层，第一导电层和氮化物层。 从隧道氧化物层，第一导电层和氮化物层形成堆叠图案，并且在与堆叠图案相邻的半导体衬底中形成沟槽。 执行氧化处理以在沟槽和第一导电层的侧壁上形成侧壁氧化物层。 将氯气引入经历氧化过程的堆叠图案的至少一部分中。 将Cl引入堆叠图案可以至少部分地固化在结构制造期间在其中引起的缺陷。

    Method of forming a mask stack pattern and method of manufacturing a flash memory device including an active area having rounded corners
    6.
    发明申请
    Method of forming a mask stack pattern and method of manufacturing a flash memory device including an active area having rounded corners 审中-公开
    形成掩模堆叠图案的方法和制造包括具有圆角的有效区域的闪存设备的方法

    公开(公告)号：US20090203190A1

    公开(公告)日：2009-08-13

    申请号：US12320435

    申请日：2009-01-26

    申请人： Young-jin Noh ,  Si-young Choi ,  Bon-young Koo ,  Ki-hyun Hwang ,  Chul-sung Kim ,  Sung-kweon Baek ,  Jin-hwa Heo

    发明人： Young-jin Noh ,  Si-young Choi ,  Bon-young Koo ,  Ki-hyun Hwang ,  Chul-sung Kim ,  Sung-kweon Baek ,  Jin-hwa Heo

    IPC分类号： H01L21/762 ,  H01L21/30

    CPC分类号： H01L21/76224

    摘要： A method of forming a mask stack pattern and a method of manufacturing a flash memory device including an active area having rounded corners are provided. The method of manufacture including forming a mask stack pattern defining an active region, the mask stack pattern having a pad oxide layer formed on a semiconductor substrate, a silicon nitride layer formed on the pad oxide layer and a stack oxide layer formed on the silicon nitride layer, oxidizing a surface of the semiconductor substrate exposed by the mask stack pattern and lateral surfaces of the silicon nitride layer such that corners of the active region are rounded, etching the semiconductor substrate having an oxidized surface to form a trench in the semiconductor substrate, forming a device isolation oxide layer in the trench, removing the silicon nitride layer from the semiconductor substrate, and forming a gate electrode in a portion where the silicon nitride layer is removed.

    摘要翻译： 提供一种形成掩模叠层图案的方法和制造包括具有圆角的有效区域的闪速存储器件的方法。 制造方法包括形成限定有源区的掩模叠层图案，掩模叠层图案具有形成在半导体衬底上的焊盘氧化层，形成在焊盘氧化物层上的氮化硅层和形成在氮化硅上的堆叠氧化物层 氧化由掩模堆叠图案和氮化硅层的侧表面暴露的半导体衬底的表面，使得有源区的角部变圆，蚀刻具有氧化表面的半导体衬底，以在半导体衬底中形成沟槽， 在沟槽中形成器件隔离氧化物层，从半导体衬底去除氮化硅层，并在除去氮化硅层的部分中形成栅电极。

    METHODS OF FABRICATING NON-VOLATILE MEMORY DEVICES INCLUDING A CHLORINE CURED TUNNEL OXIDE LAYER
    7.
    发明申请
    METHODS OF FABRICATING NON-VOLATILE MEMORY DEVICES INCLUDING A CHLORINE CURED TUNNEL OXIDE LAYER 失效
    制造非挥发性记忆体装置的方法，包括氯化固化的隧道氧化物层

    公开(公告)号：US20080299755A1

    公开(公告)日：2008-12-04

    申请号：US12123919

    申请日：2008-05-20

    申请人： Young-jin Noh ,  Si-Young Choi ,  Bon-young Koo ,  Ki-hyun Hwang ,  Chul-sung Kim ,  Sung-kweon Baek

    发明人： Young-jin Noh ,  Si-Young Choi ,  Bon-young Koo ,  Ki-hyun Hwang ,  Chul-sung Kim ,  Sung-kweon Baek

    IPC分类号： H01L21/283

    CPC分类号： H01L27/115 ,  H01L27/11521

    摘要： Fabrication of a nonvolatile memory device includes sequentially forming a tunnel oxide layer, a first conductive layer, and a nitride layer on a semiconductor substrate. A stacked pattern is formed from the tunnel oxide layer, the first conductive layer, and the nitride layer and a trench is formed in the semiconductor substrate adjacent to the stacked pattern. An oxidation process is performed to form a sidewall oxide layer on a sidewall of the trench and the first conductive layer. Chlorine is introduced into at least a portion of the stacked pattern subjected to the oxidation process. Introducing Cl into the stacked pattern may at least partially cure defects that are caused therein during fabrication of the structure.

    摘要翻译： 非易失性存储器件的制造包括在半导体衬底上依次形成隧道氧化物层，第一导电层和氮化物层。 从隧道氧化物层，第一导电层和氮化物层形成堆叠图案，并且在与堆叠图案相邻的半导体衬底中形成沟槽。 进行氧化处理以在沟槽和第一导电层的侧壁上形成侧壁氧化物层。 将氯气引入经历氧化过程的堆叠图案的至少一部分中。 将Cl引入堆叠图案可以至少部分地固化在结构制造期间在其中引起的缺陷。

    Semiconductor devices having tunnel and gate insulating layers
    8.
    发明授权
    Semiconductor devices having tunnel and gate insulating layers 失效
    具有隧道和栅极绝缘层的半导体器件

    公开(公告)号：US07893482B2

    公开(公告)日：2011-02-22

    申请号：US12428078

    申请日：2009-04-22

    申请人： Chul-sung Kim ,  Young-jin Noh ,  Bon-young Koo ,  Sung-kweon Baek

    发明人： Chul-sung Kim ,  Young-jin Noh ,  Bon-young Koo ,  Sung-kweon Baek

    IPC分类号： H01L29/788

    CPC分类号： H01L27/11521 ,  H01L27/115

    摘要： A semiconductor device includes a semiconductor substrate having a surface, buried isolation regions protruding from the surface of the semiconductor substrate, and a first insulating layer on the surface of the semiconductor substrate between the isolation regions and including a fluorine, nitrogen, and/or heavy hydrogen impurity. A floating electrode is on the first insulating layer, a second insulating layer is on the floating electrode and the isolation regions, and a control gate electrode is on the second insulating layer. Related methods of forming semiconductor devices are also disclosed.

    摘要翻译： 半导体器件包括具有表面的半导体衬底，从半导体衬底的表面突出的掩埋隔离区域和在隔离区域之间的半导体衬底的表面上的第一绝缘层，并且包括氟，氮和/或重的 氢杂质。 浮置电极位于第一绝缘层上，第二绝缘层位于浮置电极和隔离区上，而控制栅极位于第二绝缘层上。 还公开了形成半导体器件的相关方法。

    SEMICONDUCTOR DEVICES HAVING TUNNEL AND GATE INSULATING LAYERS AND METHODS OF FORMING THE SAME
    9.
    发明申请
    SEMICONDUCTOR DEVICES HAVING TUNNEL AND GATE INSULATING LAYERS AND METHODS OF FORMING THE SAME 失效
    具有隧道和门绝缘层的半导体器件及其形成方法

    公开(公告)号：US20080073693A1

    公开(公告)日：2008-03-27

    申请号：US11776297

    申请日：2007-07-11

    申请人： Chul-sung Kim ,  Young-jin Noh ,  Bon-young Koo ,  Sung-kweon Baek

    发明人： Chul-sung Kim ,  Young-jin Noh ,  Bon-young Koo ,  Sung-kweon Baek

    IPC分类号： H01L29/788 ,  H01L21/336

    CPC分类号： H01L27/11521 ,  H01L27/115

    摘要： A semiconductor device includes a semiconductor substrate having a surface, buried isolation regions protruding from the surface of the semiconductor substrate, and a first insulating layer on the surface of the semiconductor substrate between the isolation regions and including a fluorine, nitrogen, and/or heavy hydrogen impurity. A floating electrode is on the first insulating layer, a second insulating layer is on the floating electrode and the isolation regions, and a control gate electrode is on the second insulating layer. Related methods of forming semiconductor devices are also disclosed.

    摘要翻译： 半导体器件包括具有表面的半导体衬底，从半导体衬底的表面突出的掩埋隔离区域和在隔离区域之间的半导体衬底的表面上的第一绝缘层，并且包括氟，氮和/或重的 氢杂质。 浮置电极位于第一绝缘层上，第二绝缘层位于浮置电极和隔离区上，而控制栅极位于第二绝缘层上。 还公开了形成半导体器件的相关方法。

    Methods of forming semiconductor devices having tunnel and gate insulating layers
    10.
    发明授权
    Methods of forming semiconductor devices having tunnel and gate insulating layers 失效
    形成具有隧道和栅极绝缘层的半导体器件的方法

    公开(公告)号：US07537993B2

    公开(公告)日：2009-05-26

    申请号：US11776297

    申请日：2007-07-11

    申请人： Chul-sung Kim ,  Young-jin Noh ,  Bon-young Koo ,  Sung-kweon Baek

    发明人： Chul-sung Kim ,  Young-jin Noh ,  Bon-young Koo ,  Sung-kweon Baek

    IPC分类号： H01L21/336

    CPC分类号： H01L27/11521 ,  H01L27/115

    摘要： A semiconductor device includes a semiconductor substrate having a surface, buried isolation regions protruding from the surface of the semiconductor substrate, and a first insulating layer on the surface of the semiconductor substrate between the isolation regions and including a fluorine, nitrogen, and/or heavy hydrogen impurity. A floating electrode is on the first insulating layer, a second insulating layer is on the floating electrode and the isolation regions, and a control gate electrode is on the second insulating layer. Related methods of forming semiconductor devices are also disclosed.

    摘要翻译： 半导体器件包括具有表面的半导体衬底，从半导体衬底的表面突出的掩埋隔离区域和在隔离区域之间的半导体衬底的表面上的第一绝缘层，并且包括氟，氮和/或重的 氢杂质。 浮置电极位于第一绝缘层上，第二绝缘层位于浮置电极和隔离区上，而控制栅极位于第二绝缘层上。 还公开了形成半导体器件的相关方法。