公开(公告)号：US4772700A

公开(公告)日：1988-09-20

申请号：US94488

申请日：1987-08-19

申请人： Susumu Kawauchi ,  Shigeru Saeda ,  Haruo Yoshida

发明人： Susumu Kawauchi ,  Shigeru Saeda ,  Haruo Yoshida

IPC分类号： C07D498/10 ,  C09K9/02 ,  G02F1/17 ,  G03C1/685 ,  G03C1/73

CPC分类号： C07D498/10 ,  G03C1/685

摘要： A spiropiperidine-naphthoxazine compound represented by the following general formula (I) is valuable as a photochromic compound: ##STR1## wherein (a) R.sub.1 represents a C1-C18 alkyl group, C7-C15 aralkyl group which may be substituted, a C1-C10 alkenyl group or a C6-C15 aryl group which may be substituted, (b) R.sub.2 through R.sub.9 represent a group R.sub.1 defined above, a hydrogen atom, or a C5-C10 alicyclic ring or a norbonyl or adamantyl group, which is bonded between groups present on one skeleton carbon atom or between groups on adjacent skeleton carbon atoms (at the ortho-position), (c) R.sub. 10 represents a C1-C18 alkyl group, a C7-C15 aralkyl group which may be substituted or a C1-C10 alkenyl group, and (d) R.sub.11 through R.sub.16 represent a hydrogen atom, a C1-C9 alkyl group, a C1-C5 alkoxyl group, a halogen atom, a nitro group or a cyano group.

公开(公告)号：US4452757A

公开(公告)日：1984-06-05

申请号：US440475

申请日：1982-11-09

申请人： Susumu Kawauchi ,  Junji Honda ,  Kiyoaki Nishikawa ,  Masahiro Tsuji

发明人： Susumu Kawauchi ,  Junji Honda ,  Kiyoaki Nishikawa ,  Masahiro Tsuji

IPC分类号： C22C9/00 ,  C22C9/04 ,  C22C9/02

CPC分类号： C22C9/04

摘要： Corrosion-resistant copper alloys for the manufacture of radiators are composed of, by weight, 25-40% zinc, 0.005-0.070% phosphorus, 0.05-1.0% each tin and aluminum, and the balance copper and inevitable impurities.

摘要翻译： 用于制造散热器的耐腐蚀铜合金以重量计为25-40％锌，0.005-0.070％磷，0.05-1.0％锡和铝，余量为铜和不可避免的杂质。

公开(公告)号：US4908275A

公开(公告)日：1990-03-13

申请号：US160479

申请日：1988-02-25

申请人： Masahiro Tsuji ,  Susumu Kawauchi ,  Hiroshi Nakayama

发明人： Masahiro Tsuji ,  Susumu Kawauchi ,  Hiroshi Nakayama

IPC分类号： H01L23/498 ,  H05K1/00 ,  H05K1/09

CPC分类号： H01L23/49866 ,  H05K1/09 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K2201/0355 ,  Y10S428/901 ,  Y10T29/49121 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692

摘要： There is provided a film carrier comprising a resin base film and a rolled copper foil laminated thereon, said rolled copper foil forming leads for mounting semiconductor chips or other electronic components in place, characterized in that said rolled copper foil is made of a copper alloy composition consisting essentially of a total of 0.005 to 1.5% by weight of one or two or more selected from a group consisting of______________________________________ P 0.005-0.05 wt %, B 0.005-0.05 wt %, Al 0.01-0.5 wt %, As 0.01-0.5 wt %, Cd 0.01-0.5 wt %, Co 0.01-0.5 wt %, Fe 0.01-0.5 wt %, In 0.01-0.5 wt %, Mg 0.01-0.5 wt %, Mn 0.01-0.5 wt %, Ni 0.01-0.5 wt %, Si 0.01-0.5 wt %, Sn 0.01-0.5 wt %, Te 0.01-0.5 wt %, Ag 0.01-1 wt %, Cr 0.01-1 wt %, Hf 0.01-1 wt %, Zn 0.01-1 wt % and Zn 0.01-1 wt % ______________________________________ and the remainder Cu with inevitable impurities, preferably with oxygen content of not more than 50 ppm. There is also provided a method for manufacturing a film carrier characterized in that the leads of the film carrier for mounting semiconductor chips or other electronic components in place are formed by the steps of providing a rolled copper alloy foil having the composition defined above, preferably strain relief annealing it after its final cold rolling and then laminating the annealed foil onto a resin base film followed by etching.

公开(公告)号：US4609412A

公开(公告)日：1986-09-02

申请号：US704804

申请日：1985-02-25

申请人： Morinori Kamio ,  Masahiro Tsuji ,  Susumu Kawauchi ,  Jun Ono ,  Hideki Isayama ,  Akihiko Nishimoto ,  Yoshiharu Miyawaki ,  Osamu Nozoe ,  Koji Iwase

发明人： Morinori Kamio ,  Masahiro Tsuji ,  Susumu Kawauchi ,  Jun Ono ,  Hideki Isayama ,  Akihiko Nishimoto ,  Yoshiharu Miyawaki ,  Osamu Nozoe ,  Koji Iwase

IPC分类号： C22C38/00 ,  C22C38/06 ,  C21D9/52

CPC分类号： C22C38/06 ,  C22C38/001

摘要： An Al-killed cold-rolled steel sheet with excellent demagnetization characteristics is provided which is substantially consisted of 0.005% or less C; from 0.05 to 0.50% Mn; 0.010% or less S; from 0.01 to 0.08% Sol.Al; 0.0050% or less N; wherein Mn %/S %.gtoreq.7 and (Sol.Al % - 0.003%)/N %.gtoreq.6; and the remainder iron and inevitable impurities. A shadow mask made of such Al-killed cold-rolled steel sheet and a color television receiver using the same exhibit a very excellent function. A preferred process for producing such an Al-killed cold-rolled steel is also provided, said process being characterized in first obtaining a steel or a specific composition by the use of a vacuum degassing apparatus and then subjecting the steel to sequential steps of hot rolling, cold rolling, decarburization-annealing, and cold rolling.

摘要翻译： 提供了具有优异退磁特性的Al杀死冷轧钢板，其基本上由0.005％以下C组成; 0.05〜0.50％的Mn; 0.010％以下S; 0.01〜0.08％Sol.Al; 0.0050％以下N; 其中Mn％/ S％> / = 7和（Sol.Al％-0.003％）/ N％> = 6; 剩余的铁和不可避免的杂质。 由Al杀死的冷轧钢板制成的荫罩和使用其的彩色电视接收机显示出非常优异的功能。 还提供了生产这种Al杀死冷轧钢的优选方法，所述方法的特征在于首先通过使用真空脱气装置获得钢或特定组成，然后对钢进行依次的热轧步骤 ，冷轧，脱碳退火和冷轧。

公开(公告)号：US5004520A

公开(公告)日：1991-04-02

申请号：US444575

申请日：1989-12-01

申请人： Masahiro Tsuji ,  Susumu Kawauchi ,  Hiroshi Nakayama

发明人： Masahiro Tsuji ,  Susumu Kawauchi ,  Hiroshi Nakayama

IPC分类号： H01L23/498 ,  H05K1/00 ,  H05K1/09

CPC分类号： H01L23/49866 ,  H05K1/09 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K2201/0355 ,  Y10S428/901 ,  Y10T29/49121 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692

摘要： There is provided a film carrier comprising a resin base film and a rolled copper foil laminated thereon, said rolled copper foil forming leads for mounting semiconductor chips or other electronic components in place, characterized in that said rolled copper foil is made of a copper alloy composition consisting essentially of a total of 0.005 to 1.5% by weight of one or two or more selected from a group consisting of______________________________________ P 0.005-0.05 wt %, B 0.005-0.05 wt %, Al 0.01-0.5 wt %, As 0.01-0.5 wt %, Cd 0.01-0.5 wt %, Co 0.01-0.5 wt %, Fe 0.01-0.5 wt %, In 0.01-0.5 wt %, Mg 0.01-0.5 wt %, Mn 0.01-0.5 wt %, Ni 0.01-0.5 wt %, Si 0.01-0.5 wt %, Sn 0.01-0.5 wt %, Te 0.01-0.5 wt %, Ag 0.01-1 wt %, Cr 0.01-1 wt %, Hf 0.01-1 wt %, Zn 0.01-1 wt % and Zn 0.01-1 wt % ______________________________________ and the remainder Cu with inevitable impurities, preferably with oxygen content of not more than 50 ppm. There is also provided a method for manufacturing a film carrier characterized in that the leads of the film carrier for mounting semiconductor chips or other electronic components in place are formed by the steps of providing a rolled copper alloy foil having the composition defined above, preferably strain relief annealing it after its final cold rolling and then laminating the annealed foil onto a resin base film followed by etching.

摘要翻译： 提供了一种膜载体，其包括层压在其上的树脂基膜和卷绕的铜箔，所述轧制铜箔形成用于将半导体芯片或其它电子部件安装到位的引线，其特征在于，所述轧制铜箔由铜合金组合物 基本上由0.005〜1.5重量％的选自P 0.005-0.05重量％，B 0.005-0.05重量％，-Al 0.01-0.5重量％，As 0.01-0.5重量％中的一种或两种以上组成的组合， 0.5重量％，-Cd 0.01-0.5重量％，Co 0.01-0.5重量％，-Fe 0.01-0.5重量％，In 0.01-0.5重量％，-Mg 0.01-0.5重量％，Mn 0.01-0.5重量％ Ni 0.01-0.5wt％，Si 0.01-0.5wt％，-Sn 0.01-0.5wt％，Te 0.01-0.5wt％，-Ag 0.01-1wt％，Cr 0.01-1wt％，-f 0.01-1wt ％，Zn 0.01-1重量％，-Zn 0.01-1重量％，余量为不可避免的杂质，优选氧含量不大于50ppm。 还提供了一种薄膜载体的制造方法，其特征在于，用于将半导体芯片或其它电子部件安装就位的薄膜载体的引线通过以下步骤形成：提供具有上述组成的轧制铜合金箔，优选应变 在其最终冷轧后进行退火退火，然后将退火的箔层压到树脂基膜上，然后蚀刻。