Semiconductor structure and layout method of a semiconductor structure

    公开(公告)号:US11417588B2

    公开(公告)日:2022-08-16

    申请号:US16943806

    申请日:2020-07-30

    IPC分类号: H01L23/48 H01L21/48 H01L27/02

    摘要: A semiconductor structure includes a plurality of vias and a metal layer. The vias disposed on a semiconductor substrate. The metal layer has a plurality of metal lines and at least one transmission gate line region. The metal lines are connected to the vias. The at least one transmission gate line region is connected to at least one transmission gate corresponding to at least one transmission gate circuit. The transmission gate line region includes at least one different-net via pair. The different-net via pair has two metal lines and each of the two metal lines is connected to a via respectively. The two metal lines extend along a first axis but toward opposite directions. A distance between the two vias of the different-net via pair is within about 1.5 poly pitch.

    LEAKAGE CURRENT REDUCTION FOR CONTINUOUS ACTIVE REGIONS

    公开(公告)号:US20230369320A1

    公开(公告)日:2023-11-16

    申请号:US18182657

    申请日:2023-03-13

    摘要: A device includes a substrate, a first well region, a second well region, and a dummy region in the substrate, where the dummy region is a non-functional region situated between the first well region and the second well region. The first well region is configured to receive a first voltage and the second well region is configured to receive a second voltage that is different than the first voltage. The device further includes an active region that extends through at least part of the first well region and at least part of the dummy region, and at least one isolation structure situated in the dummy region between a first gate structure that extends over the active region in the dummy region on one side of the at least one isolation structure and a second gate structure on another side of the at least one isolation structure.