Semiconductor structure and layout method of a semiconductor structure

    公开(公告)号:US11417588B2

    公开(公告)日:2022-08-16

    申请号:US16943806

    申请日:2020-07-30

    IPC分类号: H01L23/48 H01L21/48 H01L27/02

    摘要: A semiconductor structure includes a plurality of vias and a metal layer. The vias disposed on a semiconductor substrate. The metal layer has a plurality of metal lines and at least one transmission gate line region. The metal lines are connected to the vias. The at least one transmission gate line region is connected to at least one transmission gate corresponding to at least one transmission gate circuit. The transmission gate line region includes at least one different-net via pair. The different-net via pair has two metal lines and each of the two metal lines is connected to a via respectively. The two metal lines extend along a first axis but toward opposite directions. A distance between the two vias of the different-net via pair is within about 1.5 poly pitch.

    LEAKAGE CURRENT REDUCTION FOR CONTINUOUS ACTIVE REGIONS

    公开(公告)号:US20230369320A1

    公开(公告)日:2023-11-16

    申请号:US18182657

    申请日:2023-03-13

    摘要: A device includes a substrate, a first well region, a second well region, and a dummy region in the substrate, where the dummy region is a non-functional region situated between the first well region and the second well region. The first well region is configured to receive a first voltage and the second well region is configured to receive a second voltage that is different than the first voltage. The device further includes an active region that extends through at least part of the first well region and at least part of the dummy region, and at least one isolation structure situated in the dummy region between a first gate structure that extends over the active region in the dummy region on one side of the at least one isolation structure and a second gate structure on another side of the at least one isolation structure.

    Signal conducting line arrangements in integrated circuits

    公开(公告)号:US11916017B2

    公开(公告)日:2024-02-27

    申请号:US17446022

    申请日:2021-08-26

    摘要: An integrated circuit includes a plurality of horizontal conducting lines in a first connection layer, a plurality of gate-conductors below the first connection layer, a plurality of terminal-conductors below the first connection layer, and a via-connector directly connecting one of the horizontal conducting lines with one of the gate-conductors or with one of the terminal-conductors. The integrated circuit also includes a plurality of vertical conducting lines in a second connection layer above the first connection layer, and a plurality of pin-connectors for a circuit cell. A first pin-connector is directly connected between a first horizontal conducting line and a first vertical conducting line atop one of the gate-conductors. A second pin-connector is directly connected between a second horizontal conducting line and a second vertical conducting line atop a vertical boundary of the circuit cell.

    Power Gating Cell Structure
    10.
    发明申请

    公开(公告)号:US20220085005A1

    公开(公告)日:2022-03-17

    申请号:US17021045

    申请日:2020-09-15

    摘要: A power gating cell on an integrated circuit is provided. The power gating cell includes: a central area; a peripheral area surrounding the central area; a first active region located in the central area, the first active region having a first width in a first direction corresponding to at least four fin structures extending in a second direction perpendicular to the first direction; and a plurality of second active regions located in the peripheral area, each second active region having a second width in the first direction corresponding to at least one and no more than three fin structures extending in the second direction.