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1.发明授权公开(公告)号：US11610848B2
公开(公告)日：2023-03-21
申请号：US17340089
申请日：2021-06-07
发明人： Nuo Xu , Yuan-Hao Chang , Po-Sheng Lu , Zhiqiang Wu
IPC分类号： H01L23/552 , H01L23/00 , H01L25/065
摘要： A semiconductor package, a semiconductor device and a shielding housing for a semiconductor package are provided. The semiconductor package includes a semiconductor chip having a first region and a second region beside the first region; and a shielding housing encasing the semiconductor chip, made of a magnetic permeable material, and including a first shielding plate, a second shielding plate opposite to the first shielding plate and a shielding wall extending between the first shielding plate and the second shielding plate. The first shielding plate has an opening exposing the first region and includes a raised portion surrounding the opening and a flat portion beside the raised portion and shielding the second region. A first distance from a level of the semiconductor chip to an outer surface of the raised portion is greater than a second distance from the level to an outer surface of the flat portion.
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2.发明申请公开(公告)号：US20220392847A1
公开(公告)日：2022-12-08
申请号：US17340089
申请日：2021-06-07
发明人： Nuo Xu , Yuan-Hao Chang , Po-Sheng Lu , Zhiqiang Wu
IPC分类号： H01L23/552 , H01L23/00 , H01L25/065
摘要： A semiconductor package, a semiconductor device and a shielding housing for a semiconductor package are provided. The semiconductor package includes a semiconductor chip having a first region and a second region beside the first region; and a shielding housing encasing the semiconductor chip, made of a magnetic permeable material, and including a first shielding plate, a second shielding plate opposite to the first shielding plate and a shielding wall extending between the first shielding plate and the second shielding plate. The first shielding plate has an opening exposing the first region and includes a raised portion surrounding the opening and a flat portion beside the raised portion and shielding the second region. A first distance from a level of the semiconductor chip to an outer surface of the raised portion is greater than a second distance from the level to an outer surface of the flat portion.
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3.发明公开公开(公告)号：US20230197633A1
公开(公告)日：2023-06-22
申请号：US18173080
申请日：2023-02-23
发明人： Nuo Xu , Yuan-Hao Chang , Po-Sheng Lu , Zhiqiang Wu
IPC分类号： H01L23/552 , H01L23/00 , H01L25/065
CPC分类号： H01L23/552 , H01L24/13 , H01L25/0657 , H01L2224/13005 , H01L2225/06541 , H01L2225/06565 , H01L2225/06586 , H01L2924/1435
摘要： A semiconductor package, a semiconductor device and a shielding housing for a semiconductor package are provided. The semiconductor package includes a semiconductor chip having a first region and a second region beside the first region; and a shielding housing encasing the semiconductor chip, made of a magnetic permeable material, and including a first shielding plate, a second shielding plate opposite to the first shielding plate and a shielding wall extending between the first shielding plate and the second shielding plate. The first shielding plate has an opening exposing the first region and includes a raised portion surrounding the opening and a flat portion beside the raised portion and shielding the second region. A first distance from a level of the semiconductor chip to an outer surface of the raised portion is greater than a second distance from the level to an outer surface of the flat portion.
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4.发明授权公开(公告)号：US12107054B2
公开(公告)日：2024-10-01
申请号：US18173080
申请日：2023-02-23
发明人： Nuo Xu , Yuan-Hao Chang , Po-Sheng Lu , Zhiqiang Wu
IPC分类号： H01L23/552 , H01L23/00 , H01L25/065
CPC分类号： H01L23/552 , H01L24/13 , H01L25/0657 , H01L2224/13005 , H01L2225/06541 , H01L2225/06565 , H01L2225/06586 , H01L2924/1435
摘要： A semiconductor package, a semiconductor device and a shielding housing for a semiconductor package are provided. The semiconductor package includes a semiconductor chip having a first region and a second region beside the first region; and a shielding housing encasing the semiconductor chip, made of a magnetic permeable material, and including a first shielding plate, a second shielding plate opposite to the first shielding plate and a shielding wall extending between the first shielding plate and the second shielding plate. The first shielding plate has an opening exposing the first region and includes a raised portion surrounding the opening and a flat portion beside the raised portion and shielding the second region. A first distance from a level of the semiconductor chip to an outer surface of the raised portion is greater than a second distance from the level to an outer surface of the flat portion.
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公开(公告)号：US12022664B2
公开(公告)日：2024-06-25
申请号：US17408145
申请日：2021-08-20
发明人： Jui-Lin Chen , Chenchen Jacob Wang , Hsin-Wen Su , Ping-Wei Wang , Yuan-Hao Chang , Po-Sheng Lu , Shih-Hao Lin
摘要： A magnetic device structure is provided. In some embodiments, the structure includes one or more first transistors, a magnetic device disposed over the one or more first transistors, a plurality of magnetic columns surrounding sides of the one or more first transistors and the magnetic device, a first magnetic layer disposed over the magnetic device and in contact with the plurality of magnetic columns, and a second magnetic layer disposed below the one or more first transistors and in contact with the plurality of magnetic columns.
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