公开(公告)号：US12074074B2

公开(公告)日：2024-08-27

申请号：US17340114

申请日：2021-06-07

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Po-Ju Chen ,  Sheng-Jen Cheng ,  Cha-Hsin Chao ,  Chih-Teng Liao

IPC: H01L21/66 ,  H01J37/32 ,  H01L21/687 ,  G01F1/00 ,  G01N15/00 ,  G01N15/06 ,  G01N15/075 ,  G01P3/00

CPC classification number: H01L22/20 ,  H01J37/32935 ,  H01L21/68742 ,  G01F1/00 ,  G01N15/00 ,  G01N2015/0046 ,  G01N15/06 ,  G01N15/075 ,  G01P3/00 ,  H01J37/32715 ,  H01J2237/2007 ,  H01J2237/202 ,  H01J2237/24578 ,  H01J2237/24585

Abstract: The present disclosure provides a method and a system therefore for processing wafer. The method includes: monitoring a distribution of particles in a chamber while processing the wafer; determining at least one parameter according to the distribution of the particles for configuring at least one device of the chamber; configuring the at least one device of the chamber according to the at least one parameter; and processing another wafer based on a recipe after configuring the at least one device of the chamber.