公开(公告)号：US12046453B2

公开(公告)日：2024-07-23

申请号：US17018532

申请日：2020-09-11

Applicant: TOKYO ELECTRON LIMITED

Inventor： Taro Ikeda ,  Atsushi Kubo ,  Eiki Kamata ,  Nobuhiko Yamamoto

IPC: H01J37/32 ,  C23C16/511 ,  C23C16/52 ,  H01L21/67

CPC classification number: H01J37/3222 ,  C23C16/52 ,  H01J37/32266 ,  H01J37/32311 ,  H01L21/67288 ,  C23C16/511 ,  H01J37/32201 ,  H01J37/32229 ,  H01J37/32293 ,  H01J37/3244 ,  H01J37/32715 ,  H01J2237/202

Abstract: A plasma processing apparatus includes: a processing container; a substrate holder disposed within the processing container and configured to hold a substrate thereon; a dielectric window disposed below the substrate holder; and a plurality of phased array antennas disposed below the dielectric window and configured to irradiate a plurality of electromagnetic waves.

公开(公告)号：US12027353B2

公开(公告)日：2024-07-02

申请号：US17206768

申请日：2021-03-19

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shota Ishibashi ,  Hiroyuki Toshima ,  Hiroyuki Iwashita ,  Tatsuo Hirasawa

IPC: H01J37/34 ,  C23C14/35 ,  H01J37/32

CPC classification number: H01J37/3455 ,  C23C14/352 ,  H01J37/32715 ,  H01J37/3414 ,  H01J37/3464 ,  H01J2237/202

Abstract: There is provided a substrate processing method of a substrate processing apparatus. The substrate processing apparatus includes at least two targets, magnet-moving mechanisms disposed in one-to-one correspondence with the at least two targets, each of the magnet-moving mechanisms being configured to reciprocate a magnet in a first direction on a back surface of each target, and a substrate moving mechanism configured to move a substrate in a second direction orthogonal to the first direction. The method includes causing the magnet-moving mechanisms to reciprocate the magnets at different phases with each other.

公开(公告)号：US20240162020A1

公开(公告)日：2024-05-16

申请号：US18423636

申请日：2024-01-26

Applicant: Applied Materials, Inc.

Inventor： Hari Ponnekanti ,  Mukund Srinivasan

IPC: H01J37/32 ,  C23C16/458 ,  C23C16/505 ,  C23C16/509 ,  C23C16/511 ,  C23C16/52

CPC classification number: H01J37/32935 ,  C23C16/4584 ,  C23C16/505 ,  C23C16/509 ,  C23C16/511 ,  C23C16/52 ,  H01J37/32449 ,  H01J37/32715 ,  H01J2237/202 ,  H01J2237/20214 ,  H01J2237/3321

Abstract: Apparatus and methods to process a substrate comprising a gas distribution assembly comprising a plasma process region with an array of individual plasma sources. A controller is connected to the array of individual plasma sources and the substrate support. The controller is configured monitor the position of the at least one substrate and provide or disable power to the individual plasma sources based on the position of the substrate relative to the individual plasma sources.

公开(公告)号：US20240087841A1

公开(公告)日：2024-03-14

申请号：US18272200

申请日：2021-10-21

Applicant: HITACHI HIGH-TECH SCIENCE CORPORATION

Inventor： Tatsuya ASAHATA

IPC: H01J37/20 ,  H01J37/22

CPC classification number: H01J37/20 ,  H01J37/226 ,  H01J2237/202 ,  H01J2237/24578

Abstract: This sample piece relocating device (10) includes an optical interferometry device (11), a sample piece carrying device (13), and a control device (21). The control device (21) controls the sample piece carrying device (13) based on information relating to processing in which a charged-particle beam device is used to irradiate a sample (S) with a charged-particle beam, thereby preparing a sample piece. The sample piece carrying device (13) controlled by the control device (21) separates and extracts the sample piece from the sample (S) and holds and carries the sample piece to a sample piece holder.

公开(公告)号：US11929231B2

公开(公告)日：2024-03-12

申请号：US17725151

申请日：2022-04-20

Applicant: HITACHI HIGH-TECH CORPORATION

Inventor： Akito Tanokuchi ,  Seiichiro Kanno ,  Kei Shibayama

IPC: H01J37/20 ,  H01J37/28

CPC classification number: H01J37/20 ,  H01J37/28 ,  H01J2237/2007 ,  H01J2237/202

Abstract: A charged particle beam device suppresses sample deformation caused by placing a sample on a suctioning surface of an electrostatic chuck mechanism, the sample having a temperature different from the suctioning surface. The charged particle beam device includes the electrostatic chuck mechanism; a stage (200) which moves a sample, which is to be irradiated with a charged particle beam, relative to an irradiation position of the charged particle beam; an insulating body (203) which is disposed on the stage and constitutes a dielectric layer of the electrostatic chuck; a first support member (402) which supports the insulating body on the stage; a ring-shaped electrode (400) which encloses the surroundings of the sample and is installed on the insulating body in a contactless manner, and to which a predetermined voltage is applied; and a second support member (405) which supports the ring-shaped electrode.

公开(公告)号：US20230369010A1

公开(公告)日：2023-11-16

申请号：US18114349

申请日：2023-02-27

Applicant: Hitachi High-Tech Corporation

Inventor： Toru Iwaya ,  Hisayuki Takasu ,  Sakae Koubori

IPC: H01J37/20 ,  H01J37/08 ,  H01J37/26 ,  H01J37/304 ,  H01J37/30 ,  H01J37/305

CPC classification number: H01J37/20 ,  H01J37/08 ,  H01J37/265 ,  H01J37/30 ,  H01J37/304 ,  H01J37/3053 ,  H01J2237/026 ,  H01J2237/202 ,  H01J2237/20214 ,  H01J2237/20221

Abstract: Provided is a machining technology to obtain a desired machining content while suppressing a possibility of causing a redeposition in a machining surface. The invention is directed to provide an ion milling device which includes an ion source which emits an ion beam, a sample holder which holds a sample, and a sample sliding mechanism which slides the sample holder in a direction including a normal direction of an axis of the ion beam.

公开(公告)号：US11702732B2

公开(公告)日：2023-07-18

申请号：US17668591

申请日：2022-02-10

Applicant: Raytheon Technologies Corporation

Inventor： Eric Jorzik

IPC: C23C14/04 ,  B05C21/00 ,  C23C14/50 ,  B05C13/02 ,  C23C14/56 ,  H01J37/20 ,  C23C14/24 ,  F01D5/00 ,  C23C10/04 ,  B05B13/02 ,  B05C1/00 ,  B05C17/00 ,  B05C15/00 ,  H01J37/32

CPC classification number: C23C14/505 ,  B05C13/02 ,  B05C21/005 ,  C23C10/04 ,  C23C14/042 ,  C23C14/246 ,  C23C14/56 ,  F01D5/005 ,  H01J37/20 ,  B05B13/0228 ,  B05C1/003 ,  B05C15/00 ,  B05C17/002 ,  F05D2230/313 ,  H01J37/32779 ,  H01J2237/202

Abstract: An embodiment of a line-of-sight coating fixture includes a support structure, a spindle, and a shadow structure. The support structure includes a plurality of compartments disposed below a platter, each compartment having an opening on a periphery of the support structure. Each compartment is adapted to receive and secure a base of a workpiece such that a body of each workpiece to be coated is disposed about a periphery of the support structure and extends above the platter. The spindle is disposed through a center of the platter or support structure for rotating the workpieces thereabout. The shadow structure is disposed about the spindle, inside of the periphery, the shadow structure sized and adapted to shield a portion of each workpiece from line-of-sight coating material.

公开(公告)号：US20230143407A1

公开(公告)日：2023-05-11

申请号：US18093422

申请日：2023-01-05

Applicant: NIKON CORPORATION

Inventor： Yuichi SHIBAZAKI

IPC: G03F7/20 ,  G01B11/26 ,  G01B11/00 ,  H01J37/304 ,  H01J37/317

CPC classification number: G03F7/70133 ,  G01B11/26 ,  G01B11/00 ,  G03F7/70775 ,  G03F7/70058 ,  H01J37/3045 ,  H01J37/3174 ,  H01J2237/3175 ,  H01J2237/202

Abstract: In corner sections of first to fourth quadrants whose origin point is a center of an upper surface of a stage, three each of two-dimensional heads are provided. The three each of two-dimensional heads include one first head and two second heads. The stage is driven, while measuring a position of the stage using three first heads that face a two-dimensional grating of a scale plate provided above the stage from the four first heads, and during the driving, difference data of measurement values of the two second heads with respect to the first head in a measurement direction are taken in for head groups to which the three first heads belong, respectively, and using the difference data, grid errors are calibrated.

公开(公告)号：US10054556B2

公开(公告)日：2018-08-21

申请号：US15339496

申请日：2016-10-31

Applicant: Hermes Microvision Inc.

Inventor： You-Jin Wang ,  Chiyan Kuan ,  Chung-Shih Pan

IPC: A61N5/06 ,  G01N23/2251 ,  H05F3/02 ,  H01J37/20 ,  H01J37/02 ,  H01J37/28

CPC classification number: G01N23/2251 ,  H01J37/026 ,  H01J37/20 ,  H01J37/28 ,  H01J2237/004 ,  H01J2237/0041 ,  H01J2237/0044 ,  H01J2237/2007 ,  H01J2237/2008 ,  H01J2237/202 ,  H01J2237/2448 ,  H01J2237/2602 ,  H01J2237/2811 ,  H01J2237/2813 ,  H05F3/02

Abstract: A structure for discharging an extreme ultraviolet mask (EUV mask) is provided to discharge the EUV mask during the inspection by an electron beam inspection tool. The structure for discharging an EUV mask includes at least one grounding pin to contact conductive areas on the EUV mask, wherein the EUV mask may have further conductive layer on sidewalls or/and bottom. The inspection quality of the EUV mask is enhanced by using the electron beam inspection system because the accumulated charging on the EUU mask is grounded.

公开(公告)号：US10014159B2

公开(公告)日：2018-07-03

申请号：US15331182

申请日：2016-10-21

Applicant: JEOL Ltd.

Inventor： Takaki Ishikawa

IPC: H01J37/20 ,  H01J37/244 ,  H01J37/26

CPC classification number: H01J37/244 ,  H01J37/20 ,  H01J37/26 ,  H01J2237/202 ,  H01J2237/20207 ,  H01J2237/20278 ,  H01J2237/20292 ,  H01J2237/24578 ,  H01J2237/26

Abstract: There is provided a detector apparatus capable of detecting the position or tilt angle of a sample stage with high resolution and high reliability. The detector apparatus (100) is operative to detect the position or tilt angle of the sample stage (2), and has a potentiometer (10) for detecting the position or tilt angle of the sample stage (2), an encoder (20) for detecting the position or tilt angle of the sample stage (2), and a computing unit (30) for calculating the position or tilt angle of the sample stage (2), based both on an output signal from the potentiometer (10) and on an output signal from the encoder (20).