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    COIL COMPONENT
    1.
    发明申请
    COIL COMPONENT 有权

    公开(公告)号：US20210375528A1

    公开(公告)日：2021-12-02

    申请号：US17330014

    申请日：2021-05-25

    Applicant: TAIYO YUDEN CO., LTD.

    Inventor： Hideaki HOSHINO ,  Kenji OKABE ,  Kozue IMAIZUMI

    IPC: H01F27/29 ,  H01F27/06 ,  H01F27/28 ,  H01F41/04

    Abstract: A coil component according to one or more embodiments of the present invention includes: an insulating base body having a bottom surface; a coil conductor disposed in the base body and having a coil surface opposed to the bottom surface; and a reinforcement portion disposed in the base body. The reinforcement portion is disposed at a position closer to the bottom surface than is a middle point between the bottom surface and the coil surface.

    INDUCTOR AND PRINTED CIRCUIT BOARD
    2.
    发明申请
    INDUCTOR AND PRINTED CIRCUIT BOARD 审中-公开
    电感和印刷电路板

    公开(公告)号：US20170018351A1

    公开(公告)日：2017-01-19

    申请号：US15208882

    申请日：2016-07-13

    Applicant: Taiyo Yuden Co., Ltd.

    Inventor： Masuo YATABE ,  Kozue IMAIZUMI ,  Noriyuki MABUCHI ,  Kazuhiko OYAMA

    IPC: H01F27/29 ,  H05K1/18 ,  H01F27/28

    CPC classification number: H01F27/292 ,  H01F27/2804 ,  H01F2027/2809 ,  H05K3/3431 ,  H05K2201/0792 ,  H05K2201/1003 ,  H05K2201/10636 ,  H05K2203/048 ,  Y02P70/611 ,  Y02P70/613

    Abstract: One object is to compensate the reduction of the Q value due to reduction of core sectional area of a coil of an inductor, and the reduction of positional accuracy and adhesive strength of components mounted on a printed circuit board due to reduction of area of external electrodes, both caused by downsizing of component sizes. An inductor is provided which includes: a coil formed in an insulator and having one end and the other end thereof formed in a direction away from a mounting surface; and lead-out portions connected to the coil at positions more distant from the mounting surface than a portion of the coil closest to the mounting surface.

    Abstract translation: 一个目的是为了补偿由于电感器线圈的芯截面积的减小引起的Q值的降低，以及由于外部电极的面积的减小而安装在印刷电路板上的部件的位置精度和粘合强度的降低 都是由于组件尺寸的缩小造成的。 提供一种电感器，其包括：形成在绝缘体中的线圈，并且其一端和另一端沿远离安装表面的方向形成; 以及与最靠近安装表面的线圈的一部分相比，在与安装表面更远的位置连接到线圈的引出部分。

    ELECTRONIC COMPONENT
    3.
    发明申请
    ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20180096778A1

    公开(公告)日：2018-04-05

    申请号：US15719419

    申请日：2017-09-28

    Applicant: TAIYO YUDEN CO., LTD.

    Inventor： Masuo YATABE ,  Chitose KIMURA ,  Kozue IMAIZUMI ,  Ichiro YOKOYAMA

    IPC: H01F27/28 ,  H01F27/29

    CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F27/292 ,  H01F2027/2809 ,  H01G4/012 ,  H01G4/30 ,  H01G4/40

    Abstract: In an embodiment, an electronic component includes: an element body part 10 constituted by an insulative body of rectangular solid shape; an internal conductor 30 provided inside the element body part 10; and external electrodes 50 provided at least on the bottom face 14 (mounting surface) of the element body part 10 and electrically connected to the internal conductor 30; wherein the element body part 10 has: a conductor-containing layer 20 in which a coil conductor 36 (functional part) that will become a part of the internal conductor 30 to demonstrate electrical performance, is provided; and a high-hardness layer 22 which is provided side by side with the conductor-containing layer 20 in a direction parallel with the bottom face 14 (mounting surface) of the element body part 10, and which has a higher hardness compared to the conductor-containing layer 20. The electronic component has improve mechanical strength.

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