LAMINATED INDUCTOR
    1.
    发明申请
    LAMINATED INDUCTOR 有权
    层压电感器

    公开(公告)号:US20140292470A1

    公开(公告)日:2014-10-02

    申请号:US14228878

    申请日:2014-03-28

    CPC classification number: H01F27/292 H01F5/00

    Abstract: A laminated inductor includes: a laminate having an insulating part constituted by non-magnetic layers, as well as a coil part constituted by conductors positioned between the non-magnetic layers; and external electrodes that are electrically connected to the ends of the coil part and positioned on the exterior surfaces of the laminate; wherein the external electrodes each have a first electrode layer whose primary constituent is Ag, as well as a second electrode layer whose primary constituent is Cu and which is positioned on the outer side of the first electrode layer and has a thickness of 4 μm or more, and the total thickness of the first electrode layer and second electrode layer is 5 μm or more and preferably 10 μm or less.

    Abstract translation: 层叠电感器包括:具有由非磁性层构成的绝缘部分的层压体,以及由位于非磁性层之间的导体构成的线圈部分; 以及外部电极,其电连接到所述线圈部的端部并且位于所述层叠体的外表面上; 其中,所述外部电极各自具有主要成分为Ag的第一电极层以及主要成分为Cu的第二电极层,所述第二电极层位于所述第一电极层的外侧且具有4μm以上的厚度 ,第一电极层和第二电极层的总厚度为5μm以上,优选为10μm以下。

    INDUCTOR AND PRINTED CIRCUIT BOARD
    2.
    发明申请
    INDUCTOR AND PRINTED CIRCUIT BOARD 审中-公开
    电感和印刷电路板

    公开(公告)号:US20170018351A1

    公开(公告)日:2017-01-19

    申请号:US15208882

    申请日:2016-07-13

    Abstract: One object is to compensate the reduction of the Q value due to reduction of core sectional area of a coil of an inductor, and the reduction of positional accuracy and adhesive strength of components mounted on a printed circuit board due to reduction of area of external electrodes, both caused by downsizing of component sizes. An inductor is provided which includes: a coil formed in an insulator and having one end and the other end thereof formed in a direction away from a mounting surface; and lead-out portions connected to the coil at positions more distant from the mounting surface than a portion of the coil closest to the mounting surface.

    Abstract translation: 一个目的是为了补偿由于电感器线圈的芯截面积的减小引起的Q值的降低,以及由于外部电极的面积的减小而安装在印刷电路板上的部件的位置精度和粘合强度的降低 都是由于组件尺寸的缩小造成的。 提供一种电感器,其包括:形成在绝缘体中的线圈,并且其一端和另一端沿远离安装表面的方向形成; 以及与最靠近安装表面的线圈的一部分相比,在与安装表面更远的位置连接到线圈的引出部分。

    COIL COMPONENT
    4.
    发明申请
    COIL COMPONENT 审中-公开

    公开(公告)号:US20180096780A1

    公开(公告)日:2018-04-05

    申请号:US15713397

    申请日:2017-09-22

    Abstract: In an embodiment, a coil component includes: an element body part 10; a coil conductor 36 constituted by first conductors 32 extending along the pair of end faces 16 and orthogonally to a bottom face 14, as well as second conductors 34 extending from one side, to the other side, of the pair of end faces and thereby connecting the multiple first conductors 32; lead conductor parts 38 electrically connected to two ends of the coil conductor, respectively; and a pair of external electrodes 50 electrically connected to the lead conductor parts; wherein at least one end of the coil conductor is electrically connected, via the lead conductor, to the external electrode at a top face 12 of the element body part; and the coil conductor extends from the at least the one end, using a second conductor, along and near the top face.

    ELECTRONIC COMPONENT
    5.
    发明申请

    公开(公告)号:US20180096778A1

    公开(公告)日:2018-04-05

    申请号:US15719419

    申请日:2017-09-28

    Abstract: In an embodiment, an electronic component includes: an element body part 10 constituted by an insulative body of rectangular solid shape; an internal conductor 30 provided inside the element body part 10; and external electrodes 50 provided at least on the bottom face 14 (mounting surface) of the element body part 10 and electrically connected to the internal conductor 30; wherein the element body part 10 has: a conductor-containing layer 20 in which a coil conductor 36 (functional part) that will become a part of the internal conductor 30 to demonstrate electrical performance, is provided; and a high-hardness layer 22 which is provided side by side with the conductor-containing layer 20 in a direction parallel with the bottom face 14 (mounting surface) of the element body part 10, and which has a higher hardness compared to the conductor-containing layer 20. The electronic component has improve mechanical strength.

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