公开(公告)号：US20170057020A1

公开(公告)日：2017-03-02

申请号：US15248196

申请日：2016-08-26

Applicant: TANAKA DENSHI KOGYO K.K.

Inventor： Hiroyuki AMANO ,  Somei YARITA ,  Yusuke SAKITA ,  Yuki ANTOKU ,  Wei CHEN

IPC: B23K35/02 ,  C22C9/00 ,  C22C5/04 ,  C22C5/02 ,  B23K35/30 ,  B21C1/02 ,  C22F1/14 ,  C25D3/50 ,  C23C14/16 ,  C23C14/35 ,  C23C26/00 ,  B32B15/01 ,  C22C9/06 ,  C22F1/08

CPC classification number: B23K35/0227 ,  B21C1/02 ,  B23K35/302 ,  B32B15/018 ,  C22C5/02 ,  C22C5/04 ,  C22C9/00 ,  C22C9/06 ,  C22F1/08 ,  C22F1/14 ,  C23C14/165 ,  C23C14/35 ,  C23C26/00 ,  C25D3/50 ,  H01L2224/05624 ,  H01L2224/45 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2924/00011 ,  H01L2924/10253 ,  H01L2924/01201 ,  H01L2924/00012 ,  H01L2924/01016 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01006 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/01004 ,  H01L2924/013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01078 ,  H01L2924/01203 ,  H01L2924/01206

Abstract: A palladium coated copper wire for ball bonding includes a core formed of pure copper or copper alloy having a purity of 98% by mass or more, and a palladium draw coated layer coated on the core. The copper wire has a diameter of 10 to 25 μm, and the palladium drawn layer contains sulfur, phosphorus, boron or carbon.

Abstract translation: 用于球接的钯包铜线包括由纯度为98质量％以上的纯铜或铜合金形成的芯和涂覆在芯上的钯吸附涂层。 铜线的直径为10〜25μm，钯拉伸层含有硫，磷，硼或碳。

公开(公告)号：US20200350273A1

公开(公告)日：2020-11-05

申请号：US16869694

申请日：2020-05-08

Applicant: Tanaka Denshi Kogyo K.K.

Inventor： Yuki ANTOKU ,  Shota KAWANO ,  Yusuke SAKITA

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00

Abstract: A gold-coated silver bonding wire includes: a core material containing silver as a main component; and a coating layer provided on a surface of the core material and containing gold as a main component. The gold-coated silver bonding wire contains gold in a range of not less than 2 mass % nor more than 7 mass %, and at least one sulfur group element selected from the group consisting of sulfur, selenium, and tellurium in a range of not less than 1 mass ppm nor more than 80 mass ppm, with respect to a total content of the bonding wire.

公开(公告)号：US20170125135A1

公开(公告)日：2017-05-04

申请号：US15337771

申请日：2016-10-28

Applicant: TANAKA DENSHI KOGYO K.K.

Inventor： Hiroyuki AMANO ,  Somei YARITA ,  Yusuke SAKITA ,  Yuki ANTOKU ,  Wei CHEN

IPC: H01B1/02 ,  H01L23/00

Abstract: A noble metal-coated copper wire for ball bonding, with a wire diameter between 10 μm or more, and 25 μm or less, includes a core material having a copper alloy having a copper purity of 98 mass % or higher, and a noble metal-coating layer formed on the core material. The noble metal-coating layer includes a palladium cavitating layer containing palladium; at least one element selected from the group consisting of Group 13 to 16 elements or an oxygen element, finely dispersed in the palladium; and a diffusion layer formed of copper diffused into the palladium. The noble metal-coating layer may include a palladium cavitating layer containing palladium, at least one element selected from the group consisting of Group 13 to 16 elements or an oxygen element, finely dispersed therein, and a nickel intermediate layer disposed between the core material and the noble metal-coating layer.