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公开(公告)号：US20220208474A1
公开(公告)日：2022-06-30
申请号：US17559552
申请日：2021-12-22
申请人： TDK CORPORATION
发明人： Shinya ONODERA , Akitoshi YOSHII , Kyohei TAKATA
摘要： An external electrode is disposed on an end of the element body in the first direction. The external electrode includes a pair of first electrode portions disposed on the pair of second side surfaces and including a conductive resin layer. Each of the pair of second side surfaces includes a region exposed from the external electrode. An insulating film is disposed on the element body. The insulating film includes film portions disposed on the pair of second side surfaces. Each of the film portions covers an edge of the conductive resin layer and the region of each of the second side surfaces along the edge of the conductive resin layer.
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公开(公告)号：US20140118882A1
公开(公告)日：2014-05-01
申请号：US14024398
申请日：2013-09-11
申请人： TDK Corporation
发明人： Sunao MASUDA , Katsumi KOBAYASHI , Takashi KOMATSU , Akitoshi YOSHII , Kazuyuki HASEBE , Kayou KUSANO , Norihisa ANDO
CPC分类号： H01G2/06 , H01G4/12 , H01G4/232 , H01G4/2325 , H01G4/30
摘要： A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed.
摘要翻译： 一种具有金属端子的陶瓷电子部件，包括在两端形成有端子电极的芯片部件，以及一对金属端子，包括具有平板部分的平板部分，所述平板部分面对面设置成使其面对所述芯片部件的端面， 通过接合部分连接到所述端子电极，以及安装部分，其连接到所述平板部分的一个端部并且大致垂直于所述平板部分延伸，其中所述安装部分具有形成约270°的角度的安装部分底面 形成相对于所述平板部分的角度以及相对于所述平板部分形成大约90度的角度的安装部分上表面，并且形成具有比所述安装部分底面更低的润湿性的阻焊区域。
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公开(公告)号：US20230411077A1
公开(公告)日：2023-12-21
申请号：US18331294
申请日：2023-06-08
申请人： TDK CORPORATION
发明人： Akihiro MASUDA , Shinya ITO , Norihisa ANDO , Hideki KANEKO , Ken ABURAKAWA , Kenya TAMAKI , Akitoshi YOSHII
摘要： The electronic device includes: a case including a recessed portion and an opening edge portion of the recessed portion; a ceramic element arranged in the recessed portion, having a first main surface and a second main surface facing each other, and including a first electrode portion formed on the first main surface and a second electrode portion formed on the second main surface; a first metal terminal including a first mounting portion, arranged in the opening edge portion and approximately horizontal with respect to the first main surface and the second main surface, and a first electrode connection portion connected to the first electrode portion; and a second metal terminal including a second mounting portion, arranged in the opening edge portion and approximately horizontal with respect to the first main surface and the second main surface, and a second electrode connection portion connected to the second electrode portion.
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公开(公告)号：US20230095767A1
公开(公告)日：2023-03-30
申请号：US17939819
申请日：2022-09-07
申请人： TDK CORPORATION
发明人： Yuichi NAGAI , Natsumi KATO , Akitoshi YOSHII , Ken MORITA , Takehisa TAMURA , Atsushi TAKEDA
摘要： Each of a plurality of internal electrodes is electrically connected to a corresponding external electrode of a plurality of external electrodes. A plurality of auxiliary internal electrodes are disposed in the same layer as the plurality of internal electrodes to be located between each of a pair of side surfaces and the plurality of internal electrodes. Each of the plurality of external electrodes includes a pair of side surface electrode portions disposed on the pair of side surfaces and including a conductive resin layer. Each of the plurality of auxiliary internal electrodes is electrically connected to the external electrode to which the internal electrode located in the same layer is not electrically connected, and is located between the conductive resin layer to which the internal electrode located in the same layer is not electrically connected and the internal electrode located in the same layer.
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公开(公告)号：US20230402228A1
公开(公告)日：2023-12-14
申请号：US18331652
申请日：2023-06-08
申请人： TDK CORPORATION
发明人： Akihiro MASUDA , Takaaki SATO , Shinya ITO , Norihisa ANDO , Hideki KANEKO , Ken ABURAKAWA , Kenya TAMAKI , Akitoshi YOSHII
摘要： An electronic device includes: a ceramic element including a first electrode portion and a second electrode portion; a first metal terminal including a first external connection portion and a first electrode connection portion connected to the first electrode portion through solder; and a second metal terminal including a second external connection portion and a second electrode connection portion connected to the second electrode portion through solder. The first electrode connection portion includes a first solder stopper formed by undulation of at least a part of a facing surface of the first electrode connection portion facing the first electrode portion to control a range of an adhesion region of solder to the first electrode portion. The second electrode connection portion includes a second solder stopper that is formed by undulation of at least a part of a facing surface of the second electrode connection portion facing the second electrode portion.
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公开(公告)号：US20230268127A1
公开(公告)日：2023-08-24
申请号：US18096766
申请日：2023-01-13
申请人： TDK CORPORATION
发明人： Takaaki SATO , Akihiro MASUDA , Shinya ITO , Norihisa ANDO , Hideki KANEKO , Ken ABURAKAWA , Kenya TAMAKI , Akitoshi YOSHII
摘要： An electronic component including a case including an accommodation part having an opening; a ceramic element arranged in the accommodation part; a metal terminal including an electrode connecting part connecting to the ceramic element, a mounting part exposed out of the accommodation part, and a terminal arm part connecting the electrode connecting part and the mounting part; a case cover including a closing plate part covering the opening, and a case cover lateral side portion extending in a depth direction of the accommodation part from a circumference of the closing plate part and at least partially facing against an accommodation side wall of the accommodation part; and a mold resin filling the accommodation part.
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公开(公告)号：US20230064506A1
公开(公告)日：2023-03-02
申请号：US17888219
申请日：2022-08-15
申请人： TDK CORPORATION
发明人： Akihiro MASUDA , Shinya ITO , Norihisa ANDO , Hideki KANEKO , Ken ABURAKAWA , Kenya TAMAKI , Akitoshi YOSHII
摘要： An electronic device includes a case, a ceramic element, a first metal terminal, and a second metal terminal. The case includes a recess and a case lower surface facing opposite to its opening. The ceramic element is disposed in the recess and includes first and second main surfaces opposing to each other, a first electrode portion formed on the first main surface, and a second electrode portion formed on the second main surface. The first metal terminal includes a first mounting portion disposed on the case lower surface and being substantially parallel to the first and second main surfaces and a first electrode connection portion connected to the first electrode portion. The second metal terminal includes a second mounting portion disposed on the case lower surface and being substantially parallel to the first and second main surfaces and a second electrode connection portion connected to the second electrode portion.
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公开(公告)号：US20230061638A1
公开(公告)日：2023-03-02
申请号：US17888139
申请日：2022-08-15
申请人： TDK CORPORATION
发明人： Akihiro MASUDA , Shinya ITO , Norihisa ANDO , Hideki KANEKO , Ken ABURAKAWA , Kenya TAMAKI , Akitoshi YOSHII
摘要： An electronic device includes a case, a ceramic element, a first metal terminal, and a second metal terminal. The case includes a recess and its opening edge. The ceramic element is disposed in the recess and includes a first main surface and a second main surface opposing to each other, a first electrode portion formed on the first main surface, and a second electrode portion formed on the second main surface. The first metal terminal includes a first mounting portion disposed on the opening edge and being substantially perpendicular to the first and second main surfaces and a first electrode connection portion connected to the first electrode portion. The second metal terminal includes a second mounting portion disposed on the opening edge and being substantially perpendicular to the first and second main surfaces and a second electrode connection portion connected to the second electrode portion.
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公开(公告)号：US20150036262A1
公开(公告)日：2015-02-05
申请号：US14445894
申请日：2014-07-29
申请人： TDK Corporation
发明人： Nobutaka KAI , Yasuhiro OKUI , Satoru KINDAICHI , Hideki KANEKO , Tatsuya KOJIMA , Akitoshi YOSHII
CPC分类号： H01G4/1209 , H01G4/1218 , H01G4/1236 , H01G4/30
摘要： A multilayer ceramic electronic device comprising a lamination in which an internal electrode layer 3 and a dielectric layer 2 are laminated alternatively, wherein the dielectric layer 2 is comprised of a dielectric ceramic composition including a main component represented by a general formula of ABO3 and a rare-earth component R, and segregation phases 5 including the rare-earth component R are present in the dielectric layer 2. When the dielectric layer 2 is separated to six areas by dividing the dielectric layer 2 sandwiched by a pair of the internal dielectric layers 3 in the thickness direction, there are the R segregation phases present in two neighboring areas 2a respectively adjacent to the pair of the internal electrode layers 3 in the dielectric layer 3 at a ratio of double or more compared with the R segregation phases present in two central areas 2b located at a substantially center in the dielectric layer 2.
摘要翻译： 一种多层陶瓷电子器件，包括层叠体，其中内部电极层3和电介质层2交替层叠，其中介电层2由包含由通式ABO 3表示的主要成分和稀有金属的介电陶瓷组合物组成 - 电介质层2中存在包含稀土类成分R的偏析相5.当通过将介电层2夹在一对内部电介质层3之间的介电层2分开来将电介质层2分离为6个区域时 在厚度方向上，在与介电层3中的一对内部电极层3相邻的两个相邻区域2a中存在R偏析相，其比例为两倍以上，与存在于两个中心的R偏析相比较 位于电介质层2中的大致中心的区域2b。
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