Abstract:
A probe card for a testing apparatus of electronic devices comprises at least one testing head which houses a plurality of contact probes, each contact probe having at least one contact tip suitable to abut onto contact pads of a device under test, and a support plate of the testing head associated with a stiffener and an intermediate support, connected to the support plate and suitable to provide a spatial transformation of the distances between contact pads made on opposite sides thereof. Conveniently, the probe card comprises a support which is joined to the intermediate support, which is made of a material compatible with the printed circuit board technologies and has a coefficient of thermal expansion greater than 10×10−6° C.−1, the support being made of a metal material having a coefficient of thermal expansion lower than 6×10−6° C.−1.
Abstract:
It is described a contact probe for a testing head of an apparatus for testing electronic devices including a body essentially extended along a longitudinal direction between a contact tip and a contact head, that contact probe comprising at least one multilayer structure, in turn including a superposition of at least one inner layer or core and a first inner coating layer, and an outer coating layer that completely covers the multilayer structure and made of a material having a higher hardness than a material realizing the core.
Abstract:
A manufacturing method of a semi-finished product that includes a plurality of contact for a testing head of electronic devices comprises the steps of: providing a substrate made of a conductive material; and defining each contact probe by removing material from the substrate, each contact probes being anchored to the substrate by at least one bridge of material. The step of defining the contact probes includes a step of laser cutting, in correspondence with a contour of the contact probes and of that at least one bridge of material.
Abstract:
It is described a contact probe for a testing head of an apparatus for testing electronic devices including a body essentially extended along a longitudinal direction between a contact tip and a contact head, that contact probe comprising at least one multilayer structure, in turn including a superposition of at least one inner layer or core and a first inner coating layer, and an outer coating layer that completely covers the multilayer structure and made of a material having a higher hardness than a material realizing the core.
Abstract:
A manufacturing method of a semi-finished product that includes a plurality of contact for a testing head of electronic devices comprises the steps of: providing a substrate made of a conductive material; and defining each contact probe by removing material from the substrate, each contact probes being anchored to the substrate by at least one bridge of material. The step of defining the contact probes includes a step of laser cutting, in correspondence with a contour of the contact probes and of that at least one bridge of material.
Abstract:
A contact probe of a testing head of a testing apparatus of electronic devices comprises respective end portions adapted to contact respective contact pads and a body essentially extended in a longitudinal direction between the end portions, at least one end portion comprising an insert made of a first conductive material having a hardness being greater than a second conductive material making the contact probe which is supported by a section of the end portion, the section being made of the second conductive material and being shaped in a complementary way with respect to the insert and having respective abutting surfaces facing and adhering to respective abutting surfaces of the insert.
Abstract:
A probe card for a testing apparatus of electronic devices comprises at least one testing head which houses a plurality of contact probes, each contact probe having at least one contact tip suitable to abut onto contact pads of a device under test, and a support plate of the testing head associated with a stiffener and an intermediate support, connected to the support plate and suitable to provide a spatial transformation of the distances between contact pads made on opposite sides thereof. Conveniently, the probe card comprises a support which is joined to the intermediate support, which is made of a material compatible with the printed circuit board technologies and has a coefficient of thermal expansion greater than 10×10−6° C.−1, the support being made of a metal material having a coefficient of thermal expansion lower than 6×10−6° C.−1.