PROBE CARD FOR ELECTRONIC DEVICES
    1.
    发明申请

    公开(公告)号:US20190113539A1

    公开(公告)日:2019-04-18

    申请号:US16219783

    申请日:2018-12-13

    Abstract: A probe card for testing of electronic devices comprises a testing head with plural contact probes inserted into guide holes of an upper guide and a lower guide, and a space transformer, each of the contact probes having a first terminal portion projecting from the lower guide with a first length and ending with a contact tip adapted to abut onto a respective contact pad of a device to be tested, and a second terminal portion projecting from the upper guide with a second length and ending with a contact head adapted to abut onto a contact pad of the space transformer. The probe card comprises a spacer element interposed between the space transformer and the upper guide and removable to adjust the first length of the first terminal portion by changing the second length of the second terminal portion and approaching the upper guide and the space transformer.

    CONTACT PROBE FOR A PROBE HEAD
    2.
    发明公开

    公开(公告)号:US20230288447A1

    公开(公告)日:2023-09-14

    申请号:US18005880

    申请日:2021-07-08

    CPC classification number: G01R1/06738 G01R1/06761 H01R13/2492

    Abstract: A contact probe for a probe head for test equipment of electronic devices is provided. The contact probe includes a first end portion and a second end portion configured to realize a contact with suitable contact structures, and a body portion extended along a longitudinal development axis between respective the first and second end portions. The first end portion includes a base portion, a peripherally protruding element protruding from the base portion, and a hollow part having a base at a surface of the base portion and being surrounded by the peripherally protruding element. In addition, the peripherally protruding element is configured to penetrate into the contact structures.

    VERTICAL PROBE HEAD HAVING AN IMPROVED CONTACT WITH A DEVICE UNDER TEST

    公开(公告)号:US20210318355A1

    公开(公告)日:2021-10-14

    申请号:US17357833

    申请日:2021-06-24

    Inventor: Stefano FELICI

    Abstract: A probe head for testing a device under test integrated on a semiconductor wafer includes a plurality of contact probes, each having a first end and a second end, and at least one first lower guide and one second lower guide at the first end. The guides are parallel to each other and have a respective plurality of first and second guide holes for slidingly housing the contact probes. At least one third lower guide is substantially parallel to the first lower guide and to the second lower guide and includes a plurality of third guide holes for slidingly housing the contact probes. The guide holes are disposed in a shifted arrangement to eliminate a scrub movement of the first ends of each contact probe of the probe head.

    PROBE HEAD FOR REDUCED-PITCH APPLICATIONS

    公开(公告)号:US20230021227A1

    公开(公告)日:2023-01-19

    申请号:US17783440

    申请日:2020-12-17

    Abstract: A probe head for a testing apparatus integrated on a semiconductor wafer is disclosed having a first plurality of contact probes having a first transversal diameter, a second plurality of micro contact probes having a second transversal diameter, smaller than the first transversal diameter, and a flexible membrane having conductive tracks for connecting a first plurality contact probe with a corresponding second plurality micro contact probe. The second plurality contact probes are arranged between the testing apparatus and the flexible membrane, and the second plurality micro contact probes are arranged between the flexible membrane and a semiconductor wafer. The second plurality micro contact probes are configured to abut onto contact pads of a device under test integrated in the semiconductor wafer, with each first plurality contact probe being in contact with a corresponding second plurality micro contact probe through a conductive track of the flexible membrane to connect the device under test with the testing apparatus.

    VERTICAL PROBE HEAD WITH IMPROVED CONTACT PROPERTIES TOWARDS A DEVICE UNDER TEST

    公开(公告)号:US20210255218A1

    公开(公告)日:2021-08-19

    申请号:US17308636

    申请日:2021-05-05

    Inventor: Stefano FELICI

    Abstract: A probe head for testing a device under test includes an upper guide and a lower guide parallel to each other and spaced apart. Each of the guides is provided with a respective plurality of guide holes, a plurality of contact probes housed in the guide holes and provided each with a first end and with a second end, the first end being adapted to contact pads of a device under test. At least one additional guide is associated with one of the guides. The additional guide includes first guide holes, housing a first group of the contact probes, and second guide holes, housing a second group of the contact probes. The first and second guide holes are shifted with respect to the guide holes of the guide which said additional guide is associated with, and the shift of the first guide holes is in a direction opposite the shift of the second guide holes.

Patent Agency Ranking