公开(公告)号：US3436604A

公开(公告)日：1969-04-01

申请号：US3436604D

申请日：1966-04-25

Applicant: TEXAS INSTRUMENTS INC

Inventor： HYLTIN TOM M ,  KILBY JACK S ,  LUECKE GERALD ,  TOOMBS HAROLD D

IPC: H01L23/538 ,  H05K3/36 ,  H05K7/06 ,  H02B1/04 ,  H01L19/00

CPC classification number: H05K3/36 ,  H01L23/5384 ,  H01L24/48 ,  H01L2223/6622 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K7/06 ,  H01L2924/00 ,  H01L2224/45099

公开(公告)号：US3698082A

公开(公告)日：1972-10-17

申请号：US3698082D

申请日：1971-02-25

Applicant: TEXAS INSTRUMENTS INC

Inventor： HYLTIN TOM M ,  KILBY JACK S ,  LUECKE GERALD ,  TOOMBS HAROLD D

IPC: H01L21/48 ,  H01L23/538 ,  H01L23/66 ,  H05K7/06 ,  H01B13/00 ,  H05K3/28

CPC classification number: H05K7/06 ,  H01L21/486 ,  H01L23/5384 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6622 ,  H01L2224/16 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48235 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A method for fabricating an integrated circuit array supporting substrate having coaxial transmission lines formed about a core means in proper position for electrically connecting integrated circuit chips. After determining the position and function of the integrated chips mounted upon the core means, the substrate is fabricated by properly positioning insulated conductors in a frame designed to retain the conductors in a desired arrangement, folding the frame about the core, plating the insulated conductors, core and frame with metallized layers to form coaxial cables of the insulated conductors, encapsulating the device, and exposing the ends of the coaxial lines.

Abstract translation: 一种用于制造集成电路阵列支撑基板的方法，该集成电路阵列支撑基板具有围绕芯装置形成的同轴传输线，用于电连接集成电路芯片。 在确定安装在芯装置上的集成芯片的位置和功能之后，通过将绝缘导体适当地定位在设计成以期望的布置保持导体的框架中，将框架围绕芯部折叠，电镀绝缘导体， 芯和框架与金属化层形成绝缘导体的同轴电缆，封装该器件，并露出同轴线的端部。