公开(公告)号：US20190206828A1

公开(公告)日：2019-07-04

申请号：US16025603

申请日：2018-07-02

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Honglin GUO ,  Jason CHIEN ,  Byron Lovell WILLIAMS ,  Jeffrey Alan WEST ,  Anderson LI ,  Arvin Nono VERDEFLOR

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/495 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L24/49 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/85 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49505 ,  H01L2224/85013 ,  H01L2224/85913 ,  H01L2924/1205

Abstract: An integrated circuit package and methods for packaging an integrated circuit. In one example, a method for packaging an integrated circuit includes connecting input/output pads of a first die to terminals of a lead frame via palladium coated copper wires. An oxygen plasma is applied to the first die and the palladium coated copper wires. The first die and the palladium coated copper wires are encapsulated in a mold compound after application of the oxygen plasma.

公开(公告)号：US20200251440A1

公开(公告)日：2020-08-06

申请号：US16854823

申请日：2020-04-21

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Honglin GUO ,  Jason CHIEN ,  Byron Lovell WILLIAMS ,  Jeffrey Alan WEST ,  Anderson LI ,  Arvin Nono VERDEFLOR

IPC: H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L23/31 ,  H01L23/495 ,  H01L21/56

Abstract: An integrated circuit and methods for packaging the integrated circuit. In one example, a method for packaging an integrated circuit includes connecting input/output pads of a first integrated circuit die to terminals of a lead frame via palladium coated copper wires. An oxygen plasma is applied to the first integrated circuit die and the palladium coated copper wires. The first integrated circuit die and the palladium coated copper wires are encapsulated in a mold compound after application of the oxygen plasma.