公开(公告)号：US20230183880A1

公开(公告)日：2023-06-15

申请号：US18081637

申请日：2022-12-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian MEIER ,  Bernhard ZIEGLTRUM

IPC: C25D7/00 ,  G01M3/16 ,  C25D3/46 ,  C25D3/48 ,  C25D5/48

CPC classification number: C25D7/00 ,  C25D3/46 ,  C25D3/48 ,  C25D5/48 ,  G01M3/16

Abstract: In examples, an apparatus comprises a substrate having opposite first and second surfaces. The substrate includes a first opening through the substrate. The substrate includes a first sealing layer covering an inner surface of the first opening, with the inner surface extending between the first and second surfaces. The substrate includes contact pads on the second surface. The apparatus also comprises a fluid sensor having a sensor surface facing the second surface and the first opening. The apparatus further includes metal interconnects coupled between the sensor surface and the contact pads. The apparatus also includes a second sealing layer between the second surface and the sensor surface, in which the second sealing layer surrounds the metal interconnects and includes a second opening below the first opening, and at least part of the sensor surface is exposed through the first and second openings.

公开(公告)号：US20230182141A1

公开(公告)日：2023-06-15

申请号：US17877610

申请日：2022-07-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian MEIER ,  Bernhard ZIEGLTRUM ,  Marcus ZIMNIK ,  Bernhard WOLF

IPC: B01L3/00

CPC classification number: B01L3/50855 ,  B01L3/50857 ,  B01L2300/0663 ,  B01L2300/0829

Abstract: A modular titer plate assembly includes a multi-well plate, a sensor assembly, and a mainboard. The multi-well plate includes a two-dimensional array of wells. The sensor assembly is detachably mounted to the multi-well plate. The sensor assembly includes a two-dimensional array of sensors aligned with the two-dimensional array of wells. The mainboard is detachably mounted to the sensor assembly.

公开(公告)号：US20230187390A1

公开(公告)日：2023-06-15

申请号：US17957352

申请日：2022-09-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian MEIER ,  Bernhard ZIEGLTRUM ,  Helmut RINCK

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/32 ,  H01L24/16 ,  H01L24/73 ,  H01L24/08 ,  H01L2224/73204 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16257 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/05657 ,  H01L2224/05111 ,  H01L2224/05169 ,  H01L2224/05541 ,  H01L2224/08502 ,  H01L2224/26145 ,  H01L2224/26175 ,  H01L2924/1461

Abstract: In one example, a semiconductor die comprises: a semiconductor substrate having a circuit formed therein; one or more metal layers on the semiconductor substrate, the one or more metal layers coupled to the circuit; a metal interface structure on the one or more metal layers, in which the metal interface structure has opposite first and second surfaces, and the first surface faces the one or more metal layers; and a dissolvable metal layer on the second surface.