公开(公告)号：US20240006392A1

公开(公告)日：2024-01-04

申请号：US17852925

申请日：2022-06-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Anton Winkler ,  Christopher Manack ,  Jeffrey Morroni ,  Hidetoshi Inoue ,  Yuki Sato ,  Kenji Otake

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L49/02 ,  H01L21/54 ,  H01F27/29 ,  H01F27/32

CPC classification number: H01L25/165 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L23/3128 ,  H01L23/295 ,  H01L28/10 ,  H01L28/40 ,  H01L24/29 ,  H01L24/81 ,  H01L24/94 ,  H01L21/54 ,  H01F27/292 ,  H01F27/327 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/2919 ,  H01L2224/29186 ,  H01L2224/81447 ,  H01F41/005

Abstract: In one example, an integrated circuit comprises: a substrate; a semiconductor die; metal interconnects coupled between the semiconductor die and the substrate; an insulation layer coupled between the semiconductor die and the substrate, the insulation layer surrounding the metal interconnects; an inductor coupled to the substrate; and a magnetic material encapsulating the semiconductor die, the inductor, the metal interconnects and the insulation layer, the magnetic material having a different material from the insulation layer.