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公开(公告)号：US10104764B2
公开(公告)日：2018-10-16
申请号：US14218523
申请日：2014-03-18
Inventor： Frank Stepniak , Anton Winkler
Abstract: A system-in-a-package (SIP) has a semiconductor chip embedded in a dielectric substrate. An inductor is on a top surface of a substrate and is connected to the semiconductor chip. A thin film capacitor may be placed between the inductor and the dielectric substrate. A second thin film capacitor may be placed on the top surface of the semiconductor chip, or be embedded in the dielectric substrate with a thermal pad on a bottom surface of the substrate which is connected to the second thin film capacitor to facilitate heat dissipation.
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公开(公告)号：US20240006392A1
公开(公告)日：2024-01-04
申请号：US17852925
申请日：2022-06-29
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Anton Winkler , Christopher Manack , Jeffrey Morroni , Hidetoshi Inoue , Yuki Sato , Kenji Otake
CPC classification number: H01L25/165 , H01L24/16 , H01L24/32 , H01L24/73 , H01L23/3128 , H01L23/295 , H01L28/10 , H01L28/40 , H01L24/29 , H01L24/81 , H01L24/94 , H01L21/54 , H01F27/292 , H01F27/327 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/2919 , H01L2224/29186 , H01L2224/81447 , H01F41/005
Abstract: In one example, an integrated circuit comprises: a substrate; a semiconductor die; metal interconnects coupled between the semiconductor die and the substrate; an insulation layer coupled between the semiconductor die and the substrate, the insulation layer surrounding the metal interconnects; an inductor coupled to the substrate; and a magnetic material encapsulating the semiconductor die, the inductor, the metal interconnects and the insulation layer, the magnetic material having a different material from the insulation layer.
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公开(公告)号：US20240006259A1
公开(公告)日：2024-01-04
申请号：US17852979
申请日：2022-06-29
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Hidetoshi Inoue , Kenji Otake , Yuki Sato , Takafumi Ando , Jeffrey Morroni , Anton Winkler , Yi Yan
CPC classification number: H01L23/295 , H01L24/16 , H01L23/3128 , H01L25/165 , H01L28/10 , H01L2224/81447 , H01L24/81 , H01L21/561 , H01F27/327 , H01F41/005 , H01L2224/16227 , H01L28/40
Abstract: In one example, an integrated circuit comprises: a substrate; a semiconductor die; metal interconnects, the semiconductor die being mounted to the substrate via the metal interconnects; an inductor mounted to the substrate; and a magnetic material encapsulating the semiconductor die, the inductor, and the metal interconnects, the magnetic material including: coated metal particles, which are coated with a first insulation material; and a second insulation material, in which the coated metal particles are suspended.
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公开(公告)号：US20150061103A1
公开(公告)日：2015-03-05
申请号：US14012145
申请日：2013-08-28
Inventor： Christopher Daniel Manack , Frank Stepniak , Anton Winkler
CPC classification number: H01L23/49827 , H01L23/49805 , H01L23/49838 , H01L23/5389 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H01L2924/0002 , H05K3/0052 , H05K3/403 , H01L2924/00 , H01L2224/05599
Abstract: A method of making an electrical assembly includes making a laminate substrate, embedding a plurality of integrated circuit dies in the laminate substrate, forming a plurality of through-holes in the laminate substrate and adding conductive material to the through-holes, and making at least one saw cut extending through the laminate substrate and through the plurality of through-holes and the conductive material therein to form at least one laminate block with a cut face and a plurality of sectioned through-holes.
Abstract translation: 制造电气组件的方法包括制造层叠基板，将多个集成电路管芯嵌入层叠基板中，在层压基板中形成多个通孔并将导电材料添加到通孔，并至少使 一个锯切延伸穿过层叠基板并穿过多个通孔和其中的导电材料以形成具有切割面和多个分段通孔的至少一个层压块。
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