公开(公告)号：US20220223486A1

公开(公告)日：2022-07-14

申请号：US17538850

申请日：2021-11-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Tobias Bernhard FRITZ ,  Baher S. HAROUN ,  Benjamin Stassen COOK ,  Michael SZELONG ,  Ernst MUELLNER ,  Jeronimo SEGOVIA-FERNANDEZ

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/495 ,  G01L1/18

Abstract: An example semiconductor package includes a semiconductor die configured to detect a force. In addition, the semiconductor package includes a mold compound covering the semiconductor die. Further, the semiconductor package includes an engagement surface including a pattern of projections adapted to engage with a mounting surface on a member of interest.

公开(公告)号：US20250083142A1

公开(公告)日：2025-03-13

申请号：US18428825

申请日：2024-01-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian MEIER ,  Ernst MUELLNER

IPC: B01L3/00 ,  G01N27/22

Abstract: Example packaged integrated circuit (IC) sensors comprise a semiconductor substrate; a back end of line (BEOL) structure on the semiconductor substrate, the BEOL structure including multiple microfluidic channels, each microfluidic channel including a flow control device configured to selectively permit and restrict flow of fluids; multiple fluid sensors including first and second fluid sensors in the BEOL structure; a main reaction reservoir on the BEOL structure configured to store a reagent, in which the reagent is operable to replicate a nucleic strand in a biological sample to cause a pH change, and the first fluid sensor is exposed in the main reaction reservoir; an auxiliary reservoir on the BEOL structure and coupled to the main reaction reservoir via a microfluid channel of the multiple microfluidic channels, in which the second fluid sensor is exposed in the auxiliary reaction reservoir; and a controller coupled to the first and second fluid sensors.

公开(公告)号：US20220221353A1

公开(公告)日：2022-07-14

申请号：US17538782

申请日：2021-11-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Tobias Bernhard FRITZ ,  Baher S. HAROUN ,  Benjamin Stassen COOK ,  Sreenivasan Kalyani KODURI ,  Michael SZELONG ,  Ernst MUELLNER

IPC: G01L1/18 ,  H01L23/31 ,  H01L23/495

Abstract: A force sensor including a semiconductor die, and a die pad coupled to the semiconductor die, the semiconductor die configured to detect a force in the die pad. In addition, the force sensor includes a mold compound covering the semiconductor die and having an outer perimeter, a first side, and a second side opposite the first side, the outer perimeter extending between the first side and the second side, the die pad exposed out of the mold compound along the first side. Further, the force sensor includes a mounting frame engaged with the die pad along the second side of the mold compound, the mounting frame including multiple mounting pads extended outward in multiple directions from the outer perimeter.