公开(公告)号：US20230137953A1

公开(公告)日：2023-05-04

申请号：US17515113

申请日：2021-10-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jeronimo SEGOVIA-FERNANDEZ ,  Corina NISTORICA

IPC: G02B1/00 ,  H01L41/113 ,  H01L41/047 ,  H01L41/083 ,  H01L41/18

Abstract: An optical detector system includes a light source configured to emit light having a frequency spectrum and modulated in time, and an optical detector configured to detect an intensity of the light at a wavelength range within the frequency spectrum. The optical detector includes a piezoelectric layer, a first metal layer coupled to a first surface of the piezoelectric layer, a second metal layer coupled to a second surface of the piezoelectric layer, and a plasmonic metasurface coupled to the first metal layer and configured to absorb the light at the wavelength range, the plasmonic metasurface including metal structures and a dielectric layer disposed on the first metal layer. The optical detector system further includes a voltage detector coupled to the first metal layer and the second metal layer, the voltage detector configured to detect a voltage at a frequency of the modulated light.

公开(公告)号：US20220223486A1

公开(公告)日：2022-07-14

申请号：US17538850

申请日：2021-11-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Tobias Bernhard FRITZ ,  Baher S. HAROUN ,  Benjamin Stassen COOK ,  Michael SZELONG ,  Ernst MUELLNER ,  Jeronimo SEGOVIA-FERNANDEZ

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/495 ,  G01L1/18

Abstract: An example semiconductor package includes a semiconductor die configured to detect a force. In addition, the semiconductor package includes a mold compound covering the semiconductor die. Further, the semiconductor package includes an engagement surface including a pattern of projections adapted to engage with a mounting surface on a member of interest.

公开(公告)号：US20210214212A1

公开(公告)日：2021-07-15

申请号：US17135305

申请日：2020-12-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Ting-Ta YEN ,  Jeronimo SEGOVIA-FERNANDEZ ,  Bichoy BAHR ,  Benjamin COOK

IPC: B81B3/00 ,  B81C1/00

Abstract: A device includes a substrate having first and second layers and an insulator layer between the first and second layers. A microelectromechanical system (MEMS) structure is provide on a portion of the second layer. A trench is formed in the second layer and around at least a part of a periphery of the portion of the second layer. An undercut is formed in the insulator layer and adjacent to the portion of the second layer. The undercut separates the portion of the second layer from the first layer. First and second pinholes extend from a plane of the insulator layer and in the first layer. The first and second pinholes are in fluid communication with the undercut and the trench.

公开(公告)号：US20240039500A1

公开(公告)日：2024-02-01

申请号：US17877206

申请日：2022-07-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hakhamanesh MANSOORZARE ,  Ting-Ta YEN ,  Jeronimo SEGOVIA-FERNANDEZ ,  Bichoy BAHR

IPC: H03H3/007 ,  H03H9/10

CPC classification number: H03H3/0076 ,  H03H9/1057 ,  H03H2009/02283

Abstract: A micro-mechanical resonator die includes: micro-mechanical resonator die layers; a cavity formed in at least one of the micro-mechanical resonator die layers; and a micro-mechanical resonator suspended in the cavity. The micro-mechanical resonator includes: a base; a first resonator portion extending from the base along a first plane; and a second resonator portion extending from the base along a second plane. The first resonator portion is configured to operate in an out-of-plane flexural mode that displaces at least part of the first resonator portion out of the first plane. The second resonator portion is configured to operate in an out-of-plane flexural mode that displaces at least part of the second resonator portion out of the second plane and out-of-phase relative to the first resonator portion.

公开(公告)号：US20230275553A1

公开(公告)日：2023-08-31

申请号：US17683086

申请日：2022-02-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Steffen Paul LINK ,  Ting-Ta YEN ,  Jeronimo SEGOVIA-FERNANDEZ

IPC: H03H9/02 ,  H03H3/04 ,  H03H9/17

CPC classification number: H03H9/02015 ,  H03H3/04 ,  H03H9/175 ,  H03H2003/0435

Abstract: In some examples, an apparatus includes a first metal layer having a thickness, a piezoelectric material layer having a first side and a second side that is opposite the first side, the piezoelectric material layer first side abutting the first metal layer, the piezoelectric material layer second side having recesses, and a second metal layer abutting the piezoelectric material layer second side, the second metal layer having extensions that fill the recesses to form a metal frame that is at least partially recessed into the piezoelectric material layer. The first metal layer, the piezoelectric material layer, and the second metal layer form a resonator body. The metal frame has a shape governing a resonant mode of the resonator body.

公开(公告)号：US20220242722A1

公开(公告)日：2022-08-04

申请号：US17388301

申请日：2021-07-29

Applicant: Texas Instruments Incorporated

Inventor： Ting-Ta YEN ,  Jeronimo SEGOVIA-FERNANDEZ ,  Ricky Alan JACKSON ,  Benjamin COOK

IPC: B81B7/00

Abstract: A semiconductor system includes a substrate. The substrate has a front side and a back side. A device is formed on the front side of the substrate. A vertical spring is etched in the substrate about the device. A trench is etched in the front side of the substrate about the device. A wall of the trench forms a side of the vertical spring.

公开(公告)号：US20240391758A1

公开(公告)日：2024-11-28

申请号：US18794909

申请日：2024-08-05

Applicant: Texas Instruments Incorporated

Inventor： Ting-Ta YEN ,  Jeronimo SEGOVIA-FERNANDEZ ,  Ricky Alan JACKSON ,  Benjamin COOK

IPC: B81B7/00

Abstract: In one example, a method comprises etching a vertical spring in a substrate, the vertical spring encompassing a device formed on a front side of the substrate. The method further comprises bonding a cap to the front side of the substrate, the cap disposed over the device and the vertical spring.

公开(公告)号：US20240146309A1

公开(公告)日：2024-05-02

申请号：US18050451

申请日：2022-10-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jeronimo SEGOVIA-FERNANDEZ ,  Ali DJABBARI ,  Peter SMEYS

IPC: H03L1/02 ,  H03B5/04

CPC classification number: H03L1/027 ,  H03B5/04 ,  H03L7/099

Abstract: A circuit includes: a first resonator; a temperature compensation circuit including a resonator group-delay analyzer and a second resonator; oscillator control circuitry; and a controller. The resonator group-delay analyzer is configured to determine a group-delay parameter responsive to operations of the second resonator. The controller is configured to provide a control signal responsive to the group-delay parameter. The oscillator control circuitry is configured to adjust a frequency of an output signal of the oscillator control circuitry responsive to the control signal.

公开(公告)号：US20230170877A1

公开(公告)日：2023-06-01

申请号：US17537776

申请日：2021-11-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jeronimo SEGOVIA-FERNANDEZ ,  Bichoy BAHR ,  Ting-Ta YEN ,  Michael Henderson PERROTT ,  Zachary SCHAFFER

IPC: H03H9/17 ,  H03H9/13 ,  H03H9/02

CPC classification number: H03H9/175 ,  H03H9/131 ,  H03H9/02015

Abstract: A tunable bulk acoustic wave (BAW) resonator includes: a first electrode adapted to be coupled to an oscillator circuit; a second electrode adapted to be coupled to the oscillator circuit; and a piezoelectric layer between the first electrode and the second electrode; and a Bragg mirror. The Bragg mirror has: a metal layer; and a dielectric layer between the metal layer and either of the first electrode or the second electrode. The tunable BAW resonator also includes: a radio-frequency (RF) signal source having a first end and a second end, the first end coupled to the first electrode, and the second end coupled to the second electrode; and an amplifier circuit between either the first electrode or the second electrode and the Bragg mirror metal layer.