公开(公告)号：US11800636B2

公开(公告)日：2023-10-24

申请号：US17483726

申请日：2021-09-23

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Snehamay Sinha ,  Tapobrata Bandyopadhyay ,  Markarand Ramkrishna Kulkarni

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H01L21/02 ,  H05K3/42 ,  H01L23/06

CPC classification number: H05K1/0221 ,  H01L21/02008 ,  H01L23/06 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/115 ,  H05K3/42

Abstract: An electronic substrate includes a dielectric core, a first conducting layer on a first side of the core and a second conducting layer on the second side of the core opposite the first side. At least one differential coaxial through-via includes a first inner signal through-via that is at least electrical conductor lined for a first signal path and at least a second inner signal through-via that is also at least electrical conductor lined positioned side-by-side and being dielectrically isolated from the first inner signal through-via for a second signal path. An annular-shaped outer ground shield enclosure is at least conductor lined that surrounds and is dielectrically isolated from both the first and second inner signal through-vias.

公开(公告)号：US20230363083A1

公开(公告)日：2023-11-09

申请号：US18353295

申请日：2023-07-17

Applicant: Texas Instruments Incorporated

Inventor： Snehamay Sinha ,  Tapobrata Bandyopadhyay ,  Markarand Ramkrishna Kulkarni

IPC: H05K1/02 ,  H05K1/11 ,  H01L21/02 ,  H05K3/42 ,  H01L23/06

CPC classification number: H05K1/0221 ,  H05K1/115 ,  H01L21/02008 ,  H05K3/42 ,  H01L23/06 ,  H05K1/0222 ,  H05K1/0245

Abstract: An electronic substrate includes a dielectric core, a first conducting layer on a first side of the core and a second conducting layer on the second side of the core opposite the first side. At least one differential coaxial through-via includes a first inner signal through-via that is at least electrical conductor lined for a first signal path and at least a second inner signal through-via that is also at least electrical conductor lined positioned side-by-side and being dielectrically isolated from the first inner signal through-via for a second signal path. An annular-shaped outer ground shield enclosure is at least conductor lined that surrounds and is dielectrically isolated from both the first and second inner signal through-vias.

公开(公告)号：US12063735B2

公开(公告)日：2024-08-13

申请号：US18353295

申请日：2023-07-17

Applicant: Texas Instruments Incorporated

Inventor： Snehamay Sinha ,  Tapobrata Bandyopadhyay ,  Markarand Ramkrishna Kulkarni

IPC: H05K1/00 ,  H01L21/02 ,  H01L23/06 ,  H05K1/02 ,  H05K1/11 ,  H05K3/42

CPC classification number: H05K1/0221 ,  H01L21/02008 ,  H01L23/06 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/115 ,  H05K3/42

Abstract: An electronic substrate includes a dielectric core, a first conducting layer on a first side of the core and a second conducting layer on the second side of the core opposite the first side. At least one differential coaxial through-via includes a first inner signal through-via that is at least electrical conductor lined for a first signal path and at least a second inner signal through-via that is also at least electrical conductor lined positioned side-by-side and being dielectrically isolated from the first inner signal through-via for a second signal path. An annular-shaped outer ground shield enclosure is at least conductor lined that surrounds and is dielectrically isolated from both the first and second inner signal through-vias.

公开(公告)号：US20220015225A1

公开(公告)日：2022-01-13

申请号：US17483726

申请日：2021-09-23

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Snehamay Sinha ,  Tapobrata Bandyopadhyay ,  Markarand Ramkrishna Kulkarni

IPC: H05K1/02 ,  H05K1/11 ,  H01L21/02 ,  H05K3/42 ,  H01L23/06

Abstract: An electronic substrate includes a dielectric core, a first conducting layer on a first side of the core and a second conducting layer on the second side of the core opposite the first side. At least one differential coaxial through-via includes a first inner signal through-via that is at least electrical conductor lined for a first signal path and at least a second inner signal through-via that is also at least electrical conductor lined positioned side-by-side and being dielectrically isolated from the first inner signal through-via for a second signal path. An annular-shaped outer ground shield enclosure is at least conductor lined that surrounds and is dielectrically isolated from both the first and second inner signal through-vias.