公开(公告)号：US11273625B2

公开(公告)日：2022-03-15

申请号：US16710857

申请日：2019-12-11

Applicant: The Clorox Company

Inventor： Nikhil P. Dani ,  Joerg Hendrix ,  Scott Wood ,  Hubert Chan ,  Mark Pszczolkowski ,  Daniela Fritter

IPC: B32B23/02 ,  B32B5/02 ,  B32B27/32 ,  B32B27/12 ,  B08B1/00 ,  B32B27/10 ,  B32B29/00 ,  D21H13/14 ,  D21H27/00 ,  D21H27/02 ,  D21H27/36 ,  A47L13/17 ,  C11D17/04 ,  C11D3/30 ,  B32B7/12 ,  D21F11/00 ,  D21F11/14

Abstract: Methods for forming multi-layer substrates including top and bottom surface layers and a melt softened thermoplastic material layer between the exterior surface layers, where the thermoplastic material includes polyethylene or has a tan delta value of 0.2 to 0.4 within the temperature range of 100° F.−350° F. The 3 (or more) layers are assembled, and heated, melt softening the thermoplastic material, causing bonding of the thermoplastic layer to the exterior surface layers. A cleaning composition may be loaded onto the multi-layer substrate, where a fluid pathway through the melted thermoplastic material allows the cleaning composition to travel between the surface layers. Adhesion between the surface layers and the thermoplastic layer is provided by the thermoplastic material itself, which bonds to groups of fibers in the surface layers. The process does not require chemical adhesives, any processing water, drying, or the like, so as to be possible with low capital investment.

公开(公告)号：US11858238B2

公开(公告)日：2024-01-02

申请号：US17665383

申请日：2022-02-04

Applicant: THE CLOROX COMPANY

Inventor： Nikhil P. Dani ,  Joerg Hendrix ,  Scott Wood ,  Hubert Chan ,  Mark Pszczolkowski ,  Daniela Fritter

IPC: B32B23/02 ,  B32B27/32 ,  B32B27/12 ,  B32B7/12 ,  B32B27/10 ,  B32B29/00 ,  D21H13/14 ,  D21H27/00 ,  D21H27/02 ,  A47L13/17 ,  B32B5/02 ,  C11D17/04 ,  C11D3/30 ,  B08B1/00 ,  D21F11/00 ,  D21F11/14 ,  D21H27/36

CPC classification number: B32B23/02 ,  B08B1/006 ,  B32B5/022 ,  B32B7/12 ,  B32B27/10 ,  B32B27/12 ,  B32B27/32 ,  B32B29/002 ,  C11D3/30 ,  C11D17/041 ,  D21F11/006 ,  D21F11/14 ,  D21H13/14 ,  D21H27/002 ,  D21H27/02 ,  D21H27/36 ,  A47L13/17 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2260/04 ,  B32B2262/062 ,  B32B2274/00 ,  B32B2307/724 ,  B32B2307/728 ,  B32B2367/00 ,  B32B2432/00 ,  Y10T428/3188 ,  Y10T428/31855

Abstract: Methods for forming multi-layer substrates including top and bottom surface layers and a melt softened thermoplastic material layer between the exterior surface layers, where the thermoplastic material includes polyethylene or has a tan delta value of 0.2 to 0.4 within the temperature range of 100° F.-350° F. The 3 (or more) layers are assembled, and heated, melt softening the thermoplastic material, causing bonding of the thermoplastic layer to the exterior surface layers. A cleaning composition may be loaded onto the multi-layer substrate, where a fluid pathway through the melted thermoplastic material allows the cleaning composition to travel between the surface layers. Adhesion between the surface layers and the thermoplastic layer is provided by the thermoplastic material itself, which bonds to groups of fibers in the surface layers. The process does not require chemical adhesives, any processing water, drying, or the like, so as to be possible with low capital investment.

公开(公告)号：US11472164B2

公开(公告)日：2022-10-18

申请号：US16710676

申请日：2019-12-11

Applicant: The Clorox Company

Inventor： Nikhil P. Dani ,  Joerg Hendrix ,  Scott Wood ,  Hubert Chan ,  Daniela Fritter

IPC: B32B23/02 ,  B32B5/02 ,  B32B27/32 ,  B32B27/12 ,  B32B7/12 ,  B32B27/10 ,  C11D17/04 ,  C11D3/30 ,  B08B1/00 ,  B32B29/00 ,  D21F11/00 ,  D21F11/14 ,  D21H13/14 ,  D21H27/00 ,  D21H27/02 ,  D21H27/36 ,  A47L13/17

Abstract: Multi-layer substrates comprising top and bottom surface layers comprised of synthetic nonwoven fibers, and a melted thermoplastic material layer between the top and bottom layers, where the thermoplastic material comprises polyethylene or has a tan delta value of 0.2 to 0.4 within the temperature range of 100° F. to 350° F. The multi-layer substrate can include a cleaning composition loaded onto the multi-layer substrate, where a fluid pathway through the melted thermoplastic material allows the cleaning composition to travel from the top surface layer to the bottom surface layer. The multi-layer substrate may be void of chemical adhesives, where adhesion between the top surface layer and the thermoplastic layer, and between the bottom surface layer and the thermoplastic layer is instead provided by the thermoplastic material itself, which bonds to groups of fibers in the top and bottom surface layers that are in contact with the thermoplastic material as it melts.