公开(公告)号：US20240258262A1

公开(公告)日：2024-08-01

申请号：US18426144

申请日：2024-01-29

申请人： THE INDIUM CORPORATION OF AMERICA

发明人： Milos Lazic ,  Richard McDonough

IPC分类号： H01L23/00 ,  H01L23/367

CPC分类号： H01L24/26 ,  H01L23/367 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/2732 ,  H01L2224/29105 ,  H01L2224/3207 ,  H01L2224/32221 ,  H01L2224/83201 ,  H01L2924/0103 ,  H01L2924/01049 ,  H01L2924/0105

摘要： Described are a double barrier system and method used to contain a thermal interface material to avoid unwanted interactions of the thermal interface material with other metals or components within a semiconductor device. In one implementation, a semiconductor assembly includes: a substrate; a heat generating device including a first surface attached to the substrate; a first barrier surrounding and in touching relation with the heat generating device; a second barrier surrounding the first barrier such that there is an area between the first barrier and the second barrier; a heat transferring device; and a thermal interface material between and in touching relation with the heat transferring device and a second surface of the heat generating device opposite the first surface.

公开(公告)号：US20240243091A1

公开(公告)日：2024-07-18

申请号：US18415074

申请日：2024-01-17

申请人： THE INDIUM CORPORATION OF AMERICA

发明人： Richard McDonough ,  Milos Lazic ,  David P. Socha

IPC分类号： H01L23/00 ,  H01L21/48

CPC分类号： H01L24/27 ,  H01L21/4882 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/16221 ,  H01L2224/2743 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2224/29171 ,  H01L2224/2918 ,  H01L2224/29184 ,  H01L2224/32245 ,  H01L2224/32506 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2924/01048 ,  H01L2924/0133

摘要： Thermal interface materials deposited in solid form, in a layered manner, and their uses in electronics assembly are described. In one implementation, a method includes: forming an assembly including multiple solid metal thermal interface materials (TIMs) between a first device and a second device such that a first surface of the solid metal TIMs is in touching relation with a surface of the first device, and a second surface of the solid metal TIMs opposite the first surface is in touching relation with a surface of the second device, the solid metal TIMs including a first solid metal TIM and a second solid metal TIM; and forming a liquid TIM alloy from the solid metal TIMs by heating the assembly above a first solidus temperature of the first solid metal TIM, the liquid TIM alloy having a second solidus temperature below the first solidus temperature.