公开(公告)号：US20190194502A1

公开(公告)日：2019-06-27

申请号：US16330517

申请日：2017-08-17

申请人： THREEBOND CO., LTD.

发明人： Soichi OTA ,  Hitoshi MAFUNE ,  Makoto KATO ,  Tomoya KODAMA

IPC分类号： C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J163/10 ,  C09J201/00 ,  H01B1/20

CPC分类号： C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J163/10 ,  C09J201/00 ,  H01B1/00 ,  H01B1/20

摘要： Conventionally, when an adherend is nickel or the like, it has been difficult to realize an electroconductive adhesive that lowers connection resistance in various kinds of thermocurable curing resins. However, it is possible to provide an electroconductive adhesive, in the case where the adherend is nickel or the like, which reduces connection resistance in various kinds of thermocurable curing resins while simultaneously maintaining storage stability to have good handleability. The present description provides a thermocurable electroconductive adhesive including the following components (A) to (D): Component (A): a curable resin, Component (B): a thermal curing agent that cures Component (A), Component (C): an organometallic complex, and Component (D): electroconductive particles.

公开(公告)号：US20190194443A1

公开(公告)日：2019-06-27

申请号：US16328409

申请日：2017-08-24

申请人： THREEBOND CO., LTD.

发明人： Soichi OTA ,  Yusuke KUWAHARA ,  Hitoshi MAFUNE ,  Tomoya KODAMA ,  Makoto KATO ,  Masayuki OSADA

IPC分类号： C08L33/10 ,  C08F290/06 ,  C08F20/28 ,  C08K5/14 ,  C08K3/08 ,  C09J9/02 ,  C09J133/10 ,  C08K9/04

CPC分类号： C08L33/10 ,  C08F4/34 ,  C08F20/28 ,  C08F290/06 ,  C08F290/067 ,  C08K3/08 ,  C08K5/14 ,  C08K9/04 ,  C08K2003/0806 ,  C08K2201/001 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J133/10 ,  H01B1/20

摘要： In the (meth)acrylic resin composition of the present invention, when a sealed container is used, it is possible to achieve both storage stability in an atmosphere at 25° C. and low temperature curability in an atmosphere at 60 to 140° C., and further, properties thereof can be exhibited even in an electroconductive adhesive including electroconductive particles. The present invention is a (meth)acrylic resin composition including the following components (A) to (C): component (A): a urethane modified oligomer having a (meth)acrylic group, component (B): a monomer having a hydroxyl group and/or a carboxylic group and one (meth)acrylic group in a molecule in which a surface tension is 25 to 45 mN/m, and component (C): an organic peroxide having a specific structure.

公开(公告)号：US20190177582A1

公开(公告)日：2019-06-13

申请号：US16321555

申请日：2017-07-28

申请人： THREEBOND CO., LTD.

发明人： Soichi OTA ,  Takashi SUZUKI ,  Makoto KATO ,  Hitoshi MAFUNE ,  Masayuki OSADA

IPC分类号： C09J163/00 ,  C09J9/02

摘要： An epoxy resin composition which exhibits excellent storage stability while having a low initial viscosity and favorable low temperature curability and an electro-conductive adhesive containing the same. An epoxy resin composition includes components (A) to (C): component (A): an epoxy resin (excluding the following component (B)); component (B): an epoxy resin having one epoxy group in a molecule and a surface tension of from 28.5 to 35.0 mN/m; and component (C): a latent curing agent.

公开(公告)号：US20210277289A1

公开(公告)日：2021-09-09

申请号：US16330526

申请日：2017-08-17

申请人： THREEBOND CO., LTD.

发明人： Tomoya KODAMA ,  Soichi OTA ,  Masayuki OSADA ,  Hitoshi MAFUNE ,  Makoto KATO ,  Kanako MORII

IPC分类号： C09J9/02 ,  C09J11/06 ,  C09J11/04 ,  C09J133/08 ,  H01B1/20

摘要： Conventionally, there was a need to add a large amount of electroconductive particles for improving conductivity, but when the electroconductive particles were added too much, initial viscosity was increased, and at the same time, it was difficult to stabilize preservation stability. However, conductivity can be improved without adding a large amount of the electroconductive particles by selecting a monomer, and at the same time, preservation stability can be stabilized by using certain electroconductive particles. A thermocurable electroconductive adhesive including components (A) to (D): component (A): an oligomer having a (meth)acryl group; component (B): a monomer having one methacryl group in a molecule; component (C): an organic peroxide having a specific structure; and component (D): electroconductive particles which are surface-treated with a stearic acid.

公开(公告)号：US20190177579A1

公开(公告)日：2019-06-13

申请号：US16306670

申请日：2017-06-23

申请人： THREEBOND CO., LTD.

发明人： Soichi OTA ,  Makoto KATO ,  Hitoshi MAFUNE ,  Masayuki OSADA

IPC分类号： C09J9/02 ,  C09J175/14 ,  C09J5/06 ,  C08K9/04 ,  C08K3/08 ,  C08G18/09 ,  C08G18/32 ,  H01B1/22

摘要： A thermosetting conductive adhesive that can exhibit high conductivity (low connection resistance) when cured at a high temperature in a short time. The present invention also provides a thermosetting conductive adhesive that has excellent adhesive strength when cured at a high temperature in a short time. The thermosetting conductive adhesive according to the present invention includes components (A) to (D): component (A): a urethane-modified polyfunctional (meth)acrylate oligomer that is either an aromatic urethane-modified (meth)acrylate oligomer having six (meth)acryl groups in the molecule or an aliphatic urethane-modified (meth)acrylate oligomer having two (meth)acryl groups in the molecule; component (B): a monofunctional (meth)acrylate monomer; component (C): an organic peroxide; and component (D): conductive particles, in which when the component (A) is an aliphatic urethane-modified (meth)acrylate oligomer having two (meth)acryl groups in the molecule, the component (B) is a monofunctional acrylate monomer.