公开(公告)号：US20210082691A1

公开(公告)日：2021-03-18

申请号：US17014484

申请日：2020-09-08

Applicant: Tokyo Electron Limited

Inventor： Shogo FUKUI ,  Pohan HUANG

IPC: H01L21/02 ,  F26B5/00 ,  B08B7/00

Abstract: There is provided a method of cleaning a substrate processing apparatus in which a drying process of drying a substrate whose surface is wet with a liquid is performed by bring the substrate into contact with a supercritical fluid, the method including: diffusing a first cleaning fluid in an interior of the substrate processing apparatus, the first cleaning fluid being obtained by mixing the supercritical fluid with a solvent containing polar molecules and having a lower boiling point than a boiling point of the liquid; and discharging the first cleaning fluid from the interior of the substrate processing apparatus, that occurs after the diffusing the first cleaning fluid.

公开(公告)号：US20240096650A1

公开(公告)日：2024-03-21

申请号：US18367742

申请日：2023-09-13

Applicant: Tokyo Electron Limited

Inventor： Shogo FUKUI ,  Masami YAMASHITA ,  Tomofumi EMURA

IPC: H01L21/67

CPC classification number: H01L21/67023 ,  H01L21/6719 ,  H01L21/67248 ,  H01L21/67253

Abstract: A substrate processing apparatus of processing a substrate by using a processing fluid in a supercritical state, the substrate processing apparatus includes: a processing container in which the substrate is accommodated; a supply line connecting the processing container to a fluid source configured to send out the processing fluid in the supercritical state; a discharge line configured to discharge the processing fluid from the processing container; a control valve interposed in the discharge line; and a controller configured to control a pressure in the processing container by adjusting an opening degree of the control valve. In a circulation process in which the processing fluid is supplied to the processing container from the supply line, the controller is configured to adjust the opening degree of the control valve such that each of a pressure-lowering step and a pressure-raising step.

公开(公告)号：US20250140585A1

公开(公告)日：2025-05-01

申请号：US18835377

申请日：2023-01-26

Applicant: Tokyo Electron Limited

Inventor： Shogo FUKUI

IPC: H01L21/67 ,  H01L21/02

Abstract: A substrate processing apparatus includes a processing container, a fluid supplier, a heating mechanism, a temperature meter, and a controller, and dries a substrate having a liquid film using a supercritical fluid. The controller acquires information on a temperature of an interior of the processing container measured by the temperature meter from when the substrate is loaded into the processing container until the substrate is unloaded therefrom, stores temperature-time data, extracts a temperature from the stored temperature-time data during a temperature adjustment target period, determines whether or not correction of a set temperature of the heating mechanism is necessary based on comparison between the temperature during the temperature adjustment target period and a reference temperature held in advance, and, when the correction of the set temperature is determined to be necessary, controls an output of the heating mechanism according to the corrected set temperature.

公开(公告)号：US20230005763A1

公开(公告)日：2023-01-05

申请号：US17808160

申请日：2022-06-22

Applicant: Tokyo Electron Limited

Inventor： Kazuki KOSAI ,  Hideaki UDOU ,  Seiya FUJIMOTO ,  Yudai TAKANAGA ,  Takahito NAKASHOYA ,  Shogo FUKUI ,  Atsushi ANAMOTO ,  So OSADA

IPC: H01L21/67 ,  B08B3/02 ,  B08B13/00 ,  B08B3/14

Abstract: An apparatus includes: a tank storing a processing liquid; a circulation line; a branch line; a processing part for supplying the processing liquid to a substrate at the branch line; a discharge part for reducing a storage amount of the processing liquid; a supply part for supplying a new processing liquid to the tank; and a controller including: a first determination part for determining whether the storage amount is less than a lower limit value; a first replenishment controller for replenishing the processing liquid to the tank when the storage amount is less than the lower limit value; a calculation part for calculating a replenishment amount of the processing liquid; and a second replenishment controller for reducing the storage amount and replenishing the processing liquid to the tank when a calculation value of the replenishment amount is less than a set value.

公开(公告)号：US20210111043A1

公开(公告)日：2021-04-15

申请号：US16603044

申请日：2018-03-23

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yusuke TAKAMATSU ,  Yasuhiro TAKAKI ,  Shinichi UMENO ,  Shogo FUKUI

IPC: H01L21/67 ,  H01L21/687 ,  B08B3/08 ,  B01D19/02 ,  B01D19/00 ,  B01D29/52 ,  B05C11/10 ,  B05C5/02

Abstract: A liquid supply device includes: a storage tank configured to store a processing liquid including a first processing liquid (sulfuric acid) and a second processing liquid (hydrogen peroxide solution); a circulation path having a first pipeline through which the processing liquid passes in a horizontal direction, and configured to circulate the processing liquid stored in the storage tank; a branch path configured to supply the processing liquid to a processing unit; and a branching part having an opening for allowing the processing liquid to flow out from the first pipeline to the branch path, wherein the opening is formed in the branching part and formed below a periphery of the first pipeline when the first pipeline is viewed in section.

公开(公告)号：US20210043471A1

公开(公告)日：2021-02-11

申请号：US16936977

申请日：2020-07-23

Applicant: Tokyo Electron Limited

Inventor： Katsuya NAKATA ,  Shogo FUKUI

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/02

Abstract: A substrate processing apparatus performs a drying process for drying a substrate with a liquid film formed on a pattern formation surface thereof, using a processing fluid in a supercritical state. The substrate processing apparatus includes a processing container, a holder, and a processing liquid supply. The processing container accommodates the substrate. The holder holds the substrate inside the processing container. The processing liquid supply supplies a processing fluid into the processing container. Further, the holder includes a base, a plurality of support members, and a lifting mechanism. The base is disposed below the substrate. The plurality of support members are provided on the base, and support the substrate from below. The lifting mechanism moves the plurality of support members up and down.