公开(公告)号：US20210327688A1

公开(公告)日：2021-10-21

申请号：US17272945

申请日：2019-08-26

Applicant: Tokyo Electron Limited

Inventor： Yasuharu SASAKI ,  Yohei UCHIDA

IPC: H01J37/32

Abstract: A mounting base for placing a substrate to be subjected to a predetermined processing is provided. The mounting base includes an electrostatic chuck for electrostatically attracting and holding the substrate, a first edge ring that is disposed around the substrate and is transferrable, a second edge ring fixed around the first edge ring, a lifter pin for raising and lowering the first edge ring, a first electrode disposed in a position facing the first edge ring in the electrostatic chuck to electrostatically attract and hold the first edge ring; and a second electrode disposed in a position facing the second edge ring in the electrostatic chuck to electrostatically attract and hold the second edge ring.

公开(公告)号：US20240347322A1

公开(公告)日：2024-10-17

申请号：US18751991

申请日：2024-06-24

Applicant: Tokyo Electron Limited

Inventor： Yasuharu SASAKI ,  Shoichiro MATSUYAMA ,  Yohei UCHIDA

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01J37/32642 ,  H01J37/32715 ,  H01L21/6833 ,  H01L21/68735 ,  H01L21/68757

Abstract: An electrostatic chuck according to an exemplary embodiment includes a first region and a second region. The first region has a first upper surface. The first region is configured to hold a substrate disposed on the first upper surface. The second region has a second upper surface. The second region extends in a circumferential direction to surround the first region. The second region is configured to support a focus ring mounted on the second upper surface. The first upper surface and the second upper surface extend along a single flat surface. The first region and the second region provide a space therebetween to separate the first upper surface and the second upper surface from each other.

公开(公告)号：US20200219753A1

公开(公告)日：2020-07-09

申请号：US16737267

申请日：2020-01-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yohei UCHIDA ,  Jun HIROSE

IPC: H01L21/687 ,  H01L21/683 ,  H01J37/32

Abstract: A mounting table includes a wafer mounting surface mounting a wafer, a ring mounting surface disposed at a radially outer side of the wafer mounting surface and mounting a first ring having a first engaging portion and a second ring having a second engaging portion to be engaged with the first engaging portion, a lifter pin, and a driving mechanism. The second ring has a through-hole extends to reach a bottom surface of the first engaging portion, and the ring mounting surface has a hole at a position corresponding to the through-hole. A lifter pin has a first holding part that fits into the through-hole and a second holding part that extends from the first holding part and has a part protruding from the first holding part. The lifter pin is accommodated in the hole, and a driving mechanism vertically moves the lifter pin.

公开(公告)号：US20200152428A1

公开(公告)日：2020-05-14

申请号：US16677847

申请日：2019-11-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasuharu SASAKI ,  Yohei UCHIDA

IPC: H01J37/32

Abstract: A substrate support for a plasma processing apparatus includes a first support area configured to support a substrate placed thereon; a second support area configured to support a focus ring placed thereon, and extending in a circumferential direction outward in a radial direction with respect to the first support area; a conductive structure configured to be connected to the focus ring; and a holder configured to hold the connection member to press the connection member downward, and also to cause the connection member to press the surface of the focus ring. The conductive structure includes a first conductive path which provides a terminal area outward in the radial direction with respect to the second support area, and a connection member configured to electrically connect the focus ring and the terminal area, and disposed on the terminal area to face a surface of the focus ring.

公开(公告)号：US20190279894A1

公开(公告)日：2019-09-12

申请号：US16293788

申请日：2019-03-06

Applicant: Tokyo Electron Limited

Inventor： Yohei UCHIDA ,  Naoki SUGAWA ,  Katsushi ABE ,  Tsuyoshi HIDA

IPC: H01L21/687 ,  H01L21/67 ,  H01J37/32

Abstract: A placement apparatus for placing a workpiece is provided. The placement apparatus includes a stage on which a workpiece can be placed in a processing vessel; an edge ring including a locking part which is disposed on the stage so as to surround a periphery of the workpiece; a conductive connecting member connected with the edge ring at the locking part; and a first contacting member configured to cause the edge ring to contact the stage, while the edge ring is connected with the connecting member.

公开(公告)号：US20230020793A1

公开(公告)日：2023-01-19

申请号：US17956110

申请日：2022-09-29

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yohei UCHIDA ,  Jun HIROSE

IPC: H01L21/687 ,  H01L21/683 ,  H01J37/32

Abstract: A mounting table includes a wafer mounting surface mounting a wafer, a ring mounting surface disposed at a radially outer side of the wafer mounting surface and mounting a first ring having a first engaging portion and a second ring having a second engaging portion to be engaged with the first engaging portion, a lifter pin, and a driving mechanism. The second ring has a through-hole extends to reach a bottom surface of the first engaging portion, and the ring mounting surface has a hole at a position corresponding to the through-hole. A lifter pin has a first holding part that fits into the through-hole and a second holding part that extends from the first holding part and has a part protruding from the first holding part. The lifter pin is accommodated in the hole, and a driving mechanism vertically moves the lifter pin.

公开(公告)号：US20220336257A1

公开(公告)日：2022-10-20

申请号：US17811121

申请日：2022-07-07

Applicant: Tokyo Electron Limited

Inventor： Yohei UCHIDA ,  Naoki SUGAWA ,  Katsushi ABE ,  Tsuyoshi HIDA

IPC: H01L21/687 ,  H01J37/32 ,  H01L21/67 ,  H01L21/683

Abstract: A placement apparatus for placing a workpiece is provided. The placement apparatus includes a stage on which a workpiece can be placed in a processing vessel; an edge ring including a locking part which is disposed on the stage so as to surround a periphery of the workpiece; a conductive connecting member connected with the edge ring at the locking part; and a first contacting member configured to cause the edge ring to contact the stage, while the edge ring is connected with the connecting member.

公开(公告)号：US20210366694A1

公开(公告)日：2021-11-25

申请号：US16644009

申请日：2019-06-03

Applicant: Tokyo Electron Limited

Inventor： Yasuharu SASAKI ,  Shoichiro MATSUYAMA ,  Yohei UCHIDA

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/687

Abstract: An electrostatic chuck according to an exemplary embodiment includes a first region and a second region. The first region has a first upper surface. The first region is configured to hold a substrate disposed on the first upper surface. The second region has a second upper surface. The second region extends in a circumferential direction to surround the first region. The second region is configured to support a focus ring mounted on the second upper surface. The first upper surface and the second upper surface extend along a single flat surface. The first region and the second region provide a space therebetween to separate the first upper surface and the second upper surface from each other.