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公开(公告)号：US20240290897A1
公开(公告)日：2024-08-29
申请号：US18206158
申请日：2023-06-06
发明人： CHIA-SHUAI CHANG , CHIEN-HUNG LIN , WEN-FU YU , WEI-LI WANG , BAE-YINN HWANG , JYUN-HUEI JIANG
IPC分类号： H01L31/0475 , H01L23/00 , H01L23/31 , H01L31/0216 , H01L31/048
CPC分类号： H01L31/0475 , H01L23/3114 , H01L23/3142 , H01L24/45 , H01L31/02164 , H01L31/048
摘要： A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a plurality of adhesive rings disposed on the sensor chip, a plurality of filtering lenses respectively adhered to the adhesive rings, and an encapsulant that surrounds the above components. A sensing region of the sensor chip has a layout boundary and a plurality of sub-regions that are defined by the layout boundary and that are separate from each other. The adhesive rings are disposed on the sensing region, and each of the adhesive rings surrounds one of the sub-regions. Each of the filtering lenses, a corresponding one of the adhesive rings, and a corresponding one of the sub-regions jointly define a buffering space. The encapsulant is formed on the substrate and covers the layout boundary of the sensor chip.
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公开(公告)号：US20240204020A1
公开(公告)日：2024-06-20
申请号：US18474201
申请日：2023-09-25
发明人： CHIEN-HUNG LIN , BAE-YINN HWANG , WEN-FU YU , WEI-LI WANG
IPC分类号： H01L27/146 , H01L31/0232
CPC分类号： H01L27/14625 , H01L27/14685 , H01L31/02327 , H01L2933/0058
摘要： An optical package structure and a method for manufacturing the same are provided. The optical package structure includes an optical element, a bonding structural member, and a light transmittable member. The bonding structural member is bonded to a surface of the optical element. The bonding structural member includes a first bonding layer, a light-absorption layer, and a second bonding layer. The first bonding layer and the second bonding layer are made of an opaque material. The light-absorption layer is disposed between the first bonding layer and the second bonding layer. The light transmittable member is bonded to the bonding structural member and spaced apart from the optical element. The light-absorption layer is configured to absorb light emitted to the bonding structural member.
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公开(公告)号：US20240128291A1
公开(公告)日：2024-04-18
申请号：US18206146
申请日：2023-06-06
发明人： CHIA-SHUAI CHANG , CHIEN-HUNG LIN , WEI-LI WANG , WEN-FU YU , BAE-YINN HWANG
IPC分类号： H01L27/146 , H01L23/00
CPC分类号： H01L27/14618 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/29017 , H01L2224/32225 , H01L2224/48227 , H01L2224/73215
摘要： A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer has two adhering surfaces having a same area and a middle cross section located at a middle position between the two adhering surfaces. An area of the middle cross section is 115% to 200% of an area of any one of the two adhering surfaces. The adhesive layer can provide for light to travel therethrough, and enables the light therein to change direction and to attenuate. The sensor chip, the adhesive layer, and the light-permeable layer are embedded in the encapsulant, and an outer surface of the light-permeable layer is at least partially exposed from the encapsulant.
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公开(公告)号：US20240337779A1
公开(公告)日：2024-10-10
申请号：US18515167
申请日：2023-11-20
发明人： CHIA-SHUAI CHANG , CHIEN-HUNG LIN , WEN-FU YU , WEI-LI WANG , BAE-YINN HWANG , JYUN-HUEI JIANG
IPC分类号： G02B5/02
CPC分类号： G02B5/0215
摘要： An optical device includes an electronic component, a light-permeable layer, and a ring-shaped adhesive layer that is sandwiched between the electronic component and the light-permeable layer. The ring-shaped adhesive layer surrounds an optical region of the electronic component and includes a plurality of light-weakening slots that are formed on an inner side surface thereof. The light-weakening slots are in a ring-shaped arrangement and surround the optical region. Each of the light-weakening slots has a slot opening having a slot width and a slot bottom spaced apart from the slot opening by a slot depth. A width of each of the light-weakening slots gradually decreases along a direction from the slot opening to the slot bottom, and a ratio of the slot width to the slot depth is within a range from 1:0.86 to 1:11.4, such that each of the light-weakening slots is configured to weaken light irradiated thereon.
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公开(公告)号：US20240128233A1
公开(公告)日：2024-04-18
申请号：US18206132
申请日：2023-06-06
发明人： CHIA-SHUAI CHANG , WEN-FU YU , BAE-YINN HWANG , WEI-LI WANG , CHIEN-HUNG LIN
IPC分类号： H01L25/065 , H01L21/304 , H01L23/00 , H01L23/31
CPC分类号： H01L25/0655 , H01L21/3043 , H01L23/3114 , H01L23/3142 , H01L24/13 , H01L24/29 , H01L24/48 , H01L24/81 , H01L24/83 , H01L24/85
摘要： A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a fixing adhesive layer disposed on the substrate, a sensor chip adhered to the fixing adhesive layer, an annular adhering layer disposed on the sensor chip, a light-permeable sheet adhered to the annular adhering layer, and a plurality of metal wires that are electrically coupled to the substrate and the sensor chip. The size of the light-permeable sheet is smaller than that of the sensor chip.
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公开(公告)号：US20240204019A1
公开(公告)日：2024-06-20
申请号：US18460576
申请日：2023-09-03
发明人： CHIEN-HUNG LIN , BAE-YINN HWANG , WEN-FU YU , WEI-LI WANG
IPC分类号： H01L27/146 , H01L33/44
CPC分类号： H01L27/14623 , H01L33/44
摘要： An optical package structure includes a light transmittable member, a bonding structural member, and an optical element. The bonding structural member includes a first bonding layer and a second bonding layer to form a light-scattering structure. The first bonding layer is connected to a bonding surface of the light transmittable member. An inner side of the first bonding layer includes a plurality of first protruded portions. An inner side of the second bonding layer includes a plurality of second protruded portions. The second protruded portions and the first protruded portions are arranged in a staggered manner. The bonding structural member includes the first bonding layer or the light-absorption member. The light-absorption member is filled in concaved portions of the first bonding layer. The optical element is connected to the bonding structural member, and is spaced apart from the light transmittable member.
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公开(公告)号：US20240128139A1
公开(公告)日：2024-04-18
申请号：US18206153
申请日：2023-06-06
发明人： WEI-LI WANG , JYUN-HUEI JIANG , WEN-FU YU , BAE-YINN HWANG , CHIEN-HUNG LIN
IPC分类号： H01L23/31 , H01L23/00 , H01L25/065
CPC分类号： H01L23/3114 , H01L23/3121 , H01L23/3142 , H01L24/29 , H01L25/0655
摘要： A sensor package structure includes a substrate, a sensor chip disposed on the substrate along a predetermined direction for being electrically coupled to each other, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer is formed with at least one type of a buffering cavity, wave-shaped slots, and rectangular slots, which penetrate therethrough along the predetermined direction. The buffering cavity can be located in the adhesive layer, and any one type of the wave-shaped slots and the rectangular slots can be respectively recessed in an inner side and an outer side of the adhesive layer. A minimum width of the adhesive layer is greater than or equal to 50% of a predetermined width between the inner side and the outer side.
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