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公开(公告)号：US11974404B2
公开(公告)日：2024-04-30
申请号：US17527352
申请日：2021-11-16
Applicant: TOPPAN INC.
Inventor： Yuki Nitta , Takeshi Tamura , Masashi Sawadaishi , Takashi Fujita
CPC classification number: H05K3/46 , H01L23/142 , H01L23/32 , H05K1/14 , H05K3/284 , H05K3/305 , H05K3/3436 , H05K3/36 , H05K2201/10378
Abstract: There is provided a method of producing circuit boards, including a bonding step of bonding joints of an FC-BGA circuit board component with respective joints of an interposer, followed by a resin supply step of filling an underfill in a gap between the FC-BGA circuit board component and the interposer, a resin curing step of curing the underfill, and a support release step of releasing a support from the interposer, which are performed through a sequence of the support release step, the resin supply step, and the resin curing step.
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公开(公告)号：US11877394B2
公开(公告)日：2024-01-16
申请号：US17746018
申请日：2022-05-17
Applicant: TOPPAN INC.
Inventor： Susumu Maniwa , Masashi Sawadaishi
CPC classification number: H05K1/0306 , H05K1/115 , H05K3/429 , H05K3/4661 , H05K2201/1003 , H05K2201/10015
Abstract: A glass core multilayer wiring board includes a glass substrate, a through electrode, a first layer structure, and a second layer structure. A through hole has a diameter decreasing from a first surface toward a second surface. The through electrode is along a side wall of the through hole. The first layer structure is on the first surface and the second layer structure is on the second surface. The second layer structure closes an opening in the second surface defining a bottom section. The through electrode has: a first layer on part of the side wall and on part or all of the bottom section of the through hole closing the opening of the through hole, a second layer covering the first layer, the side wall of the through hole exposed, and the bottom section, and a third layer is located on the second layer.
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