公开(公告)号：US20230360936A1

公开(公告)日：2023-11-09

申请号：US18355484

申请日：2023-07-20

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Koichi KAZAMA ,  Yoshiyuki ARAI ,  Jun INAGAKI

IPC: H01L21/67 ,  B32B43/00 ,  B23K26/57 ,  B23K26/067

CPC classification number: H01L21/67144 ,  B32B43/006 ,  B23K26/57 ,  B23K26/067 ,  B32B2310/0843

Abstract: A transfer device is provided that comprises a transfer substrate holding unit, a receiving substrate holding unit, and an active energy ray irradiation unit. The transfer substrate holding unit holds a transfer substrate with an ablation layer on which at least one element is held. The receiving substrate holding unit holds a receiving substrate such that the ablation layer of the transfer substrate is opposite the receiving substrate. The active energy ray irradiation unit irradiates the ablation layer of the transfer substrate with an active energy ray to cause ablation for transferring the at least one element held by the ablation layer from the transfer substrate to the receiving substrate. The active energy ray irradiation unit irradiates the ablation layer with the active energy ray at a plurality of locations in a holding region of the ablation layer that holds one of the at least one element.

公开(公告)号：US20220203635A1

公开(公告)日：2022-06-30

申请号：US17606127

申请日：2020-05-12

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Takashi IWADE ,  Jun INAGAKI ,  Toshifumi TAKEGAMI

IPC: B29C70/68 ,  B29C70/30 ,  B21D22/20 ,  B21D47/04

Abstract: A sheet metal member forming method comprises placing a fiber bundle of a predetermined length, via a thermosetting resin, in a predetermined position on a surface of a sheet metal member, forming a coating film on at least a part of the sheet metal member after the placing of the fiber bundle, and while heating and drying the coating film, heat-curing the thermosetting resin to bond the fiber bundle to the sheet metal member.

公开(公告)号：US20220176643A1

公开(公告)日：2022-06-09

申请号：US17436760

申请日：2020-03-02

Applicant: TORAY ENGINEERING CO., LTD. ,  TOKYO INSTITUTE OF TECHNOLOGY

Inventor： Naoyuki ATSUTA ,  Takashi IWADE ,  Jun INAGAKI ,  Toshifumi TAKEGAMI ,  Kotaro TADANO

IPC: B29C65/50 ,  B29C70/38

Abstract: A tape layup apparatus whereby the tape layup performance on a surface to be laid up can be enhanced is provided, the tape layup apparatus being an ATL apparatus 10 having an ATL head 20 for laying up with pressing a tape 1 on a laid-up surface 2a, the ATL head 20 equipped with a pressing part 30 to press the tape 1 on the laid-up surface 2a and a parallel linkage 40 to operate in a manner that allows a pressing position and/or a pressing attitude of the pressing part 30 to follow a form of the laid-up surface 2a.

公开(公告)号：US20210268722A1

公开(公告)日：2021-09-02

申请号：US16967579

申请日：2019-01-24

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Takashi IWADE ,  Jun INAGAKI

IPC: B29C64/129 ,  B33Y10/00 ,  B29C64/268 ,  B29C64/209

Abstract: A three-dimensional modeling method comprises modeling a shell layer of a three-dimensional modeling object using a shell material, and modeling a core portion inside of the modeled shell layer using a core material. The modeling of the shell layer is performed by an additive manufacturing technology, and is divided into multiple steps in a lamination modeling direction of the three-dimensional modeling object. The modeling of the core portion includes filling the core material inside of the modeled shell layer subsequent to each modeling of the shell layer that has been divided into the multiple steps, and correctively curing the core material by irradiation with an active energy ray or by application of heat energy after the multiple steps of the modeling of the shell layer and the filing of the core material are all completed.

公开(公告)号：US20210129456A1

公开(公告)日：2021-05-06

申请号：US16493517

申请日：2018-03-02

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Jun INAGAKI ,  Shimpei AOKI ,  Toshifumi TAKEGAMI ,  Masato SUGAMORI ,  Kimihiko HATTORI ,  Hideo MATSUOKA

IPC: B29C70/38 ,  B29C70/10

Abstract: A fiber bundle affixing device comprises an affixing head configured to affix fiber bundles that have been cut in advance to a predetermined length, one by one to an affixing surface under heating and/or pressure. The affixing head includes a heater configured to heat the fiber bundles and/or the affixing surface, and a feeder configured to hold and/or convey only one fiber bundle that is being affixed by the affixing head during an affixing operation of affixing the fiber bundles by the affixing head.