公开(公告)号：US20230416448A1

公开(公告)日：2023-12-28

申请号：US18033176

申请日：2021-12-16

Applicant: TORAY INDUSTRIES, INC.

Inventor： Hiroya TSUCHIDA ,  Daisuke KONISHI ,  Nobuyuki TOMIOKA

IPC: C08G59/24 ,  C08G59/40 ,  C08G59/68 ,  C08G65/06 ,  C08K5/19 ,  C08K7/06 ,  C08K7/14 ,  C08K9/06 ,  C08J5/04 ,  C08J5/24

CPC classification number: C08G59/245 ,  C08G59/4028 ,  C08G59/68 ,  C08G65/06 ,  C08K5/19 ,  C08K7/06 ,  C08K2201/003 ,  C08K9/06 ,  C08J5/042 ,  C08J5/043 ,  C08J5/243 ,  C08J5/244 ,  C08K7/14

Abstract: A purpose of the present invention is to provide a thermosetting epoxy resin composition that manifests latency at a temperature at which the thermosetting resin cures and has an excellent curing rate, and molded articles obtained by thermosetting the same. A further purpose is to provide a fiber-reinforced composite material obtained by blending with reinforcing fibers, a molding material for a fiber-reinforced composite material, and a method for producing a fiber-reinforced composite material. To achieve the above, the thermosetting epoxy resin composition of the present invention is a thermosetting epoxy resin composition including the following constituent elements [a], [b], and [c], wherein the relationship between the curing time (Tc) and the induction time (Ti) satisfies 1