公开(公告)号：US12210285B2

公开(公告)日：2025-01-28

申请号：US17252934

申请日：2019-07-25

Applicant: TORAY INDUSTRIES, INC.

Inventor： Keika Hashimoto ,  Yuki Masuda ,  Yuki Takeyama

IPC: G03F7/038 ,  C08G73/10 ,  C08G73/22 ,  C08J5/18 ,  C08K5/00 ,  C08K5/23 ,  C08L61/34 ,  C08L79/08 ,  G03F7/004 ,  G03F7/022 ,  G03F7/023 ,  G03F7/039 ,  G03F7/20 ,  G03F7/26 ,  G09F9/30 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L23/14 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L27/12

Abstract: Provided is a resin composition which makes it possible to improve the resistance to a flux to be used in soldering and the resistance to reflow, and which, when used as a photosensitive resin composition, can be cured into a film capable of being imparted with such thick film processability that the film can be processed with high sensitivity even when the thickness of the film is as high as 15 μm or more. A resin composition comprising (A) a resin having a structural unit represented by general formula (1) and/or general formula (2), (B) a phenolic resin and (C) an antioxidant agent, wherein the phenolic resin (B) contains a structure represented by general formula (3).

公开(公告)号：US11640110B2

公开(公告)日：2023-05-02

申请号：US16800674

申请日：2020-02-25

Applicant: TORAY INDUSTRIES, INC.

Inventor： Keika Hashimoto ,  Kazuto Miyoshi ,  Masao Tomikawa

IPC: G03F7/022 ,  G03F7/023 ,  C08L101/02 ,  H01L21/027 ,  H01L29/786 ,  G03F7/037 ,  G03F7/004 ,  G03F7/038 ,  G03F7/40 ,  C09D179/08

Abstract: A resin composition which is configured such that if the resin composition is formed into a resin composition film that has a thickness of 3.0 μm after a heat treatment at a temperature within the range of 200-350° C., the resin composition film forms a heat-resistant resin film that has a light transmittance of 50% or more at a wavelength of 365-436 nm before the heat treatment, while having a light transmittance of 10% or less at a wavelength of 365-436 nm after the heat treatment. Provided is a resin composition having a function of absorbing ultraviolet light and visible light in a short wavelength range, which is suitable for the formation of a planarization film, an insulating layer and a partition wall that are used for organic light emitting devices or display devices.

公开(公告)号：US11347146B2

公开(公告)日：2022-05-31

申请号：US16329441

申请日：2017-08-30

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yuki Masuda ,  Keika Hashimoto ,  Ryoji Okuda

IPC: G03F7/039 ,  C08G73/14 ,  C09D179/08 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  H01L51/00 ,  H01L23/00 ,  H01L27/12 ,  H01L27/32 ,  H01L51/56 ,  G03F7/022 ,  C08J5/18 ,  G03F7/023 ,  C08G73/06 ,  C08G73/10 ,  C08G69/26

Abstract: The present invention is a resin composition including (a) a resin, (b) an antioxidizing agent, and (d) a crosslinking agent, wherein the resin composition is characterized by the following: the resin (a) is formed of one or more kinds of resins selected from among polyimide precursor, polyamide, polyimide, polybenzoxazole, and copolymers thereof; and the crosslinking agent (d) includes a phenolic hydroxyl group in one molecule, and also includes a substituent group having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group. Provided is the resin composition by which obtained is a pattern-cured film that enables fine patterns to be obtained, that exhibits excellent in-plane pattern uniformity while being curable at a low temperature of 250° C. or less, and that retains high extensibility and high adhesion with metal wires even after a reliability evaluation which is an actual-use accelerated test.