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公开(公告)号：US11279802B2
公开(公告)日：2022-03-22
申请号：US16969315
申请日：2019-03-15
发明人： Yutaro Koyama , Yuki Masuda , Masao Tomikawa
摘要： The present invention provides an alkali-soluble resin with which a cured film having high extensibility, reduced stress, high adhesion to a metal, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin, and the present invention is an alkali-soluble resin (A) including a structure represented by a general formula (1) wherein X1 represents a divalent organic group having 2 to 100 carbon atoms, Y1 and Y2 each represent a divalent to hexavalent organic group having 2 to 100 carbon atoms, X2 represents a tetravalent organic group having 2 to 100 carbon atoms, p and q each represent an integer in a range of 0 to 4, and n1 and n2 each represent an integer in a range of 5 to 100,000, wherein (I) and (II) described below are satisfied: (I) an organic group having an aliphatic chain having 8 to 30 carbon atoms is contained as X1 of the general formula (1) at a content of 30 to 70 mol % based on 100 mol % of a total of X1 and X2, and (II) an organic group having a diphenyl ether structure is contained as Y1 of the general formula (1) at a content of 1 to 30 mol % based on 100 mol % of a total of Y1 and Y2.
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公开(公告)号：US10908500B2
公开(公告)日：2021-02-02
申请号：US16063893
申请日：2017-01-10
发明人： Yu Shoji , Yuki Masuda , Kimio Isobe , Ryoji Okuda
摘要： Provided is a cured film having high chemical resistance, high elongation, and high adhesion to metal copper. A cured film formed by curing a photosensitive resin composition containing a polybenzoxazole precursor, in which a rate at which the polybenzoxazole precursor is cyclized into polybenzoxazole is not less than 10% and not more than 60%.
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3.发明授权Positive-type photosensitive resin composition, method for producing semiconductor device including cured film using the same 有权正型感光性树脂组合物，使用该固化膜的半导体装置的制造方法公开(公告)号：US09454078B2
公开(公告)日：2016-09-27
申请号：US14422664
申请日：2013-09-11
发明人： Hiroyuki Onishi , Yuki Masuda , Masao Tomikawa
CPC分类号： G03F7/0233 , C08G73/1042 , C08G73/105 , C08G73/1075 , C08G73/1082 , C08G73/14 , C09D179/08 , G03F7/0226 , G03F7/40 , C08K5/22 , C08K5/357
摘要： The present invention provides a positive-type photosensitive resin composition capable of obtaining a cured film which exhibits low warpage, and is also excellent in high sensitivity and high resolution during firing at a lower temperature of 250° C. or lower. Disclosed is a positive-type photosensitive resin composition including (a) a polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2), and (b) a quinonediazide compound, wherein the polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2) has an imidation ratio of 85% or more, and also a ratio of the structural unit represented by the general formula (1) to the structural unit represented by the general formula (2) is within a range of 30:70 to 90:10, in which X1 in the general formula (1) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y1 represents an aromatic diamine residue including 1 to 4 aromatic rings, and in which X2 in the general formula (2) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y2 represents a diamine residue including at least two or more alkylene glycol units in the main chain.
摘要翻译： 本发明提供能够获得低翘曲的固化膜的正型感光性树脂组合物，在低温250℃以下的烧成时，高灵敏度，高分辨率也优异。 公开了一种正型感光性树脂组合物，其包含（a）包含由通式（1）表示的结构单元和由通式（2）表示的结构单元的聚酰亚胺树脂和（b）醌二叠氮化合物，其中 包含由通式（1）表示的结构单元和由通式（2）表示的结构单元的聚酰亚胺树脂的酰亚胺化率为85％以上，并且由通式 （1）表示的四羧酸残基在通式（2）表示的结构单元的范围为30:70〜90:10的范围内，通式（1）中的X1表示包含1〜4个芳环的四羧酸残基， Y1表示包含1〜4个芳香环的芳香族二胺残基，通式（2）中的X2表示包含1〜4个芳香环的四羧酸残基，Y2表示包含至少两个 或更多的主链中的亚烷基二醇单元。
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公开(公告)号：US11347146B2
公开(公告)日：2022-05-31
申请号：US16329441
申请日：2017-08-30
发明人： Yuki Masuda , Keika Hashimoto , Ryoji Okuda
IPC分类号： G03F7/039 , C08G73/14 , C09D179/08 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40 , H01L51/00 , H01L23/00 , H01L27/12 , H01L27/32 , H01L51/56 , G03F7/022 , C08J5/18 , G03F7/023 , C08G73/06 , C08G73/10 , C08G69/26
摘要： The present invention is a resin composition including (a) a resin, (b) an antioxidizing agent, and (d) a crosslinking agent, wherein the resin composition is characterized by the following: the resin (a) is formed of one or more kinds of resins selected from among polyimide precursor, polyamide, polyimide, polybenzoxazole, and copolymers thereof; and the crosslinking agent (d) includes a phenolic hydroxyl group in one molecule, and also includes a substituent group having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group. Provided is the resin composition by which obtained is a pattern-cured film that enables fine patterns to be obtained, that exhibits excellent in-plane pattern uniformity while being curable at a low temperature of 250° C. or less, and that retains high extensibility and high adhesion with metal wires even after a reliability evaluation which is an actual-use accelerated test.
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5.发明申请POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE INCLUDING CURED FILM USING THE SAME 有权正型型感光性树脂组合物，使用其形成包括固化膜的半导体器件的方法公开(公告)号：US20150212412A1
公开(公告)日：2015-07-30
申请号：US14422664
申请日：2013-09-11
发明人： Hiroyuki Onishi , Yuki Masuda , Masao Tomikawa
CPC分类号： G03F7/0233 , C08G73/1042 , C08G73/105 , C08G73/1075 , C08G73/1082 , C08G73/14 , C09D179/08 , G03F7/0226 , G03F7/40 , C08K5/22 , C08K5/357
摘要： The present invention provides a positive-type photosensitive resin composition capable of obtaining a cured film which exhibits low warpage, and is also excellent in high sensitivity and high resolution during firing at a lower temperature of 250° C. or lower. Disclosed is a positive-type photosensitive resin composition including (a) a polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2), and (b) a quinonediazide compound, wherein the polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2) has an imidation ratio of 85% or more, and also a ratio of the structural unit represented by the general formula (1) to the structural unit represented by the general formula (2) is within a range of 30:70 to 90:10, in which X1 in the general formula (1) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y1 represents an aromatic diamine residue including 1 to 4 aromatic rings, and in which X2 in the general formula (2) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y2 represents a diamine residue including at least two or more alkylene glycol units in the main chain.
摘要翻译： 本发明提供能够获得低翘曲的固化膜的正型感光性树脂组合物，在低温250℃以下的烧成时，高灵敏度，高分辨率也优异。 公开了一种正型感光性树脂组合物，其包含（a）包含由通式（1）表示的结构单元和由通式（2）表示的结构单元的聚酰亚胺树脂和（b）醌二叠氮化合物，其中 包含由通式（1）表示的结构单元和由通式（2）表示的结构单元的聚酰亚胺树脂的酰亚胺化率为85％以上，并且由通式 （1）表示的四羧酸残基在通式（2）表示的结构单元的范围为30:70〜90:10的范围内，通式（1）中的X1表示包含1〜4个芳环的四羧酸残基， Y1表示包含1〜4个芳香环的芳香族二胺残基，通式（2）中的X2表示包含1〜4个芳香环的四羧酸残基，Y2表示包含至少两个 或更多的主链中的亚烷基二醇单元。
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公开(公告)号：US10584205B2
公开(公告)日：2020-03-10
申请号：US15557623
申请日：2016-03-18
发明人： Yu Shoji , Yuki Masuda , Yutaro Koyama , Ryoji Okuda
摘要： A highly sensitive photosensitive resin composition that can afford a cured film having a low stressfulness, a high degree of elongation, and an excellent adhesion to a metal material, copper among others, is provided. A photosensitive resin composition including an alkali-soluble resin having an organic group derived from an aliphatic diamine.
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公开(公告)号：US11802181B2
公开(公告)日：2023-10-31
申请号：US16343957
申请日：2017-08-28
发明人： Yuki Masuda , Ryoji Okuda
IPC分类号： C08G69/26 , C08G73/08 , G03F7/075 , G03F7/20 , H01L23/29 , H01L23/31 , G03F7/023 , H05B33/02 , H01L29/786 , C07C237/04 , H01L23/12 , H05B33/12 , C07C235/24 , H05B33/22 , H10K50/00 , H10K59/00 , C08G73/10
CPC分类号： C08G69/26 , C07C235/24 , C07C237/04 , C08G73/08 , G03F7/0233 , G03F7/0751 , G03F7/2022 , H01L23/12 , H01L23/29 , H01L23/31 , H01L29/786 , H05B33/02 , H05B33/12 , H05B33/22 , H10K50/00 , H10K59/00 , C08G73/10
摘要： The present invention relates to a novel di-amine compound, a heat-resistant resin using the di-amine compound, and a resin composition using the heat-resistant resin, and a cured film excellent in chemical resistance and film properties even by a thermal treatment at a low temperature of 200° C. or less can be obtained. The novel di-amine compound is represented by the general formula (1). The heat-resistant resin composition of the present invention or the resin composition can be suitably used in a surface protective film and an interlayer dielectric film of a semiconductor device, a dielectric layer or a planarizing layer of an organic electroluminescent element (organic EL), or the like.
(In the general formula (1), R1 and R2 each are a divalent aliphatic group, R3 and R4 each are a divalent aliphatic group, aliphatic ring group, aromatic group, a divalent organic group bonded to an aromatic group by —O—, —CO—, —SO2—, —CH2—, —C(CH3)2— or —C(CF3)2— (wherein F is fluorine), a divalent organic group in which two or more aromatic groups are bonded by a single bond, or a divalent organic group in which two or more aromatic groups are bonded by —O—, —CO—, —SO2—, —CH2—, —C(CH3)2— or —C(CF3)2— (wherein F is fluorine), R5 and R6 each are an organic group having any of a hydrogen atom, a halogen atom, a hydroxyl group, a nitro group, a cyano group, an aliphatic group, an aromatic group, an acetyl group, a carboxyl group, an ester group, an amide group, an imide group, and a urea group, A is a divalent aliphatic group, aliphatic ring group, aromatic group, a divalent organic group in which two or more aromatic groups are bonded by a single bond, or a divalent organic group in which two or more aromatic groups are bonded by —O—, —S—, —CO—, —SO2—, —CH2—, —C(CH3)2— or —C(CF3)2— (wherein F is fluorine), p and q each are an integer number in the range of 0 to 3).-
8.发明授权公开(公告)号：US11333976B2
公开(公告)日：2022-05-17
申请号：US15545912
申请日：2016-01-25
发明人： Tomoyuki Yuba , Yuki Masuda , Jiake Jin , Ping Li
IPC分类号： G03F7/023 , G03F7/40 , C08G69/32 , C07C209/74 , C07C231/02 , C07D209/48 , C07D263/62 , C07C231/12 , H01L21/027 , C07C41/22 , H01L23/31 , H05K3/34 , C07C213/00 , C07C211/56 , C08G73/10 , G03F7/037 , C09D179/08 , C07C67/307 , C07C269/06 , C09D179/04 , G03F7/039 , C07C25/18 , C07C215/80 , C07D263/56 , C08G73/22 , G03F7/16 , G03F7/20 , G03F7/32 , H01L23/29 , H01L27/12 , H05K1/02 , H01L27/32
摘要： A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2):
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公开(公告)号：US11174350B2
公开(公告)日：2021-11-16
申请号：US15765596
申请日：2016-09-21
发明人： Yuki Masuda , Yu Shoji , Kimio Isobe , Ryoji Okuda
摘要： A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.
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公开(公告)号：US10990008B2
公开(公告)日：2021-04-27
申请号：US16301280
申请日：2017-05-22
发明人： Yuki Masuda , Ryoji Okuda
IPC分类号： G03F7/023 , C08G73/10 , C08L63/00 , C08L63/04 , C08L79/08 , C08L61/14 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40 , H01L23/532
摘要： The present invention provides a resin composition which can result in a cured film which has chemical resistance, low stress property, and high elongation property even by a heat treatment at a low temperature.
The resin composition comprising an alkali-soluble resin (a) which contains a phenol skeleton having a crosslinking group and a phenol skeleton not having a crosslinking group and which has a weight average molecular weight in the range of 1,000 to 50,000, wherein the content ratio of the phenol skeleton having a crosslinking group to the total 100% by mole of structural units of the phenol skeleton having a crosslinking group and the phenol skeleton not having a crosslinking group is in the range of 5 to 90% by mole.
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