公开(公告)号：US09690197B2

公开(公告)日：2017-06-27

申请号：US14907137

申请日：2014-07-18

Applicant: TORAY INDUSTRIES, INC.

Inventor： Hitoshi Araki ,  Mitsuhito Suwa ,  Hiroko Mitsui ,  Toru Okazawa

IPC: G03F7/075 ,  G03F7/027 ,  G03F7/029 ,  G06F3/044 ,  G03F7/00 ,  G03F7/032 ,  G03F7/033 ,  G03F7/105 ,  G06F3/041

CPC classification number: G03F7/0757 ,  G03F7/0007 ,  G03F7/0035 ,  G03F7/027 ,  G03F7/029 ,  G03F7/032 ,  G03F7/033 ,  G03F7/0755 ,  G03F7/105 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04111 ,  G06F2203/04112

Abstract: The present invention provides a negative-type photosensitive white composition for a touch panel, the composition including: (A) a white pigment; (B) an alkali-soluble resin; (C) a polyfunctional monomer; and (D) a photopolymerization initiator.

公开(公告)号：US20210139700A1

公开(公告)日：2021-05-13

申请号：US16074187

申请日：2017-02-03

Applicant: Toray Industries, Inc.

Inventor： Shinji Arimoto ,  Takenori Fujiwara ,  Toru Okazawa

IPC: C08L79/08 ,  C08G77/18 ,  C08G77/20 ,  C08G77/26 ,  C08L63/00 ,  C08K5/1539 ,  C08K3/36 ,  C09J11/06

Abstract: A resin composition contains at least (a) a polyimide resin having a specific structure and (b) a crosslinker including a fluorene group. The resin composition is capable of bonding an electronic circuit formation substrate or a semiconductor circuit formation substrate and a support substrate together. The resin composition has excellent heat resistance during bonding of an electronic circuit formation substrate or semiconductor circuit formation substrate having a thickness of 1 μm or more and 100 μm or less. The resin composition has steady adhesive force through the process of manufacturing an electronic component, a semiconductor device or the like, and can be peeled off under mild conditions at room temperature after the manufacturing process. An adhesive, a resin layer, a laminated film, and a processed wafer containing the resin composition, as well as a method for manufacturing an electronic component or a semiconductor device using these are also disclosed.

公开(公告)号：US20240002607A1

公开(公告)日：2024-01-04

申请号：US18038040

申请日：2021-12-20

Applicant: Toray Industries, Inc.

Inventor： Jun Oura ,  Yohei Konoshima ,  Mitsuhito Suwa ,  Toru Okazawa

IPC: C08G79/10 ,  C09D185/00 ,  C04B35/48 ,  C04B35/64 ,  D01F9/10 ,  D01F6/76

CPC classification number: C08G79/10 ,  C09D185/00 ,  C04B35/48 ,  C04B35/64 ,  D01F9/10 ,  D01F6/76 ,  C04B2235/3248 ,  D10B2101/08

Abstract: A polymetalloxane including structural units represented by formulae (1-1) and (1-2), and having a weight-average molecular weight of 30,000 or more and 2,000,000 or less;






wherein, M1 and M2 independently represent different metal atoms; L1 and L2 are each independently a group selected from the group consisting of an allyloxy group, an aryloxy group, and a trialkylsiloxy group; L1 and L2 may be the same or different, and at least one thereof is an allyloxy group or an aryloxy group; R1 and R2 are each independently a hydrogen atom, a C1-12 alkyl group, or a group having a metalloxane bond; m is an integer that represents the valence of the metal atom M1, and a is an integer of 1 to (m−2); and n is an integer that represents the valence of the metal atom M2, and b is an integer of 1 to (n−2).

公开(公告)号：US11186757B2

公开(公告)日：2021-11-30

申请号：US16074187

申请日：2017-02-03

Applicant: Toray Industries, Inc.

Inventor： Shinji Arimoto ,  Takenori Fujiwara ,  Toru Okazawa

IPC: C09J179/08 ,  C08G77/18 ,  C08G77/20 ,  C08G77/26 ,  C08K3/36 ,  C08K5/1539 ,  C08L63/00 ,  C08L79/08 ,  C09J11/06 ,  C08G73/10 ,  C09J183/14 ,  C08G77/455 ,  H01L21/683

Abstract: A resin composition contains at least (a) a polyimide resin having a specific structure and (b) a crosslinker including a fluorene group. The resin composition is capable of bonding an electronic circuit formation substrate or a semiconductor circuit formation substrate and a support substrate together. The resin composition has excellent heat resistance during bonding of an electronic circuit formation substrate or semiconductor circuit formation substrate having a thickness of 1 μm or more and 100 μm or less. The resin composition has steady adhesive force through the process of manufacturing an electronic component, a semiconductor device or the like, and can be peeled off under mild conditions at room temperature after the manufacturing process. An adhesive, a resin layer, a laminated film, and a processed wafer containing the resin composition, as well as a method for manufacturing an electronic component or a semiconductor device using these are also disclosed.

公开(公告)号：US20150125680A1

公开(公告)日：2015-05-07

申请号：US14400968

申请日：2013-05-08

Applicant: TORAY INDUSTRIES, INC.

Inventor： Hitoshi Araki ,  Mitsuhito Suwa ,  Toru Okazawa

IPC: G06F3/041 ,  G03F7/30

CPC classification number: G06F3/041 ,  C03C17/007 ,  C03C17/008 ,  C03C17/42 ,  C03C2217/445 ,  C03C2217/475 ,  C03C2217/948 ,  G03F7/30 ,  G06F2203/04103 ,  Y10T428/24975

Abstract: The present invention provides a substrate comprising a region where thin films are laminated on a transparent ground substrate, which thin films are, in the order mentioned from the upper surface of the substrate, an ITO thin film (I); an organic thin film (II) having a film thickness of from 0.01 μm to 0.4 μm and a refractive index of from 1.58 to 1.85; and an organic thin film (III) having a film thickness of from 0.7 μm to 20 μm and a refractive index of from 1.46 to 1.56.

Abstract translation: 本发明提供一种基板，其包括薄膜层叠在透明基板上的区域，该薄膜以从基板的上表面提到的顺序为ITO薄膜（I）; 膜厚度为0.01μm〜0.4μm，折射率为1.58〜1.85的有机薄膜（II） 以及膜厚为0.7μm〜20μm，折射率为1.46〜1.56的有机薄膜（III）。

公开(公告)号：US09651865B2

公开(公告)日：2017-05-16

申请号：US14758101

申请日：2014-02-07

Applicant: TORAY INDUSTRIES, INC.

Inventor： Hitoshi Araki ,  Mitsuhito Suwa ,  Toru Okazawa ,  Yoshihiko Inoue ,  Akihiro Ishikawa ,  Akinori Saeki

IPC: G03F7/075 ,  G03F7/027 ,  G03F7/029 ,  G03F7/038 ,  G03F7/105 ,  G03F7/40 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G06F3/041

CPC classification number: G03F7/0757 ,  G03F7/027 ,  G03F7/029 ,  G03F7/038 ,  G03F7/0755 ,  G03F7/105 ,  G03F7/168 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04107

Abstract: The purpose of the present invention is to provide a negative-type photosensitive coloring composition ideal for forming a white, light-blocking pattern and which not only has excellent chemical resistance, but also has extremely excellent heat resistance and does not yellow or crack even when undergoing high-temperature processing. This negative-type photosensitive coloring composition contains (A) a white pigment, (B) a polysiloxane obtained by co-hydrolyzate condensation of an alkoxysilane compound containing a compound of a specific structure, (C) polyfunctional acrylic monomers, (D) a photoradical polymerization initiator and (E) an organic solvent.

公开(公告)号：US20160161847A1

公开(公告)日：2016-06-09

申请号：US14907137

申请日：2014-07-18

Applicant: TORAY INDUSTRIES, INC.

Inventor： Hitoshi Araki ,  Mitsuhito Suwa ,  Hiroko Mitsui ,  Toru Okazawa

IPC: G03F7/075 ,  G06F3/041 ,  G03F7/00

CPC classification number: G03F7/0757 ,  G03F7/0007 ,  G03F7/0035 ,  G03F7/027 ,  G03F7/029 ,  G03F7/032 ,  G03F7/033 ,  G03F7/0755 ,  G03F7/105 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04111 ,  G06F2203/04112

Abstract: The present invention provides a negative-type photosensitive white composition for a touch panel, the composition including: (A) a white pigment; (B) an alkali-soluble resin; (C) a polyfunctional monomer; and (D) a photopolymerization initiator.

Abstract translation: 本发明提供一种用于触摸面板的负型感光白组合物，该组合物包括：（A）白色颜料; （B）碱溶性树脂; （C）多官能单体; 和（D）光聚合引发剂。